Staff Package Design Engineer
Tempe, AZ · On-site
Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and power/ground distribution features. * Collaborate with SI/PI, thermal, reliability, DFT, silicon ...
Staff Package Design Engineer
Tempe, AZ · On-site
Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and power/ground distribution features. * Collaborate with SI/PI, thermal, reliability, DFT, silicon ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
Perform substrate design and package layout activities while ensuring adherence to design specifications. * Execute signal integrity (SI) and power integrity (PI) aware package designs. * Optimize ...
IC Packaging Design Engineer
Chandler, AZ · On-site
$138K/yr
Perform substrate design and package layout activities while ensuring adherence to design specifications. * Execute signal integrity (SI) and power integrity (PI) aware package designs. * Optimize ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$105K - $149K/yr
Perform substrate fit and routing studies to establish design, performance, and cost tradeoffs. * Define and implement substrate design rules, conducting internal and external reviews to ensure ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$105K - $149K/yr
Perform substrate fit and routing studies to establish design, performance, and cost tradeoffs. * Define and implement substrate design rules, conducting internal and external reviews to ensure ...
Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and ...
Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and ...
Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and ...
Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$105K - $149K/yr
Perform substrate fit and routing studies to establish design, performance, and cost tradeoffs. * Define and implement substrate design rules, conducting internal and external reviews to ensure ...
Silicon Packaging Design Engineer
Phoenix, AZ · On-site
$105K - $149K/yr
Perform substrate fit and routing studies to establish design, performance, and cost tradeoffs. * Define and implement substrate design rules, conducting internal and external reviews to ensure ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
New
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
New
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
New
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
New
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
Key job responsibilities - Lead the full package layout cycle from die floor planning, bump/pad assignment, and RDL routing through substrate design, verification, and tape out release. - Drive ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Substrate and Wafer Assembly (APTDSWA) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the APTDSWA organization to assist in achieving ...
Substrate and Wafer Assembly (APTDSWA) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the APTDSWA organization to assist in achieving ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
New
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
New
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Key job responsibilities - Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release ...
Substrate and Wafer Assembly (APTDSWA) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the APTDSWA organization to assist in achieving ...
Substrate and Wafer Assembly (APTDSWA) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the APTDSWA organization to assist in achieving ...
Substrate information
See Arizona salary details
$20.9K - $35.9K
8% of jobs
$35.9K - $51K
8% of jobs
$51K - $66K
1% of jobs
$66K - $81.1K
6% of jobs
$82.9K is the 25th percentile. Wages below this are outliers.
$81.1K - $96.1K
8% of jobs
The median wage is $103.9K / yr.
$96.1K - $111.2K
34% of jobs
$122.1K is the 75th percentile. Wages above this are outliers.
$111.2K - $126.2K
11% of jobs
$126.2K - $141.3K
0% of jobs
$141.3K - $156.3K
5% of jobs
$156.3K - $171.4K
8% of jobs
$171.4K - $186.4K
8% of jobs
$20.9K
$106.4K
$186.4K
How much do substrate jobs pay per year?
As of Sep 13, 2026, the average yearly pay for substrate in Arizona is $106,416.00, according to ZipRecruiter salary data. Most workers in this role earn between $83,010.00 and $145,631.00 per year, depending on experience, location, and employer.
What is the difference between Substrate vs Blockchain Developer?
| Aspect | Substrate | Blockchain Developer |
|---|---|---|
| Primary Focus | Framework for building blockchain networks | Developing blockchain applications and smart contracts |
| Required Skills | Rust, blockchain architecture, cryptography | Programming (Solidity, JavaScript), blockchain concepts |
| Work Environment | Blockchain development teams, open-source projects | Various industries, startups, and tech companies |
| Certifications | None specific, technical expertise preferred | Blockchain certifications (e.g., Certified Blockchain Developer) |
Substrate is a blockchain framework used to build custom blockchain networks, while a Blockchain Developer focuses on creating applications and smart contracts on existing blockchains. Substrate provides the tools to develop new chains, whereas Blockchain Developers work across various platforms to implement blockchain solutions. Both roles require blockchain knowledge but differ in scope and technical focus.
