IC Packaging Design Engineer LOC: Chandler, AZ or Hillsboro, OR (ONSITE) Longterm Contract - 1 Year + No openings : 4 Skills Required Bachelor's or Master's degree in Electrical /Electronics ...
Hyreu
2 jobs near Columbus, OH
IC Packaging Design Engineer LOC: Chandler, AZ or Hillsboro, OR (ONSITE) Longterm Contract - 1 Year + No openings : 4 Skills Required Bachelor's or Master's degree in Electrical /Electronics ...
Location: Austin TX & SCV CA JD Atleast , 7+ years of Teamcenter Administration experience Strong experience with DEV → QA → PROD server management Hands-on experience with Teamcenter upgrades ...
Location: Austin TX & SCV CA JD Atleast , 7+ years of Teamcenter Administration experience Strong experience with DEV → QA → PROD server management Hands-on experience with Teamcenter upgrades ...
$138K/yr
Other
Posted 3 days ago
Job description
IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Longterm Contract – 1 Year +
No openings : 4
Skills Required
Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
- Physical Design & Layout
- Substrate design and layout
- SI/PI aware design implementation
- Design for performance, manufacturability, yield, and reliability
- Design rule compliance
About Hyreu
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