JR103798 Staff / Principal Wafer Bond Process Development Engineer Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating ...
JR103798 Staff / Principal Wafer Bond Process Development Engineer Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating ...
Process Development Engineer
$73K - $110K/yr
... the wafer fabrication facility. The position focuses on profile control, uniformity, yield ... Deposition and Etch Process Development & Ownership (35%): * Develop, qualify, and maintain PECVD ...
Process Development Engineer
$73K - $110K/yr
... the wafer fabrication facility. The position focuses on profile control, uniformity, yield ... Deposition and Etch Process Development & Ownership (35%): * Develop, qualify, and maintain PECVD ...
Process Development Engineer
San Jose, CA · On-site
As a Process Development Engineer , you will play a customer-facing, hands-on role: running demos ... Wafer processing experience in a fab, equipment manufacturer, or applications lab environment and ...
Process Development Engineer
San Jose, CA · On-site
As a Process Development Engineer , you will play a customer-facing, hands-on role: running demos ... Wafer processing experience in a fab, equipment manufacturer, or applications lab environment and ...
Process Development Engineer
Palo Alto, CA · On-site
$70K - $85K/yr
... wafer manufacturing process development in semiconductor / microelectronics industry and clean room operations • Working knowledge of technologies for nucleic acid synthesis, sequence analysis or ...
Process Development Engineer
Palo Alto, CA · On-site
$70K - $85K/yr
... wafer manufacturing process development in semiconductor / microelectronics industry and clean room operations • Working knowledge of technologies for nucleic acid synthesis, sequence analysis or ...
Manufacturing Process Development Engineer-Wafer Cleaving Operation
Greensboro, NC · On-site
$89K - $166K/yr
Process development for wafer cleaving operation * Own and sustain processing of thinned wafers ... Provide real-time engineering support for thinning operations in high-volume manufacturing * Lead ...
Manufacturing Process Development Engineer-Wafer Cleaving Operation
Greensboro, NC · On-site
$89K - $166K/yr
Process development for wafer cleaving operation * Own and sustain processing of thinned wafers ... Provide real-time engineering support for thinning operations in high-volume manufacturing * Lead ...
Principal Wafer Bonding Integration Engineer
Santa Clara, CA · On-site
$160K - $220K/yr
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Principal Wafer Bonding Integration Engineer
Santa Clara, CA · On-site
$160K - $220K/yr
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Process Development Engineer
$110K - $130K/yr
Specify, procure and bring up new wafer fab capital equipment. * Hands-on process implementation ... Development Engineer is $110,000 to $130,000 per annum. The range reflects the minimum and maximum ...
Process Development Engineer
$110K - $130K/yr
Specify, procure and bring up new wafer fab capital equipment. * Hands-on process implementation ... Development Engineer is $110,000 to $130,000 per annum. The range reflects the minimum and maximum ...
Process Development Engineer
$110K - $130K/yr
Specify, procure and bring up new wafer fab capital equipment. * Hands-on process implementation ... Development Engineer is $110,000 to $130,000 per annum. The range reflects the minimum and maximum ...
Process Development Engineer
$110K - $130K/yr
Specify, procure and bring up new wafer fab capital equipment. * Hands-on process implementation ... Development Engineer is $110,000 to $130,000 per annum. The range reflects the minimum and maximum ...
Manufacturing Process Development Engineer-Wafer Cleaving Operation
Greensboro, NC · On-site
$89K - $166K/yr
Process development for wafer cleaving operation * Own and sustain processing of thinned wafers ... Provide realtime engineering support for thinning operations in highvolume manufacturing * Lead ...
Manufacturing Process Development Engineer-Wafer Cleaving Operation
Greensboro, NC · On-site
$89K - $166K/yr
Process development for wafer cleaving operation * Own and sustain processing of thinned wafers ... Provide realtime engineering support for thinning operations in highvolume manufacturing * Lead ...
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Managing process development and improvement projects, including novel processing techniques, yield ... Engineering in Optics, Electro-Optics or Microelectronics environment or Wafer Processing.
Managing process development and improvement projects, including novel processing techniques, yield ... Engineering in Optics, Electro-Optics or Microelectronics environment or Wafer Processing.
As a Epi Process Development Engineer in TI's organization in Sherman, you will own the development ... The Epi processes you develop will run on every wafer at SMFAB. Responsibilities include: * Drive ...
As a Epi Process Development Engineer in TI's organization in Sherman, you will own the development ... The Epi processes you develop will run on every wafer at SMFAB. Responsibilities include: * Drive ...
Principal Wafer Bonding Integration Engineer
Santa Clara, CA · Hybrid
$160K - $220K/yr
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Quick apply
Principal Wafer Bonding Integration Engineer
Santa Clara, CA · Hybrid
$160K - $220K/yr
Partner with design engineering, process development teams, and external foundries to develop ... Wafer Bonding Process Integration * Develop and optimize advanced wafer bonding processes including:
Wet Process Development Engineer
Lehi, UT · On-site
As a Wet Process Development Engineer in TI's ATD organization in Lehi, you will own the ... The wet process modules you develop will run on every wafer at LFAB. Responsibilities include:
Wet Process Development Engineer
Lehi, UT · On-site
As a Wet Process Development Engineer in TI's ATD organization in Lehi, you will own the ... The wet process modules you develop will run on every wafer at LFAB. Responsibilities include:
In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will ...
In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will ...
