The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
The Role and Impact As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding ...
Sr Rf Engineer information
See Salem, OR salary details
$37.3K - $50.7K
3% of jobs
$50.7K - $64.1K
1% of jobs
$64.1K - $77.5K
6% of jobs
$77.5K - $90.8K
7% of jobs
$97K is the 25th percentile. Wages below this are outliers.
$90.8K - $104.2K
15% of jobs
The median wage is $114.4K / yr.
$104.2K - $117.6K
22% of jobs
$117.6K - $131K
15% of jobs
$136.5K is the 75th percentile. Wages above this are outliers.
$131K - $144.4K
12% of jobs
$144.4K - $157.7K
7% of jobs
$157.7K - $171.1K
6% of jobs
$171.1K - $184.5K
4% of jobs
$37.3K
$118.7K
$184.5K
How much do sr rf engineer jobs pay per year?
As of Aug 2, 2026, the average yearly pay for sr rf engineer in Salem, OR is $118,651.00, according to ZipRecruiter salary data. Most workers in this role earn between $98,300.00 and $140,100.00 per year, depending on experience, location, and employer.
What are Sr RF Engineers?
Sr RF Engineers, or Senior Radio Frequency Engineers, are professionals who design, implement, and optimize wireless communication systems. They work with radio frequency signals and components to ensure reliable transmission and reception for applications such as cellular networks, satellite communications, and wireless devices. Their responsibilities often include system design, troubleshooting, network optimization, and compliance with regulatory standards. Sr RF Engineers typically have extensive experience and may lead teams or mentor junior engineers. They play a crucial role in advancing wireless technology and maintaining high-quality communications infrastructure.
What are the key skills and qualifications needed to thrive as a Sr RF Engineer, and why are they important?
To thrive as a Sr RF Engineer, you need deep expertise in radio frequency engineering, signal processing, and wireless communication systems, usually supported by a degree in electrical engineering or a related field. Familiarity with RF simulation tools (such as CST, HFSS, or ADS), network analyzers, and relevant certifications like FCC or IEEE are typically required. Strong problem-solving skills, attention to detail, and effective collaboration set standout professionals apart in this role. These skills ensure reliable RF system performance, compliance with technical standards, and successful project delivery in dynamic technology environments.
What are some typical challenges Sr RF Engineers face when managing large-scale wireless network deployments?
Sr RF Engineers often encounter challenges such as mitigating signal interference, ensuring optimal coverage in complex environments, and adapting designs to evolving regulatory standards. Managing multiple project timelines and coordinating with cross-functional teams—like network planners, field technicians, and software specialists—are also common aspects of the role. Effective problem-solving, strong communication, and staying current with RF technologies are essential to successfully overcoming these challenges.
What is the difference between Sr Rf Engineer vs RF Engineer?
| Aspect | Sr Rf Engineer | RF Engineer |
|---|---|---|
| Credentials | Bachelor's or Master's in Electrical Engineering, certifications like FCC or RF-specific courses | Bachelor's in Electrical or Electronics Engineering, similar certifications often required |
| Work Environment | Design, testing, and troubleshooting RF systems in labs or field | Similar environments, focusing on RF system implementation and testing |
| Industry Usage | Telecommunications, aerospace, defense, wireless networks | Telecommunications, consumer electronics, wireless communication |
| Role Focus | Advanced RF design, system optimization, technical leadership | RF system setup, testing, and basic troubleshooting |
The main difference between a Sr Rf Engineer and an RF Engineer lies in experience and responsibilities. Sr Rf Engineers typically handle advanced design and optimization tasks, often leading projects, while RF Engineers focus on implementation and testing. Both roles require similar educational backgrounds and certifications, but the senior role involves more strategic and technical leadership in RF projects.
What cities near Salem, OR are hiring for Sr Rf Engineer jobs? Cities near Salem, OR with the most Sr Rf Engineer job openings:
Full-time
Medical, Retirement, PTO
Posted 9 days ago
Intel rating
8.7
Based on 147 frontline employees who took The Breakroom Quiz
20th of 156 rated electronics manufacturers
Job description
Job Description
Qualifications
Inside this Business Group
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
The Role and Impact
As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
Key Responsibilities
• Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control.
• Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
• Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
• Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
• Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
• Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
• Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
• Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
• Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
• Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.
Behavioral Skills
• Demonstrated ability to solve complex technical problems using structured engineering methodologies.
• Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
• Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
• Proven ability to mentor and develop engineers and technical team members.
• Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
• Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of industry experience; OR
• Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of industry experience; OR
• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 5+ years of industry experience.
Industry experience must include the following:
• 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging,
Preferred Qualifications
• Experience leading first-of-a-kind (FOK) process or equipment development programs.
• Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
• Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
• Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
• Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
• Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
• Experience collaborating with external equipment suppliers and materials vendors on technology development activities.
• Experience supporting technology transfer from development to manufacturing.
Inside this Business Group
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968