Automatic Wire Bonding Operator
Job Description
This role will be an assembly operator working with Automatic wire bonding equipment.
Responsibilities:
- Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
- Operate and set-up Automatic Gold wire/ribbon bonders (Palomar 8000, H+K 820 systems or F&K Delvotec) per micro-circuit layout drawings
- Operator is responsible for proper wire formation, bond appearance and bond strength.
- Flexibility to be trained in multiple Microelectronics processes that involve ball & wedge wire bonding
- Capable of performing bond pull/die shear and plotting SPC with data
- Familiarity of the use of plasma cleaning and other surface preparation for semiconductors and substrates
- Requires significant attention to detail for production activities and documentation to maintain compliance with MIL-STD 883 requirements
- Familiarity with FOD prevention and management
- Familiar with ESD controls