... RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design ...
... RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design ...
... RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design ...
... RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design ...
Advanced Manufacturing, WMS (including RF-Smart), Field Service Management, CRM, and CPQ. * Design and build complex workflows using SuiteFlow and custom SuiteScript (User Events, Scheduled Scripts ...
Advanced Manufacturing, WMS (including RF-Smart), Field Service Management, CRM, and CPQ. * Design and build complex workflows using SuiteFlow and custom SuiteScript (User Events, Scheduled Scripts ...
Senior Test Engineer
Appleton, WI ยท On-site
... design packages. * Demonstrated knowledge of basic manufacturing and assembly processes together with work measurement and work standards. * Knowledge of analog, digital, and RF circuits, PCB ...
Senior Test Engineer
Appleton, WI ยท On-site
... design packages. * Demonstrated knowledge of basic manufacturing and assembly processes together with work measurement and work standards. * Knowledge of analog, digital, and RF circuits, PCB ...
Senior Test Engineer
Appleton, WI ยท On-site
... design packages. * Demonstrated knowledge of basic manufacturing and assembly processes together with work measurement and work standards. * Knowledge of analog, digital, and RF circuits, PCB ...
Senior Test Engineer
Appleton, WI ยท On-site
... design packages. * Demonstrated knowledge of basic manufacturing and assembly processes together with work measurement and work standards. * Knowledge of analog, digital, and RF circuits, PCB ...
Sr Electrical Engineer - RF/IoT
Brookfield, WI ยท On-site
$101K - $132K/yr
We continue to invest in electrical engineeringresources to design and develop leadership in electronic capabilities; something unique within the industry. And we're pushing the limits in ...
Sr Electrical Engineer - RF/IoT
Brookfield, WI ยท On-site
$101K - $132K/yr
We continue to invest in electrical engineeringresources to design and develop leadership in electronic capabilities; something unique within the industry. And we're pushing the limits in ...
Sr Electrical Engineer - RF/IoT
Brookfield, WI ยท On-site
$101K - $132K/yr
We continue to invest in electrical engineering resources to design and develop leadership in electronic capabilities; something unique within the industry. And we're pushing the limits in firmware ...
Sr Electrical Engineer - RF/IoT
Brookfield, WI ยท On-site
$101K - $132K/yr
We continue to invest in electrical engineering resources to design and develop leadership in electronic capabilities; something unique within the industry. And we're pushing the limits in firmware ...
Senior Hardware Network Fabric Development Engineer
Chippewa Falls, WI ยท On-site
$100K - $138K/yr
RF and microwave design experience preferred. * Experience with 3D modeling tools such as HFSS highly preferred. Knowledge and Skills * Experience using electrical design tools and software packages ...
Senior Hardware Network Fabric Development Engineer
Chippewa Falls, WI ยท On-site
$100K - $138K/yr
RF and microwave design experience preferred. * Experience with 3D modeling tools such as HFSS highly preferred. Knowledge and Skills * Experience using electrical design tools and software packages ...
... the design of future axisymmetric mirror device at Realta Fusion called Hammir. This role will ... Familiarity with Fokker-Planck, particle-in-cell (PIC) and RF heating simulation tools, such as ...
Quick apply
... the design of future axisymmetric mirror device at Realta Fusion called Hammir. This role will ... Familiarity with Fokker-Planck, particle-in-cell (PIC) and RF heating simulation tools, such as ...
... the design of future axisymmetric mirror device at Realta Fusion called Hammir. This role will ... Familiarity with Fokker-Planck, particle-in-cell (PIC) and RF heating simulation tools, such as ...
... the design of future axisymmetric mirror device at Realta Fusion called Hammir. This role will ... Familiarity with Fokker-Planck, particle-in-cell (PIC) and RF heating simulation tools, such as ...
... the design of future axisymmetric mirror device at Realta Fusion called Hammir. This role will ... Familiarity with Fokker-Planck, particle-in-cell (PIC) and RF heating simulation tools, such as ...
... the design of future axisymmetric mirror device at Realta Fusion called Hammir. This role will ... Familiarity with Fokker-Planck, particle-in-cell (PIC) and RF heating simulation tools, such as ...
