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Rf Module Design Engineer Jobs in Issaquah, WA (NOW HIRING)

Kymeta

Senior RF Antenna Engineer

Redmond, WA · On-site

$140K - $200K/yr

Description Senior RF Antenna Engineer Who We Are Kymeta revolutionizes satellite communications ... As a member of Kymeta's research and antenna design team, a successful candidate will apply skills ...

K2 Space

Principal ASIC Package Design Engineer

Seattle, WA · On-site

$200K - $280K/yr

... multi-chip module (MCM) solutions. This role owns the end-to-end package strategy for high ... Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.

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Utter Associates Inc

Senior Design Engineer

Seattle, WA · On-site

The Senior Design Engineer is a full-time position that performs systems engineering on a breadth ... including RF, streaming, and satellite · Knowledge of distributed communications systems · ...

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Protingent

RF Test Engineer

Redmond, WA · On-site

$65 - $95/hr

Collaborate with design engineers to provide feedback and improve RF hardware performance. * Maintain calibration records, test documentation, and compliance with quality standards. * Support ...

Actalent

Sr. Electrical Design Engineer IV

Kirkland, WA · Hybrid

$118K - $159K/yr

... circuitry and RF solutions. The position combines hands-on lab work, schematic and layout ... Perform board bring-up activities and execute test campaigns for modules and subsystems, including ...

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K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

... chip module (MCM) solutions. This role supports the end-to-end package strategy for high ... Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.

Apply Early

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

... chip module (MCM) solutions. This role supports the end-to-end package strategy for high ... Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces.

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All JobsRf Module Design Engineer JobsRf Module Design Engineer Jobs in Issaquah, WA

Rf Module Design Engineer information

See Issaquah, WA salary details

$83.6K

$149.9K

$195.5K

How much do rf module design engineer jobs pay per year?

As of Jul 6, 2026, the average yearly pay for rf module design engineer in Issaquah, WA is $149,931.00, according to ZipRecruiter salary data. Most workers in this role earn between $126,900.00 and $168,400.00 per year, depending on experience, location, and employer.

What does an RF Module Design Engineer do?

An RF Module Design Engineer specializes in designing, developing, and testing radio frequency (RF) modules used in a variety of wireless communication devices. They are responsible for creating circuit layouts, selecting components, and ensuring the modules meet performance, reliability, and regulatory standards. Their work often involves simulation, prototyping, and troubleshooting to optimize signal integrity and minimize interference. RF Module Design Engineers collaborate closely with hardware, software, and testing teams to integrate their modules into larger systems. This role is essential in industries such as telecommunications, aerospace, and consumer electronics.

What is the difference between Rf Module Design Engineer vs RF System Engineer?

AspectRf Module Design EngineerRF System Engineer
CredentialsBachelor's or Master's in Electrical Engineering, RF certificationsBachelor's or Master's in Electrical or RF Engineering, RF certifications
Work EnvironmentDesign labs, R&D departments, manufacturing facilitiesSystem integration labs, testing environments, R&D teams
Industry UsageWireless device manufacturing, telecom, consumer electronicsWireless networks, telecom infrastructure, system-level design

Both roles require strong RF engineering knowledge and similar educational backgrounds. The Rf Module Design Engineer focuses on designing and developing RF modules, while the RF System Engineer works on integrating RF components into complete systems. Understanding these differences helps in choosing the right career path or job search focus.

What are the key skills and qualifications needed to thrive as an RF Module Design Engineer, and why are they important?

To thrive as an RF Module Design Engineer, you need strong expertise in RF circuit design, electromagnetic theory, and a relevant engineering degree, such as electrical or electronics engineering. Familiarity with tools like ADS, HFSS, and network analyzers, plus knowledge of industry standards and certifications such as IPC, is highly valued. Attention to detail, problem-solving abilities, and effective communication are crucial soft skills for collaborating with cross-functional teams and troubleshooting complex issues. These competencies ensure the development of high-performance, reliable RF modules that meet stringent industry requirements.

What are some common challenges faced by RF Module Design Engineers during the product development cycle?

RF Module Design Engineers often encounter challenges such as minimizing interference and signal loss, ensuring compliance with international wireless standards, and integrating modules into compact device enclosures without sacrificing performance. Balancing trade-offs between power consumption, cost, and performance is also a frequent consideration. Collaboration with cross-functional teams, such as PCB layout engineers and system architects, is essential to address these challenges and deliver robust, manufacturable designs.
What are popular job titles related to Rf Module Design Engineer jobs in Issaquah, WA? For Rf Module Design Engineer jobs in Issaquah, WA, the most frequently searched job titles are:
Rf Module Design Engineer jobs near you
Senior ASIC Package Design Engineer

Senior ASIC Package Design Engineer

K2 Space

Seattle, WA

$180K - $260K/yr

Other

Medical, Dental, Vision, Life, PTO

Posted 4 days ago

Job description

The Role 

We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role supports the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will collaborate with internal teams for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.  

Responsibilities 

  • Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
  • Establish package design standards, methodologies, and best practices.  
  • Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.
  • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
  • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces. 
  • Support package-level SI/PI strategy, including high-speed digital interfaces, power delivery network (PDN) design, and decoupling strategy
  • Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling. 
  • Drive material selection, substrate technology choices, and assembly process optimization.  

Qualifications 

  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Experience working directly with OSATs and substrate vendors.
  • Knowledge of packaging qualification and test methodologies. 

Nice to Have

  • Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates). 
  • Background in high-speed digital or mixed-signal SoCs. 
  • Familiarity with aerospace, space, or high-reliability electronics. 

Compensation and Benefits:

  • Base salary range for this role is $180,000 - $260,000 + equity in the company
  • Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
  • Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks
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About K2 Space

Sourced by ZipRecruiter

Industry

Guided missile and space vehicle manufacturing

Company size

11 - 50 Employees

Headquarters location

Los Angeles, CA, US

Year founded

2022

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