Signal Processing Asic Engineer Jobs (NOW HIRING)

Dayton, OH This position is ideal for an Electrical Engineer or Computer Engineer passionate about advancing Radio Frequency (RF) sensors capabilities using Application-Specific Integrated Circuit (ASIC) microelectronic components. DR-02: $75,484 - $118,528

This job announcement will accept candidate submissions until 11:45 PM EST, 20 September 2026.

The incumbent will serve as a key member of our research team, planning and conducting R&D in advanced sensor subsystems. You will develop next-generation ASIC programs for microelectronic components and advanced electronics packaging. In this role, you will help advance next-generation multifunction RF sensors and Electronic Warfare subsystems supporting critical Air Force air and space capabilities. Your work will directly contribute to state-of-the-art sensor development for both in-house projects and major Air Force acquisition programs.

Position duties include but are not limited to:

• Designing and developing specialized integrated digital and mixed-signal circuits targeting advanced silicon fabrication processes for military applications.
• Analyzing and optimizing designs to balance performance, power consumption, size and cost to meet project goals.
• Developing and executing test plans to verify the functionality and correctness of designs. This can involve simulations, formal verification, and other methodologies.
• Overseeing data collection efforts to support research and development initiatives.
• Providing critical technical oversight for Air Force-sponsored contractual efforts.
• Participating in the bring-up and validation of the manufactured silicon to identify and debug any issues.
• Working closely with various teams, including architects, verification engineers, physical design teams, and software engineers, to ensure the successful integration and functionality of domain-specific ASICs.
• Serving as a subject-matter expert, presenting detailed scientific findings to peers, senior leaders, and external organizations.
• Developing proposals and interface with OSW stakeholders and DAF program offices to accelerate technology readiness and transitions.
• Leading Domain-Specific ASIC programs focused on next-generation development of microelectronics for sensor technology that transitions to Air and Space platforms
• Representing the Air Force Research Laboratory as a technical authority in your field.
• Evaluating engineering analyses from academic and industry partners, providing expert scientific judgment.
• Authoring/co-authoring technical papers reporting on the results of investigations.
  

• Ability to obtain and maintain a Top Secret with access to SCI/SAP Clearance
• To qualify for the DR-02, applicants must have at least one (1) year of specialized experience at the next lower grade, DR-01 or equivalent in other pay systems. Specialized experience includes RF, digital, and mixed signal design experience.
• This position is an Acquisition Professional Development Program (APDP) position requiring Level/Tier 2 (Practitioner) Non-Critical certification in Engineering and Technical Management (N); experience is 4 years; the selectee will have 60 months to meet APDP requirements, or a waiver must be obtained.

• Master's degree from an accredited academic institution
• Digital Logic Design: A strong understanding of digital design principles, including combinational and sequential logic.
• Mixed Signal Design: A strong understanding of mixed signal design methods and verification.
• Familiarity with programming languages, e.g., VHDL, System Verilog, MATLAB, C/C++, Python.
• Familiarity with ASIC and Mixed Signal Design tools/ design flows such as Cadence, Synopsys, Siemens.
• Proficient in verification best practices and familiar with the Universal Verification Methodology (UVM) tools.
• Familiarity with Communications and Electronic Warfare subsystems and Phased Array Sensors and Open Architecture standards.
• Familiarity with the entire ASIC design flow, from RTL design to tape-out, is necessary.
• Familiarity with chiplets and ASIC packaging using high density and heterogeneous packaging techniques.
• Experience with the design, integration, test, and evaluation of sensor subsystem software and hardware.
• Proficient in digital signal processing and familiarity with digital engineering, digital processor designs and architectures, and artificial intelligence/machine learning approaches and hardware.
• Knowledge of radio frequency components: antennas, amplifiers, filters, mixers, and analog-to-digital converters.
• Experience related to research and development of advanced sensor subsystems and concepts.
• RF, digital, and mixed signal experimental and test and evaluation experience.
• Must have superior analytical thinking and problem-solving skills.
• Excellent verbal, oral, and written communication skills for technical and senior leader audiences.
• Self-motivated, able to work with minimal supervision, and still meet deadlines.
• Open to collaboration and able to work productively as part of a team.

Yes, this position is eligible for situational telework; as determined by agency policy

No

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This is a drug testing designated position. The incumbent will be subject to random testing.

Ability to perform TDY travel approximately 15% time.