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Thermal Simulation Fea Semiconductor Jobs (NOW HIRING)

Cspeed IO is developing next-generation optical semiconductor solutions for the AI infrastructure ... Define the thermal characterization plan and lead simulation-to-hardware correlation to a stated ...

MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent practical background. * 6+ years of thermal simulation for semiconductor packages or electronic systems, including ...

Interpret FEA results and leverage insights to provide physical explanations that identify root ... and thermal simulations Experience in building and calibrating non-linear material models ...

Interpret FEA results and leverage insights to provide physical explanations that identify root ... and thermal simulations Experience in building and calibrating non-linear material models ...

This team is seeking a mechanical engineer that specializes in Finite Element Analysis (FEA) to ... and thermal simulations Experience in building and calibrating non-linear material models ...

This team is seeking a mechanical engineer that specializes in Finite Element Analysis (FEA) to ... and thermal simulations Experience in building and calibrating non-linear material models ...

$150 - $210/hr

You'll prove that case by case: validating new solvers and methods against competitor FEA tools and ... Semiconductor packaging or high power-density electronics: chip-package-board thermal, 2.5D/3D ...

Experience with thermal simulation tools such as ANSYS, COMSOL, or similar platforms. * Familiarity with semiconductor packaging technologies and thermal interface materials. * Experience analyzing ...

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Thermal Simulation Fea Semiconductor information

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$43.5K

$104.5K

$167.5K

How much do thermal simulation fea semiconductor jobs pay per year?

As of Aug 26, 2026, the average yearly pay for thermal simulation fea semiconductor in the United States is $104,528.00, according to ZipRecruiter salary data. Most workers in this role earn between $80,000.00 and $129,000.00 per year, depending on experience, location, and employer.

What is a thermal simulation FEA engineer in the semiconductor industry?

A Thermal Simulation FEA Engineer in the semiconductor industry is a specialist who uses Finite Element Analysis (FEA) tools to model, simulate, and analyze the thermal behavior of semiconductor devices and components. Their work involves predicting how heat is generated, distributed, and dissipated within chips, packages, and systems to ensure optimal performance and reliability. They collaborate with design, process, and reliability teams to identify potential thermal issues early in the development cycle and recommend effective thermal management solutions. This role is critical in preventing overheating, improving product lifespan, and supporting the advancement of complex, high-performance semiconductor technologies.

What are the key skills and qualifications needed to thrive as a thermal simulation FEA engineer in the semiconductor industry?

To thrive as a Thermal Simulation FEA Engineer in the semiconductor industry, you need a strong background in mechanical or electrical engineering, thermal analysis, and finite element analysis (FEA), often supported by a relevant degree. Proficiency with simulation tools such as ANSYS, COMSOL, or Abaqus, and familiarity with semiconductor manufacturing processes and standards, is typically required. Strong problem-solving abilities, attention to detail, and effective communication skills help you deliver accurate analyses and collaborate with cross-functional teams. These competencies ensure reliable thermal designs, optimize device performance, and support innovation in a highly competitive field.

What are some common challenges faced by thermal simulation FEA engineers in the semiconductor industry?

Thermal Simulation FEA engineers in the semiconductor industry often encounter challenges such as accurately modeling complex device geometries, managing multi-physics interactions, and ensuring simulation results align with real-world measurements. They must frequently collaborate with design, process, and reliability teams to obtain up-to-date data and validate simulation assumptions. Keeping up with evolving semiconductor technologies and tight project timelines also requires adaptability and strong problem-solving skills.

What is the difference between Thermal Simulation Fea Semiconductor vs Thermal Analysis Engineer?

AspectThermal Simulation Fea SemiconductorThermal Analysis Engineer
CredentialsEngineering degree, simulation certificationsEngineering degree, thermal analysis certifications
Work EnvironmentDesign labs, simulation softwareTesting labs, product development teams
Industry UsageSemiconductor manufacturing, electronicsElectronics, aerospace, automotive

Thermal Simulation Fea Semiconductor specialists focus on using finite element analysis to optimize thermal performance of semiconductor devices, primarily in electronics manufacturing. Thermal Analysis Engineers have a broader scope, applying thermal analysis across various industries and products. Both roles require engineering backgrounds and simulation skills, but their focus areas and application environments differ.

Infographic showing various Thermal Simulation Fea Semiconductor job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 84% Full Time, 13% Part Time, and 2% Contract. Highlights an 84% Physical, 4% Hybrid, and 12% Remote job distribution, with an average salary of $104,528 per year, or $50.3 per hour.

2311 Principal Thermal Simulation Engineer

Columbus, OH โ€ข On-site

Full-time

Posted 9 days ago


Job description

Job Title:

Principal Thermal Simulation Engineer

Reports To:

Director of Engineering

Department:

Engineering

Compensation:

Salary

Location:

Columbus, Ohio

Travel Required:

5% (1-2 trips per year)

Job Summary

BriskHeat is seeking an experienced Principal Thermal Simulation Engineer to serve as the company's technical authority for thermal modeling, simulation, and engineering methodology. This is a senior technical leadership role responsible for advancing BriskHeat's thermal engineering capabilities through improved simulation accuracy, engineering standards, digital engineering tools, and validated design methodologies.