Wet Process Development Engineer
Lehi, UT · On-site
As a Wet Process Development Engineer in TI's ATD organization in Lehi, you will own the ... The wet process modules you develop will run on every wafer at LFAB. Responsibilities include:
Wet Process Development Engineer
Lehi, UT · On-site
As a Wet Process Development Engineer in TI's ATD organization in Lehi, you will own the ... The wet process modules you develop will run on every wafer at LFAB. Responsibilities include:
DRY ETCH PROCESS DEVELOPMENT ENGINEER (WRITER) (49917)
Milpitas, CA · On-site
$96K - $142K/yr
DRY ETCH PROCESS DEVELOPMENT ENGINEER (WRITER) FLSA STATUS: EXEMPT REPORTS TO: SR. MANAGER, DRY ... Experience working in a wafer fab manufacturing environment * Experience with Statistical Process ...
DRY ETCH PROCESS DEVELOPMENT ENGINEER (WRITER) (49917)
Milpitas, CA · On-site
$96K - $142K/yr
DRY ETCH PROCESS DEVELOPMENT ENGINEER (WRITER) FLSA STATUS: EXEMPT REPORTS TO: SR. MANAGER, DRY ... Experience working in a wafer fab manufacturing environment * Experience with Statistical Process ...
DRY ETCH PROCESS DEVELOPMENT ENGINEER (Reader) (49918)
Milpitas, CA · On-site
$96K - $142K/yr
DRY ETCH PROCESS DEVELOPMENT ENGINEER (Reader) FLSA STATUS: EXEMPT REPORTS TO: SR. MANAGER, DRY ... Experience working in a wafer fab manufacturing environment * Experience with Statistical Process ...
DRY ETCH PROCESS DEVELOPMENT ENGINEER (Reader) (49918)
Milpitas, CA · On-site
$96K - $142K/yr
DRY ETCH PROCESS DEVELOPMENT ENGINEER (Reader) FLSA STATUS: EXEMPT REPORTS TO: SR. MANAGER, DRY ... Experience working in a wafer fab manufacturing environment * Experience with Statistical Process ...
Wafer Process Development Engineer information
See salary details
$45.5K - $55.2K
2% of jobs
$55.2K - $65K
1% of jobs
$65K - $74.7K
12% of jobs
$81.1K is the 25th percentile. Wages below this are outliers.
$74.7K - $84.4K
15% of jobs
The median wage is $93.4K / yr.
$84.4K - $94.1K
22% of jobs
$94.1K - $103.9K
16% of jobs
$113.2K is the 75th percentile. Wages above this are outliers.
$103.9K - $113.6K
8% of jobs
$113.6K - $123.3K
10% of jobs
$123.3K - $133K
9% of jobs
$133K - $142.8K
4% of jobs
$142.8K - $152.5K
2% of jobs
$45.5K
$101.6K
$152.5K
How much do wafer process development engineer jobs pay per year?
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Staff / Principal Wafer Bond Process Development Engineer
Boise, ID • On-site
Other
Medical, Dental, Vision, PTO
Re-posted 17 days ago
Micron Technology rating
8.6
Based on 43 frontline employees who took The Breakroom Quiz
28th of 162 rated electronics manufacturers
Job description
Req ID:
JR103798 Staff / Principal Wafer Bond Process Development Engineer
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will contribute to developing modern wafer bonding process technology that keeps Micron at the forefront of memory technology. This position is important because it directly affects product quality, reliability, yield, cost savings, efficiency, and risk control. You will initiate, develop, and fine-tune bonding processes while addressing manufacturing line challenges. You will also manage process, equipment, and material evaluations and improvements to apply changes at various process steps. Your duties include leading and engaging in activities to improve yield and reduce costs, overseeing new process baseline qualifications, and collaborating with suppliers to achieve quality, cost, and risk objectives. You will use AI/ML/LLM tools to boost efficiency and maintain flawless operations.
Responsibilities- Develop and optimize wafer bonding processes to enable next-generation DRAM technologies.
- Plan and execute experiments (DOEs) to improve process performance, product quality, and reliability.
- Drive yield improvement, cost reduction, and productivity initiatives using data-driven problem solving.
- Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing.
- Collaborate with manufacturing, suppliers, and cross-functional teams to resolve issues and implement process improvements.
- Use advanced analytics, AI/ML tools, and technical expertise to solve complex problems and accelerate innovation.
- PhD with 3+ years, Master's degree with 5+ years, or Bachelor's degree with 7+ years of relevant semiconductor industry experience.
- 5+ years of experience developing and driving wafer bonding technologies, process integration, or related semiconductor manufacturing processes.
- Hands-on experience with one or more of the following: direct bonding, hybrid bonding, wafer thinning, de-bonding, or other advanced bonding technologies.
- Strong analytical and problem-solving skills with a demonstrated ability to lead complex technical challenges, drive innovation, and deliver process improvements through data-driven decisions.
- Proven ability to work effectively across cross-functional teams while independently leading projects, influencing technical direction, and delivering results.
- Experience developing and optimizing semiconductor processes to improve quality, reliability, yield, cost, and manufacturing readiness.
- Experience supporting DRAM, memory, or advanced semiconductor technology development.
- Knowledge of process characterization, statistical analysis, DOE methodology, and root-cause investigation techniques.
- Experience qualifying new equipment, materials, and process technologies for high-volume manufacturing.
- Familiarity with supplier collaboration and technology transfer activities.
- Experience using AI, machine learning, or large language models (LLMs) to improve engineering productivity and accelerate problem solving.
- Strong written, verbal, and presentation communication skills.
- Boise, Idaho
Micron benefits include: Health, Savings, Wellbeing Programs, Stock Purchase Discount, and a generous Time Off Program.
Job Profile(s):
Semiconductor Process Engineer 4
Relocation Level: TBD
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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc
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About Micron Technology
Sourced by ZipRecruiter
Industry
Semiconductor and electronic component manufacturing
Company size
10,000+ Employees
Headquarters location
Boise, ID, US
Year founded
2019