Integration (Process Validation) Engineer
Trevor, WI ยท On-site
$70K - $85K/yr
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
Integration (Process Validation) Engineer
Trevor, WI ยท On-site
$70K - $85K/yr
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
Integration (Process Validation) Engineer
Trevor, WI ยท On-site
$70K - $85K/yr
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
Quick apply
Integration (Process Validation) Engineer
Trevor, WI ยท On-site
$70K - $85K/yr
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
Senior Engineer, Embedded Software
Menomonee Falls, WI ยท On-site
$124K - $163K/yr
Experience with control systems design and implementation is preferred. * Experience with RF communications hardware and software is preferred. * Working knowledge of electronic circuits and an ...
Senior Engineer, Embedded Software
Menomonee Falls, WI ยท On-site
$124K - $163K/yr
Experience with control systems design and implementation is preferred. * Experience with RF communications hardware and software is preferred. * Working knowledge of electronic circuits and an ...
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... RF welding, heat sealing, pouch manufacturing, printing, and labeling operations. โข Perform ...
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... RF welding, heat sealing, pouch manufacturing, printing, and labeling operations. โข Perform ...
Integration (Process Validation) Engineer
$70K - $85K/yr
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
Quick apply
Integration (Process Validation) Engineer
$70K - $85K/yr
The engineer will work cross-functionally with Operations, Quality, Design Engineering, and ... Lead validation activities for flexible film converting, RF welding, heat sealing, pouch ...
Process Engineer
Chippewa Falls, WI ยท On-site
... RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering ...
Process Engineer
Chippewa Falls, WI ยท On-site
... RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering ...
Rf Design information
See Wisconsin salary details
$73.2K - $82.1K
1% of jobs
$82.1K - $91K
3% of jobs
$91K - $99.9K
5% of jobs
$99.9K - $108.8K
12% of jobs
$111.4K is the 25th percentile. Wages below this are outliers.
$108.8K - $117.7K
13% of jobs
$117.7K - $126.6K
14% of jobs
The median wage is $127.8K / yr.
$126.6K - $135.5K
16% of jobs
$144K is the 75th percentile. Wages above this are outliers.
$135.5K - $144.4K
12% of jobs
$144.4K - $153.3K
11% of jobs
$153.3K - $162.2K
11% of jobs
$162.2K - $171.1K
3% of jobs
$73.2K
$131.2K
$171.1K
How much do rf design jobs pay per year?
What is the difference between Rf Design vs RF Engineer?
| Aspect | Rf Design | RF Engineer |
|---|---|---|
| Credentials | Typically requires a degree in electrical engineering or related field, with specialized knowledge in RF design | Requires similar degrees, often with additional certifications in RF or wireless technology |
| Work Environment | Focuses on designing RF circuits and systems, often in labs or design offices | Involves testing, troubleshooting, and deploying RF systems, often in field or lab settings |
| Industry Usage | Primarily in product development, telecommunications, and wireless device manufacturing | Used across telecommunications, aerospace, defense, and wireless service providers |
Rf Design and RF Engineer roles share significant overlap in credentials and industry usage. Rf Design focuses on creating RF circuits and systems, while RF Engineers often handle testing, deployment, and troubleshooting. Both roles are essential in wireless technology development and deployment, with the main difference being the focus on design versus implementation.
Is RF design in demand?
What is an RF design engineer?

R&D Process Development Engineer
Eau Claire, WI โข On-site
Full-time
Medical, Dental, Vision, Life, Retirement, PTO
Re-posted 15 days ago
Job description
About TTM
TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency ("RF") components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards ("PCB"s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market.
Additional information can be found at www.ttm.com
TTM Technologies is a leading manufacturer of high-reliability printed circuit boards serving the aerospace, defense, medical device, telecommunications, automotive, and industrial electronics markets. Our manufacturing capabilities span rigid, flex, rigid-flex, HDI, RF/microwave, and advanced multilayer constructions. We are committed to pushing the boundaries of PCB technology through disciplined process development, continuous improvement, and an unwavering dedication to quality and customer satisfaction.