Working closely with the Design Engineering, Thermal Engineering, and R&D teams, this individual will drive continuous improvement in thermal simulation practices, develop engineering tools and procedures that reduce product development time, mentor engineering staff, and provide technical leadership on complex customer applications.


The ideal candidate combines deep expertise in heat transfer and thermodynamics with practical engineering judgment, advanced simulation experience, and a passion for improving engineering processes.

Job DescriptionTechnical Leadership
  • Serve as BriskHeat's technical authority in heat transfer, thermodynamics, and thermal simulation.
  • Drive the continuous improvement and long-term evolution of BriskHeat's thermal simulation capability, including modeling methodologies, engineering standards, validation techniques, and best practices.
  • Lead technical initiatives that improve engineering capability across the Design Engineering and R&D teams.
  • Mentor and train Design Engineers in thermal analysis, simulation methodologies, and engineering fundamentals.
  • Develop engineering documentation, work instructions, and training materials supporting thermal simulation and engineering best practices.
Thermal Modeling & Simulation
  • Perform advanced steady-state and transient thermal analyses using Finite Element Analysis (FEA).
  • Develop thermal models supporting BriskHeat heating solutions used in semiconductor manufacturing equipment and other demanding industrial applications.
  • Analyze temperature distributions, transient heat-up performance, surface temperatures, thermal gradients, thermal efficiency, and potential thermal safety considerations.
  • Optimize product designs through simulation-driven engineering.
  • Evaluate complex customer applications and recommend practical thermal solutions based on sound engineering principles.
Simulation Standards & Validation
  • Develop, refine, and maintain company standards for thermal modeling, simulation setup, material properties, engineering assumptions, meshing strategies, and result interpretation.
  • Create standardized simulation templates and workflows that improve repeatability, consistency, and engineering efficiency.
  • Validate simulation models through laboratory testing, analytical calculations, and correlation with product performance data.
  • Continuously improve simulation accuracy while reducing engineering design cycle time.
  • Support the development of predictive simulation methodologies that enable faster and more confident engineering decisions.
Engineering Process Improvement
  • Lead continuous improvement initiatives across the Design Engineering organization.
  • Develop engineering calculators, design tools, templates, and automated workflows that improve engineering productivity.
  • Identify opportunities to improve SolidWorks modeling practices, engineering procedures, simulation workflows, and design standards.
  • Evaluate opportunities to leverage Python, VBA, or similar technologies to automate engineering calculations and repetitive design tasks.
  • Research and implement new engineering methods, software tools, and technologies that improve engineering capability and product development efficiency.
Customer Technical Support
  • Provide engineering support for complex customer applications and unique thermal challenges.
  • Participate in technical discussions with customer engineering teams to understand application requirements and recommend optimized thermal solutions.
  • Clearly communicate engineering analyses, thermal trade-offs, and design recommendations to technical audiences.
  • Support strategic semiconductor OEM customers.
  • Travel occasionally to customer sites as required.

Required Qualifications
  • Master's degree or Ph.D. in Mechanical Engineering, Thermal Sciences, Heat Transfer, Aerospace Engineering, Applied Physics, Chemical Engineering, Materials Science, or a related engineering discipline.
  • 5–10 years of engineering experience in thermal analysis, heat transfer, or thermal product development.
  • Strong understanding of thermodynamics, heat transfer, fluid mechanics, and thermal systems engineering.
  • Extensive experience performing thermal Finite Element Analysis (FEA).
  • Experience with Ansys simulation software, preferably Ansys Discovery.
  • Experience using SolidWorks and SpaceClaim or similar 3D CAD software.
  • Experience developing and validating thermal simulation models.
  • Ability to solve complex engineering problems using first-principles analysis.
  • Excellent written and verbal communication skills.
  • Demonstrated ability to lead technical projects, mentor engineers, and drive continuous improvement initiatives.
  • Strong work ethic with the ability to work independently while collaborating effectively across engineering disciplines.​​
Physical Demands

The physical demands described here and above are representative of those that must be met by an employee to successfully perform the essential functions of the position. Reasonable accommodations may be made to enable individuals with disabilities to perform these essential functions of the position.

  • Must be able to move boxes up to 10lbs
  • Constantly operates a computer and other office equipment
  • Must be able to move different positions to maintain different files
  • Must be able to remain stationary up to 75% of the time

Work Environment

The work environment characteristics described here and above are representative of those that an employee encounters while performing the essential functions of the position. Reasonable accommodations may be made to enable individuals with disabilities to perform these essential functions of the position.


Disclaimer

The preceding job description has been designed to indicate the general nature and level of work performed by employees within this classification. It is not designed to contain or be interpreted as a comprehensive inventory of all duties, responsibilities, and qualifications required of employees assigned to this position. Nothing in this job description restricts management’s right to assign or reassign duties and responsibilities to this job at any time