What cities in Arizona are hiring for Substrate jobs?
Cities in Arizona with the most Substrate job openings:
Staff Package Design Engineer
Tempe, AZ • On-site
Renesas Electronics
Full-time
Re-posted 11 days ago
Job description
Company Description
Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, Renesas is expanding its advanced packaging capabilities and seeking a talented Staff Package Design Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver next-generation, high-performance package solutions that support our world-class product portfolio across automotive, industrial, infrastructure, and IoT applications.
Job Description
In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, wire-bonded, QFP, and QFN packages supporting automotive SoCs, industrial IoT microcontrollers, and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution, manufacturability, assembly process constraints, and cross-domain co-design with global silicon design, signal integrity/power integrity, thermal, reliability, and product engineering teams.
Key Responsibilities
Qualifications
Education
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose 'To Make Our Lives Easier.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, 'To Make Our Lives Easier.'
At Renesas, you can:
Are you ready to own your success and make your mark?
Join Renesas. Shape Your Future with Us.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Videos To Watch
https://www.youtube.com/embed/k-zs4tB6nNc
Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, Renesas is expanding its advanced packaging capabilities and seeking a talented Staff Package Design Engineer to join our Advanced Silicon Packaging team. In this role, you will design and deliver next-generation, high-performance package solutions that support our world-class product portfolio across automotive, industrial, infrastructure, and IoT applications.
Job Description
In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, wire-bonded, QFP, and QFN packages supporting automotive SoCs, industrial IoT microcontrollers, and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution, manufacturability, assembly process constraints, and cross-domain co-design with global silicon design, signal integrity/power integrity, thermal, reliability, and product engineering teams.
Key Responsibilities
- Execute package layout design and development for advanced package technologies, including power modules, FCBGA, SiP, WLCSP, and multi-chip modules.
- Develop and maintain package CAD databases, ensuring accuracy and adherence to package design guidelines, DFM, and DFA requirements to support manufacturability, yield, and long-term reliability.
- Manage the package design cycle, including schematic creation, netlist import, footprint assignment, layout implementation, verification, and generation of manufacturing release outputs such as Gerber/drill data, fabrication drawings, assembly drawings, bump maps, and related documentation.
- Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and power/ground distribution features.
- Collaborate with SI/PI, thermal, reliability, DFT, silicon design, product engineering, and manufacturing teams to support package-level co-optimization and participate in design reviews.
- Ensure package designs comply with applicable foundry, OSAT, substrate vendor, and manufacturing design rules, including DRC, LVS, connectivity, and netlist verification requirements.
- Support Engineering Change Order cycles, design updates, revision control, and release documentation throughout the project lifecycle.
Qualifications
- 4+ years of hands-on experience in package CAD layout, substrate design, or advanced package development; 6+ years preferred.
- Strong background in power module packaging, FCBGA, SiP, WLCSP, advanced substrate-based packages, and multi-die/chiplet-based package architectures.
- High proficiency with industry-standard package design tools such as Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Substrate Integrator, or equivalent CAD platforms.
- Proven experience applying advanced package design rules, substrate vendor constraints, OSAT assembly requirements, DFM/DFA principles, and manufacturing release standards.
- Experience interfacing directly with Tier-1 OSATs, substrate suppliers, foundries, silicon design teams, and product engineering teams.
- Working understanding of SI/PI fundamentals, high-speed routing, impedance control, power/ground distribution, and crosstalk mitigation.
- Strong communication, presentation, and technical documentation skills, with demonstrated experience working effectively in global, cross-functional engineering environments.
Education
- Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose 'To Make Our Lives Easier.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, 'To Make Our Lives Easier.'
At Renesas, you can:
- Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
- Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.
- Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.
Are you ready to own your success and make your mark?
Join Renesas. Shape Your Future with Us.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Videos To Watch
https://www.youtube.com/embed/k-zs4tB6nNc