Phoenix Semiconductor

Help Bring Obsolete Semiconductors Back to Life
At Phoenix Semiconductor Corporation (PSC), we're solving one of the industry's most challenging problems—replacing obsolete integrated circuits.
Our products are drop-in replacements that enable aerospace, defense, industrial, medical, and commercial systems to continue operating for decades. Every device we release must prove it performs like—or better than—the original.
About the Role
We are seeking an experienced Test Engineer to design, develop, and deploy test programs for our Multi-Chip Module (MCM) and System-in-Package (SiP) products. We also need someone to architect and setup a test environment.
The ideal candidate can take a component datasheet and independently translate its electrical, functional, and timing requirements into a working test program.
You must be able to obtain a US security clearance.
What You'll Own
As our senior test engineer, you'll define how every PSC product is validated before it reaches our customers.
You'll work closely with design engineering, quality, manufacturing, and supply chain to develop qualification strategies, analyze performance data, and ensure every replacement device meets electrical, thermal, mechanical, and reliability requirements.
This is a highly visible role where you'll help establish the testing processes and standards that support the future growth of the company.
Key Responsibilities

• Datasheet-to-Test-Program Development: Analyze semiconductor part datasheets (digital, analog, mixed-signal, RF, or power devices) and translate electrical specifications, timing diagrams, and functional requirements into comprehensive test plans and executable test programs.
• Test System Architecture: Help design, build, and maintain an in-house PXI type (National Instruments or equivalent) modular bench test system — selecting chassis, modules (DMM, scope, DIO, power supplies, switching), and instrumentation to cover the electrical test needs of our product lines.
• Test Program Design: Develop, debug, and validate test programs/software (e.g., LabVIEW, TestStand, Python with instrument drivers) for functional, parametric, and characterization testing at the board/module level.
• Boundary Scan & JTAG Test: Develop and execute boundary scan (JTAG/IEEE 1149.1) test strategies for interconnect verification, programming, and structural test of assembled boards and modules.
• MCM/SiP Test Strategy: Design test methodologies appropriate for multi-component modules, including interconnect/bond verification, thermal considerations, and system-level functional test of integrated packages. Contribute to future KGD test strategy discussions.
• Test Fixture & Interface Development: Define and collaborate on test fixtures, interface boards, and cabling/connector solutions needed to interface the test system with the unit under test.
• Correlation & Characterization: Perform bench-to-bench and unit-to-unit correlation, guard banding, and basic statistical analysis to ensure test coverage and repeatability.
• Cross-Functional Collaboration: Partner with design engineering, package engineering, product engineering, and quality teams to resolve test escapes, board-level failures, and design-for-test (DFT) concerns.
• Documentation: Create and maintain test specifications, test flow documentation, and test result/data logs.
• Production Support: Support new product introduction (NPI), test program qualification, and ongoing test process improvement.
• Debug & Failure Analysis: Investigate test failures, working with design and failure analysis (FA) resources to root-cause issues at the component, interconnect, or module level.

Required Qualifications

• US Citizen, must be able to obtain a US security clearance.
• Bachelor's degree in Electrical Engineering, Computer Engineering, or related field (or equivalent practical experience).
• 7+ years of hands-on semiconductor, board-level or module-level test engineering experience.
• Demonstrated ability to read and interpret semiconductor datasheets and convert specifications into test plans and test programs without heavy hand-holding.
• Hands-on experience with boundary scan / JTAG (IEEE 1149.1) test development and tools (e.g., Corelis, ASSET InterTech, JTAG Technologies, XJTAG, or similar).
• Experience building or programming test systems on a modular instrumentation platform such as PXI/PXIe (National Instruments or equivalent), VXI, or LXI-based bench setups.
• Proficiency with LabVIEW, TestStand, and/or Python (with instrument drivers such as VISA/SCPI) for test automation.
• Solid understanding of analog, digital, and/or mixed-signal test techniques (DC parametric, functional, AC timing, and/or RF as applicable to your product mix).
• Comfort working with general-purpose lab instrumentation (DMMs, oscilloscopes, power supplies, function generators, switch matrices) and designing test fixtures/interfaces around them.
• Strong problem-solving skills and comfort working independently to build test capability from the ground up in a fast-paced NPI environment.
• Familiarity with JEDEC, MIL-STD-883, AEC-Q100/Q101, or similar standards

Preferred Qualifications

• Experience standing up a test system from scratch — selecting PXI/PXIe chassis and modules, building a mixed instrumentation rack, and developing the software architecture to drive it.
• Familiarity with known-good-die (KGD) methodologies and multi-die test strategies — a plus for future roadmap needs, not required today.
• Experience with semiconductor package-level JESD47 “Qualification Testing” thermal, mechanical, or reliability tests (e.g., burn-in, temp cycling, THB, ESD, etc…).
• Familiarity with die-to-die or component interconnect technologies (wire bond, flip chip, SMT) and how they affect test approach.
• Familiarity with PCB manufacturing process and test (Flying probe, AOI, X-ray, etc..).
• Experience with design-for-test (DFT) collaboration during early product development, including boundary scan chain design input.
• Experience with version control, test data management, and basic database/reporting tools for test result tracking.
• Six Sigma, quality systems, or reliability engineering exposure.

• Failure analysis experience (X-RAY, CSAM, cross-sectioning, curve tracing, etc…)
• Knowledge of ATE platforms (Teradyne, Advantest, or equivalent).

You'll Thrive Here If You

• Enjoy building processes where none exist
• Like solving complex engineering challenges
• Can balance technical depth with practical execution
• Communicate clearly with engineers and executives alike
• Want your work to have immediate impact on company success

Why Phoenix Semiconductor?
You'll join a growing semiconductor startup where your work directly influences the products we ship—not one small piece of a much larger organization.
You'll have the opportunity to:

• Build testing methodologies that become company standards
• Work across the entire product lifecycle
• Influence engineering decisions early in development
• Collaborate with experienced semiconductor leaders
• Help solve component obsolescence for industries where reliability matters most

Location
This position is based in Austin, Texas and requires regular work in our engineering lab. Occasional domestic travel may be required to support customers, suppliers, and qualification activities.