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Semiconductor Process Integration Jobs in Dallas, TX

... process integration, solving the fundamental patterning and process challenges that determine ... We're committed to responsible, sustainable semiconductor manufacturing and to building a diverse ...

Collaborate with global build, verification, product engineering, test, probe, process integration ... As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and ...

EPI Process Support Engineer

Dallas, TX · On-site

$108K - $148K/yr

... semiconductor chips - the brains of devices we use every day. As the foundation of the global ... and integration requirements. * Checks and approves operational quality of system equipment.

... semiconductor chips - the brains of devices we use every day. As the foundation of the global ... and integration requirements. * Checks and approves operational quality of system equipment.

Semiconductor companies rely upon FormFactor's products and services to accelerate profitability by ... Collaborate on robotics integration, machine vision applications, equipment automation, and smart ...

The skill set you develop will be broad: interacting with design, test, and semiconductor process ... Experience with integrated circuit and device failure analysis * Programming skills for automation ...

Work with fabrication process engineering and integration teams to determine specifications. * Use ... TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded ...

Showing results 41-60

Semiconductor Process Integration information

See Dallas, TX salary details

$12

$29

$54

How much do semiconductor process integration jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for semiconductor process integration in Dallas, TX is $29.52, according to ZipRecruiter salary data. Most workers in this role earn between $21.63 and $36.15 per hour, depending on experience, location, and employer.

What are some common challenges faced by professionals in semiconductor process integration, and how can they be addressed?

Professionals in Semiconductor Process Integration often encounter challenges such as balancing yield improvement with aggressive production schedules, managing complex cross-functional communication, and troubleshooting process-related defects. These challenges can be addressed by developing strong problem-solving skills, maintaining clear communication with fabrication, design, and quality teams, and staying current with process technology advancements. Leveraging data analysis tools and fostering collaborative relationships across departments are also key to effectively overcoming integration hurdles.

What is semiconductor process integration?

Semiconductor process integration refers to the coordination and optimization of multiple manufacturing steps to create complex microelectronic devices, such as integrated circuits. Process integration engineers ensure that different fabrication processes—like lithography, etching, deposition, and doping—work together seamlessly to achieve high yield and device performance. They troubleshoot issues, develop new process flows, and collaborate with design and manufacturing teams to improve product reliability and efficiency. This role is critical in advancing semiconductor technology and scaling devices to smaller nodes.

What are the key skills and qualifications needed to thrive as a semiconductor process integration engineer, and why are they important?

To thrive as a Semiconductor Process Integration Engineer, you need a solid background in materials science, semiconductor physics, and device fabrication, often supported by a degree in electrical engineering, materials science, or a related field. Familiarity with semiconductor manufacturing tools (such as photolithography and etching equipment), statistical process control (SPC) software, and data analysis platforms is essential. Strong problem-solving abilities, attention to detail, and effective collaboration skills help you excel in cross-functional teams. These competencies are crucial for optimizing device performance, ensuring process reliability, and driving innovation in a highly technical and competitive industry.

What is the difference between Semiconductor Process Integration vs Semiconductor Process Engineer?

AspectSemiconductor Process IntegrationSemiconductor Process Engineer
Primary FocusDeveloping and optimizing manufacturing processes for semiconductor devices at the integration levelDesigning, implementing, and improving specific process steps within semiconductor fabrication
Work EnvironmentResearch labs, fabrication facilities, cross-disciplinary teamsManufacturing plants, process development labs
Required CredentialsBachelor’s or Master’s in Electrical Engineering, Materials Science, or related fields; experience in process developmentBachelor’s or Master’s in Engineering, Chemistry, or related fields; process optimization experience

Semiconductor Process Integration professionals focus on integrating multiple process steps to ensure overall device performance, while Semiconductor Process Engineers concentrate on developing and refining individual process steps. Both roles are essential in semiconductor manufacturing, often working closely within the same industry environment.

