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Substrate Jobs in Boston, MA (NOW HIRING)

Velaura

Principal Packaging Engineer

Boston, MA

$200K - $300K/yr

Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors. Own package-level signal integrity and power integrity planning ...

Conductor

Packaging Engineer- Flip Chip

Boston, MA · On-site

This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cross-functional support through package and systemproductization. Core ...

Analog Devices

SiP Layout Design Engineer

Wilmington, MA · On-site

$116K - $160K/yr

Develop detailed laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions. * Design and optimize routing, power and ...

Analogdevices

SiP Layout Design Engineer

Wilmington, MA · On-site

$116K - $160K/yr

Develop detailed laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions. * Design and optimize routing, power and ...

Onto

Senior Manager, Product Marketing

Wilmington, MA · On-site

$133K - $200K/yr

Experience supporting products for bare silicon/substrate is a plus. What Success Looks Like * Increased adoption of wafer edge and backside inspection platforms * Strong product positioning versus ...

Onto

Senior Manager, Product Marketing

Wilmington, MA · On-site

$133K - $200K/yr

Experience supporting products for bare silicon/substrate is a plus. What Success Looks Like * Increased adoption of wafer edge and backside inspection platforms * Strong product positioning versus ...

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All JobsSubstrate JobsSubstrate Jobs in Boston, MA

Substrate information

See Boston, MA salary details

$23K

$117.3K

$205.5K

How much do substrate jobs pay per year?

As of Sep 13, 2026, the average yearly pay for substrate in Boston, MA is $117,335.00, according to ZipRecruiter salary data. Most workers in this role earn between $91,527.00 and $160,575.00 per year, depending on experience, location, and employer.

What is the difference between Substrate vs Blockchain Developer?

AspectSubstrateBlockchain Developer
Primary FocusFramework for building blockchain networksDeveloping blockchain applications and smart contracts
Required SkillsRust, blockchain architecture, cryptographyProgramming (Solidity, JavaScript), blockchain concepts
Work EnvironmentBlockchain development teams, open-source projectsVarious industries, startups, and tech companies
CertificationsNone specific, technical expertise preferredBlockchain certifications (e.g., Certified Blockchain Developer)

Substrate is a blockchain framework used to build custom blockchain networks, while a Blockchain Developer focuses on creating applications and smart contracts on existing blockchains. Substrate provides the tools to develop new chains, whereas Blockchain Developers work across various platforms to implement blockchain solutions. Both roles require blockchain knowledge but differ in scope and technical focus.

Substrate jobs near you
Infographic showing various Substrate job openings in Boston, MA as of August 2026, with employment types broken down into 91% Full Time, 7% Part Time, 1% Contract, and 1% Nights. Highlights an 93% Physical, 1% Hybrid, and 6% Remote job distribution, with an average salary of $117,335 per year, or $56.4 per hour.

Principal Packaging Engineer

Boston, MA

Velaura
See more jobs at Velauraexternal

$200K - $300K/yr

Full-time

Medical, Dental, Vision, PTO

Re-posted 18 hours ago

Key responsibilities

  • Own package architecture from concept through production for Velaura SoCs.

  • Partner with architecture and silicon teams to co-optimize package, die, board, and system design for performance, power, cost, and manufacturability.

  • Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors.

Job description

Role Overview
We are looking for a Principal Packaging Engineer to own package architecture and development for Velaura's next-generation SoCs. This role will lead packaging from concept through production, working across silicon, board, system, thermal, mechanical, and manufacturing teams to deliver high-performance, cost-effective, and manufacturable products. The ideal candidate has deep experience with advanced semiconductor packaging, package-level signal and power integrity, substrate and assembly technologies, and cross-functional system optimization.
Responsibilities

 Own package architecture from concept through production for Velaura SoCs.

 Partner with architecture and silicon teams to co-optimize package, die, board, and system design for performance, power, cost, and manufacturability.

 Drive package technology selection, including flip-chip, advanced substrates, fan-out, and future multi-die integration approaches.

Lead package design, bump planning, substrate definition, escape routing, and assembly interactions with OSAT and substrate vendors.

 Own package-level signal integrity and power integrity planning for high-speed interfaces including LPDDR, PCIe, Ethernet, and other high-speed I/O.

Collaborate on thermal architecture, mechanical integration, reliability, DFM, and qualification.

Work with foundry, assembly, substrate, and test partners to successfully deliver products to production.

Help define Velaura's long-term packaging roadmap as future products evolve.

Required Qualifications

Deep experience developing advanced semiconductor packages for high-performance SoCs.

Strong understanding of package architecture, substrate technologies, bumping, assembly flows, and manufacturing.

Experience co-optimizing package design with silicon, board, SI/PI, thermal, and mechanical teams.

Hands-on experience with signal integrity, power integrity, thermal, and reliability

considerations in advanced packages.

Ability to balance technical excellence with cost, yield, manufacturability, and schedule.

Excellent communication skills and a collaborative, first-principles engineering mindset.

Preferred Qualifications

Advanced packaging technologies including chiplets, 2.5D integration, silicon bridges, or heterogeneous integration.

HBM integration and high-bandwidth memory package architecture.

Advanced process nodes (N3, N2, or beyond).

Experience working with leading foundries, OSATs, and substrate vendors.

Experience in an early-stage semiconductor company.

$200,000 - $300,000 a year
Compensation & Benefits

At Velaura, we believe exceptional talent deserves exceptional rewards. Compensation for this role includes a base salary and very competitive equity compensation, allowing team members to share in the company's long-term success.

The base pay listed represents a good faith estimate that the Company reasonably expects to pay for this position at the time of hire. Actual compensation will depend on multiple factors, including the candidate's skills, qualifications, relevant experience, and geographic location.

In addition to base salary and equity compensation, Velaura offers a comprehensive benefits package that may include medical, dental, and vision coverage; paid time off; flexible work arrangements; professional development opportunities; and other benefits designed to support the well-being and growth of our team.

Velaura is committed to pay equity and transparency and regularly benchmarks compensation to ensure we remain competitive in the market.

Why Velaura?

Velaura is building next-generation compute technology for cloud, edge, and Physical AI. Our solutions will enable robots, autonomous systems, drones, and other intelligent machines to operate efficiently in the physical world.
This is an opportunity to help build foundational technology at a time when the industry is undergoing fundamental change. You will work alongside experienced leaders, architects, engineers, and operators who have delivered industry-defining products across mobile, cloud, semiconductor, and AI platforms. If you enjoy solving difficult problems, working across disciplines, and helping shape the future of Physical AI, we would love to hear from you.

Equal Employment Opportunity and Accommodations

Velaura is an Equal Opportunity Employer that is committed to inclusion and diversity. Qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, disability or protected veteran status. We also take affirmative action to offer employment
opportunities to minorities, women, individuals with disabilities, and protected veterans.

Velaura is committed to working with qualified individuals with physical or mental disabilities. Applicants who would like to contact us regarding the accessibility of our website or who need special assistance or a reasonable accommodation for any part of the application or hiring process may contact us at: [email protected]. This contact
information is for accommodation requests only. Evaluation of requests for reasonable accommodation will be determined on a case-by-case basis.

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
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