POSITION SUMMARY
The R&D Process Development Engineer is a highly technical individual contributor responsible for developing, characterizing, optimizing, and scaling advanced manufacturing processes associated with Semi-Additive Plating (SAP) build up technology. Familiarity with Semi-Conductor or Fan-Out Wafer Level Packaging FOWLP process techniques is a plus as line and space characteristics are approaching historic Integrated Circuit sizes. Need for R&D engineering across four critical PCB fabrication disciplines: Mechanical Processing, Lithography, Electroplating, and Etching. This role sits at the intersection of materials science, chemistry, precision engineering, and manufacturing - requiring both deep scientific rigor and practical manufacturing instincts.
This individual is expected to be the recognized technical authority within their focus areas - able to think outside of the standard and come up with solutions to complex problems, evaluate and set up new equipment and derive processes around those tools to achieve intended results.
This role requires someone equally comfortable running-controlled experiments in a laboratory and developing processes on small scale production manufacturing equipment- someone who bridges the gap between science and production with clarity, confidence, and technical credibility.
KEY RESPONSIBILITIES
Semi-Additive (SAP) Build-up Process Development Equipment definition, purchase, setup and qualification for R&D. Develop technology that can be scaled to provide solutions to customers across TTM's markets.
REQUIRED QUALIFICATIONS
Education
- Required: Bachelor of Science in Chemical Engineering, Materials Science, Chemistry, Mechanical Engineering, or closely related discipline.
- Preferred: Master or PhD of Science in Chemical Engineering, Materials Science, or Electrical Engineering with a focus on electronic materials or manufacturing.
Experience
- Required: 3-8 years of hands-on process engineering experience in PCB manufacturing, or a closely related wet chemistry/precision manufacturing environment.
- Required: Direct, hands-on experience with at least two of the four focus areas: Mechanical, Lithography, Electroplating, or Etching.
- Preferred: Experience in semiconductor fab or FOWLP,
Technical Knowledge
- SAP: Fundamentals of SAP Build up or FOWLP technology including hands on experience.
- General: SPC, Design of Experiments (DoE), Cpk/Ppk analysis, failure analysis methodologies (SEM/EDS, optical microscopy, ICP-MS, XRF, FTIR), IPC standards (IPC-A-600, IPC-6012, IPC-TM-650, IPC-4552), ERP/MES systems, CAM software (Genesis, CAM350), SEMI Standards.
WORK ENVIRONMENT
- Primary Setting: PCB manufacturing facility - process engineering laboratory and production floor.
- Chemical Exposure: Regular work with hazardous chemicals including strong acids (HโSOโ, HCl, HNOโ, HF), alkalis, copper sulfate, formaldehyde, photoresist chemicals, etchants, and plating bath additives.
- PPE Required: Chemical-resistant gloves, safety glasses/face shield, lab coat, acid-resistant apron, and additional PPE as required by SDS and EHS protocols.
- Physical Requirements: Ability to stand for extended periods; lift and carry up to 35 lbs; visual acuity for microscopic examination and precision measurement.
- Travel: Occasional travel to customer sites, equipment vendors, chemical suppliers, and industry conferences (10-20%).
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Compensation and Benefits:
TTM offers a variety of health and well-being benefit programs. Benefit options include medical, dental, vision, 401K, Flexible Spending Account, Health Savings Account, accident benefits, life insurance, disability benefits, paid vacation & holidays. Benefits are available 1st of the month following date of hire.
Compensation for roles at TTM Technologies varies depending on a wide array of factors including but not limited to the specific office location, role, skill set and level of experience. As required by local law, TTM provides a reasonable range of compensation for roles that may be hired in New York, California and Colorado. For California-based roles, compensation ranges are based upon specific physical locations.
Export Statement:
Must comply with TTM Export Control Policies and Procedures and all applicable laws including ITAR, EAR and OFAC including but not limited to: a) being able to identify ITAR product on the manufacturing floor and understand that access to these products and related technical data is restricted to only US Citizens and US Permanent Residents; b) recognition of Foreign Person visitors by badge differentiation; c) understand and follow authorization procedures for bringing foreign visitors into facilities (VAL); d) understand the Export and ITAR requirements for shipments leaving the US; e) manage vendor approvals for ITAR manufacturing and services.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.