Infographic showing various Semiconductor Process Integration job openings in Dallas, TX as of August 2026, with employment types broken down into 1% As Needed, 78% Full Time, 16% Part Time, 4% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $61,408 per year, or $29.5 per hour.

Principal Research Scientist

Qorvo, Inc.

Richardson, TX • On-site

Full-time

Re-posted 29 days ago


Qorvo rating

8.3

Company rating: 8.3 out of 10

Based on 21 frontline employees who took The Breakroom Quiz


Job description

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.
Qorvo is seeking a Principal Research Scientist to serve as a principal investigator and key individual contributor leading the development of next-generation wafer-level interconnects (BEOL), wafer-level packaging (WLP) approaches, and heterogeneous integration technologies. The ideal candidate is a demonstrated leader with a track record of innovation, proposal development, and successful funding capture, as well as experience guiding small R&D teams to deliver focused, high-impact results. This role requires driving the creation of transformational, differentiated integrated circuit and packaging technologies that enable new product capabilities, accelerate technology adoption, and contribute directly to Qorvo's commercial success. The candidate will work closely with internal product teams, external partners, government sponsors, and senior leadership, to shape technology roadmaps and transition research concepts into manufacturable solutions.
Responsibilities:
  • Serve as a key individual contributor and technical leader driving next-generation wafer-level interconnect, BEOL, WLP, and heterogeneous integration research
  • Author and influence technology roadmaps aligned to long-term product and innovation strategies
  • Lead proposal development, technical shaping, capture, and execution of funded programs as Principal Investigator
  • Provide technical project leadership, including planning, execution, risk management, and milestone delivery
  • Drive hands-on process ideation, development, pathfinding, troubleshooting, and execution for wafer and wafer-level packaging technologies
  • Collaborate with and direct technicians, junior engineers, and process engineers to execute development activities efficiently
  • Communicate program status, technical results, and strategic recommendations to senior leadership, customers, and external stakeholders
  • Generate valuable intellectual property, including patents, invention disclosures, and proprietary process know-how
  • Mentor and develop junior engineers and researchers while fostering technical excellence across the team

Minimum Qualifications ("need-to-have"):
  • Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field
  • 5+ years of GaN RF transistor fabrication experience
  • 8+ years of hands-on semiconductor R&D experience in cleanroom fabrication environments
  • Demonstrated expertise in semiconductor BEOL processing and/or wafer-level packaging (WLP) technologies
  • Hands-on experience with advanced metallization, dielectric integration, and interconnect process development
  • Working knowledge of device and mask layout design, particularly for analog and RF applications
  • Proven ability to lead and guide small, multidisciplinary R&D teams
  • Strong written and verbal communication skills, including proposal development, technical reporting, and executive-level presentations

Preferred Qualifications ("nice-to-have"):
  • 3+ years of experience serving as a Principal Investigator, technical lead, or equivalent leader for advanced R&D programs
  • Experience leading or executing R&D programs sponsored by U.S. Government agencies such as DARPA, AFRL, or similar organizations
  • Expertise in advanced packaging and 3D heterogeneous integration (3DHI) technologies
  • Hands-on experience with semiconductor process modules such as lithography (stepper and/or e-beam), etch, metallization, CMP, and SEM/FIB analysis
  • Experience with wafer-level and chip-level integration processes, including wafer-to-wafer and die-to-wafer bonding, Cu-Cu hybrid bonding, wafer thinning, lap/grind, and TSV technologies
  • Experience with device processing and DC/RF characterization, including RF measurements such as S-parameters and load-pull
  • Familiarity with epitaxial design or close collaboration with epitaxy teams
  • Experience using data analytics and visualization tools such as Spotfire
  • Knowledge of device reliability testing, failure analysis, and root cause investigation

This position is not eligible for visa sponsorship by the Company.
This position requires work on US Government contracts. Applicants must be a US Person (US citizen, permanent resident, asylee or refugee).
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MAKE A DIFFERENCE AT QORVO
We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.
We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.

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