Steneg

Our client is a technology-oriented company developing advanced quantum computing technologies and next-generation semiconductor platforms that enable breakthrough computational capabilities. The organization combines scientific research with advanced engineering to design, develop and industrialize highly sophisticated quantum hardware, integrating cutting-edge microelectronics, photonics and precision engineering into scalable technology solutions.

Its multidisciplinary teams work collaboratively across physics, engineering, manufacturing and research to transform pioneering concepts into robust, production-ready systems. The company offers an innovative, technically demanding environment where collaboration, technical excellence and continuous innovation drive the development of future quantum computing technologies.

Mission

The Head of Packaging Engineering will provide technical leadership for the architecture, development and implementation of advanced semiconductor packaging solutions supporting the next generation of ion trap technologies. Working closely with physicists, engineers, technicians and external technology partners, the role will define the long-term packaging roadmap while balancing strategic leadership, hands-on technical contribution and supplier collaboration to deliver highly integrated mechanical, electrical, thermal and photonic packaging solutions.

Responsibilities

Packaging Architecture and Technology Strategy

• Define, develop and drive the advanced packaging architecture for next-generation ion trap devices featuring complex optical, electrical and mechanical interfaces.
• Establish long-term packaging technology roadmaps aligned with product development and system performance objectives.
• Evaluate emerging packaging technologies and integration approaches to support future platform scalability.

Technical Leadership and Product Development

• Lead cross-functional engineering teams in developing advanced packaging strategies for large-format ion trap devices with high-density interconnect requirements.
• Define and oversee technical development activities to validate mechanical, thermal, electrical and optical packaging performance.
• Provide technical leadership throughout all stages of ion trap development to ensure packaging compatibility, manufacturability and long-term reliability.

Supplier and Partnership Management

• Collaborate with external vendors to develop, implement and validate advanced packaging processes and manufacturing solutions.
• Build strategic partnerships with key suppliers and technology collaborators to accelerate innovation and capability development.
• Champion co-development initiatives that strengthen the organization's advanced packaging ecosystem.

Engineering Excellence and Cross-functional Collaboration

• Mentor and provide technical guidance to packaging engineers and multidisciplinary development teams.
• Ensure packaging solutions satisfy system-level performance, quality and manufacturing requirements.
• Promote engineering best practices, technical innovation and continuous improvement across packaging development activities.

Required Qualifications

• Bachelor's degree in Engineering, Physics, Materials Science or a related technical discipline.
• Minimum of 10 years of experience in advanced semiconductor packaging development, microelectronics packaging or related high-technology environments.
• Demonstrated experience leading complex technical projects and multidisciplinary engineering initiatives.
• Strong expertise in semiconductor packaging technologies involving mechanical, thermal, electrical and photonic interfaces.
• Experience working with external manufacturing partners and technology suppliers.
• Excellent communication, stakeholder management and technical leadership skills.
• Ability to work effectively in multidisciplinary and international engineering environments.

Preferred Experience

• Master's degree or PhD in Physics, Electrical Engineering, Materials Science or a related engineering discipline.
• Experience with advanced large-area multi-chip semiconductor packaging technologies.
• Expertise in photonic packaging, including fiber-to-chip and optical chip-to-chip coupling.
• Experience with heterogeneous integration and advanced 2.5D/3D packaging technologies.
• Knowledge of high-density I/O packaging and interconnect technologies.
• Demonstrated track record of technical innovation, intellectual property development and technology leadership.
• Experience working within highly collaborative cross-functional engineering organizations.

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