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Temp Rf Antenna Design Engineer Jobs in New York

Nokia

High-Speed Package Design Engineer

Murray Hill, NJ

$143K/yr

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

Distributed Spectrum Inc

RF Systems Engineer

New York, NY · On-site

$120K - $250K/yr

... antenna models, propagation models, channel simulations) to evaluate system design decisions • ... RF concepts to non-specialists BS or higher or equivalent experience Electrical Engineering or ...

Gumloop

Design Engineer

New York, NY · On-site

Role Overview We're looking for a Design Engineer to help shape, design, and build high-craft ... temporary remote work flexibility per year * 401k match up to 6%

City of New York

Design Engineer

Floral Park, NY

... Engineer or if you are on the open-competitive list Exam #5015. The Department of Design ... S. immigration law and is not hiring temporary employees. Candidates must have proper work ...

City of New York

Design Engineer

Floral Park, NY

... Engineer or if you are on the open-competitive list Exam #5015. The Department of Design ... S. immigration law and is not hiring temporary employees. Candidates must have proper work ...

City of New York

Design Engineer

Floral Park, NY · On-site

$70K - $80K/yr

... Engineer or if you are on the open-competitive list Exam #5015. The Department of Design ... S. immigration law and is not hiring temporary employees. Candidates must have proper work ...

Belcan

Senior Design Engineer

Westbury, NY · On-site

Senior Design Engineer Location: Bethpage, NY Start Date: Right Away Job Type: Direct Hire Salary ... We offer excellent opportunities for contract, temporary, temp-to-hire, and direct assignments. We ...

Arup

Telecom Design Engineer

New York, NY · On-site

$100K - $125K/yr

Design active networks, RF modeling software, DAS, building automation systems, electronic security ... Bachelor's degree in Technology, Architectural Engineering, Electrical Engineering or related ...

Teledyne FLIR LLC

IC Design Engineer

Chestnut Ridge, NY · On-site

$113K - $151K/yr

Design for manufacturability and reliability The Tools The IC Design Engineer will primarily use ... Understanding of RF design topics such as S-Parameters and matching networks * Proficiency with the ...

Teledyne

IC Design Engineer

Chestnut Ridge, NY

$113K - $151K/yr

Design for manufacturability and reliability The Tools The IC Design Engineer will primarily use ... Understanding of RF design topics such as S-Parameters and matching networks * Proficiency with the ...

1 point system

Wireless Engineer

Manhattan, NY · On-site

Possess a profound understanding of RF propagation, antenna theory, and cutting-edge wireless ... Design Software: Proficient in leveraging RF modeling and simulation software (Visio, and AutoCAD ...

1 point system

Ekahau Wireless Engineer

New York, NY · On-site

Summary: Senior RF wireless engineer who can design, analyze, and optimize complex wireless ... Possess a profound understanding of RF propagation, antenna theory, and cutting-edge wireless ...

W3Global Inc.

Control System Design Engineer

New York, NY

$115K - $145K/yr

Senior Controls Design Engineer Specializing in HVAC & Building Automation & Control Systems (BAS ... We specialize in placing permanent, direct, contract, and temporary positions for companies of any ...

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All JobsRf Antenna Design Engineer JobsTemp Rf Antenna Design Engineer JobsTemp Rf Antenna Design Engineer Jobs in New York

Temp Rf Antenna Design Engineer information

What is the difference between Temp Rf Antenna Design Engineer vs RF Antenna Design Engineer?

AspectTemp Rf Antenna Design EngineerRF Antenna Design Engineer
CredentialsBachelor's or higher in Electrical Engineering, RF or Antenna EngineeringBachelor's or higher in Electrical Engineering, RF or Antenna Engineering
Work EnvironmentTemporary projects, contract roles, R&D labsFull-time positions, R&D departments, manufacturing facilities
Industry UsageTelecommunications, defense, aerospace with project-based rolesTelecom, aerospace, consumer electronics companies

The main difference between a Temp Rf Antenna Design Engineer and an RF Antenna Design Engineer lies in employment type and project duration. Temp Rf Antenna Design Engineers typically work on short-term, contract-based projects, often in R&D labs or specialized settings. In contrast, RF Antenna Design Engineers usually hold full-time roles within companies, focusing on ongoing product development and manufacturing. Both roles require similar technical skills and educational backgrounds, but their employment arrangements and project scopes differ.

What cities in New York are hiring for Temp Rf Antenna Design Engineer jobs? Cities in New York with the most Temp Rf Antenna Design Engineer job openings:
Temp Rf Antenna Design Engineer jobs near you
High-Speed Package Design Engineer

High-Speed Package Design Engineer

Nokia

Murray Hill, NJ

$143K/yr

Full-time

Re-posted 10 days ago

Nokia rating

8.6

Company rating: 8.6 out of 10

Based on 5 frontline employees who took The Breakroom Quiz

6th of 82 rated telecommunications companies

Job description

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.  

This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadershipisthe primary emphasis of this role.  

This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure. 

Required Qualifications 

  • MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience  
  • 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications  
  • Strong fundamentals in electromagnetics, signal integrity, and power integrity  
  • Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD,Xpedition, or equivalent)  
  • Ability to work independently and collaboratively in a cross-functional, research-driven environment  

Preferred Qualifications  

  • Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)  
  • Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors  
  • Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis
  • PCB design and technology (e.g., Altium or equivalent) 
  • Lead the design and development of high-speed IC packages, includingSiP, FC-BGA, and advanced heterogeneous integration solutions  
  • Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements  
  • Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces  
  • Co-optimizedie, package, and PCB designs in collaboration with silicon, board, and system integration teams  
  • Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope)  
  • Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors  
  • Provide technical input and design validation for vendor-supported automation and enablement efforts  
  • Support continuous improvement of package design methodologies and best practices across projects 

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