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Si Pi Engineer Jobs in Bothell, WA (NOW HIRING)

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...

New

K2 Space

Principal ASIC Package Design Engineer

Seattle, WA · On-site

$200K - $280K/yr

Engineered to survive the harshest radiation environments and to fully capitalize on today's and ... Own package-level SI/PI strategy, including high-speed digital interfaces (e.g., SerDes, JESD ...

New

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

Engineered to survive the harshest radiation environments and to fully capitalize on today's and ... Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery ...

New

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

Engineered to survive the harshest radiation environments and to fully capitalize on today's and ... Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery ...

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All JobsSi Pi Engineer JobsSi Pi Engineer Jobs in Bothell, WA

Si Pi Engineer information

See Bothell, WA salary details

$40.8K

$119.9K

$153.7K

How much do si pi engineer jobs pay per year?

As of Jul 9, 2026, the average yearly pay for si pi engineer in Bothell, WA is $119,929.00, according to ZipRecruiter salary data. Most workers in this role earn between $98,900.00 and $152,000.00 per year, depending on experience, location, and employer.

What are Si Pi Engineers?

Si Pi Engineers, also known as Signal Integrity and Power Integrity Engineers, are professionals who specialize in ensuring that electronic systems, especially those involving high-speed signals and complex power delivery networks, function correctly and reliably. They analyze, design, and troubleshoot circuits to minimize signal degradation, interference, and power delivery issues in printed circuit boards (PCBs) and integrated circuits. Their work is critical in industries such as telecommunications, data centers, consumer electronics, and automotive electronics, where high-speed data transfer and stable power are essential.

What is the difference between Si Pi Engineer vs PCB Design Engineer?

AspectSi Pi EngineerPCB Design Engineer
CredentialsBachelor's in Electrical Engineering or related; certifications like IPC CID or IPC CID+Bachelor's in Electrical Engineering, Electronics, or related; certifications like IPC CID or IPC CID+
Work EnvironmentElectronics manufacturing, semiconductor, or embedded systems companiesElectronics design firms, manufacturing, or consulting companies
Industry UsageUsed in semiconductor, embedded systems, and IoT industriesCommon in consumer electronics, industrial equipment, and communication devices

Both Si Pi Engineers and PCB Design Engineers often hold similar credentials and work in electronics-related industries. However, Si Pi Engineers focus more on signal integrity and power integrity within integrated circuits, while PCB Design Engineers specialize in designing printed circuit boards. Understanding these distinctions helps clarify career paths and job expectations in electronics design and manufacturing.

What are some common challenges faced by Si Pi Engineers when collaborating with cross-functional teams?

Si Pi Engineers often work closely with hardware designers, PCB layout engineers, and system integrators to ensure signal and power integrity across complex electronic systems. A common challenge is effectively communicating technical requirements and constraints, as not all team members may have a deep understanding of SI/PI principles. Additionally, balancing performance, cost, and manufacturability while resolving issues such as crosstalk, noise, and voltage fluctuations can require creative problem-solving and strong teamwork. Regular design reviews and open communication channels help mitigate these challenges and lead to successful project outcomes.

What are the key skills and qualifications needed to thrive as a Si Pi Engineer, and why are they important?

To thrive as a Si Pi (Signal Integrity/Power Integrity) Engineer, a strong background in electrical engineering, circuit design, and high-speed signal analysis is essential, usually supported by a relevant engineering degree. Familiarity with simulation tools such as HyperLynx, Ansys SIwave, and Cadence, along with experience in PCB layout and measurement instruments like oscilloscopes and VNAs, is typically required. Analytical thinking, problem-solving, and effective communication are vital soft skills for collaborating across design and manufacturing teams. These competencies ensure reliable high-speed electronic systems, minimize signal loss, and prevent power distribution issues, which are critical for product performance and integrity.
What are popular job titles related to Si Pi Engineer jobs in Bothell, WA? For Si Pi Engineer jobs in Bothell, WA, the most frequently searched job titles are:
What job categories do people searching Si Pi Engineer jobs in Bothell, WA look for? The top searched job categories for Si Pi Engineer jobs in Bothell, WA are:
Si Pi Engineer jobs near you
Senior ASIC Package Design Engineer

Senior ASIC Package Design Engineer

K2 Space

Seattle, WA • On-site

$180K - $260K/yr

Other

Medical, Dental, Vision, Life, PTO

Posted 7 days ago

New

Job description

The Role 

We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role supports the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will collaborate with internal teams for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.  

Responsibilities 

  • Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
  • Establish package design standards, methodologies, and best practices.  
  • Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces. 
  • Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network (PDN) design, and decoupling strategy
  • Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling. 
  • Drive material selection, substrate technology choices, and assembly process optimization.  

Qualifications 

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies. 

Nice to Have

  • Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates). 
  • Background in high-speed digital or mixed-signal SoCs. 
  • Familiarity with aerospace, space, or high-reliability electronics. 

Compensation and Benefits:

  • Base salary range for this role is $180,000 - $260,000 + equity in the company
  • Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
  • Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks
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About K2 Space

Sourced by ZipRecruiter

Industry

Guided missile and space vehicle manufacturing

Company size

11 - 50 Employees

Headquarters location

Los Angeles, CA, US

Year founded

2022

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