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Remote Asic Design Jobs in Rosemount, MN (NOW HIRING)

Remote Asic Design information

See Rosemount, MN salary details

$96.1K

$153.6K

$206.5K

How much do remote asic design jobs pay per year?

As of Aug 8, 2026, the average yearly pay for remote asic design in Rosemount, MN is $153,559.00, according to ZipRecruiter salary data. Most workers in this role earn between $134,400.00 and $184,000.00 per year, depending on experience, location, and employer.

How does working remotely as an ASIC design engineer affect collaboration and project workflow?

As a remote ASIC Design Engineer, collaboration typically relies heavily on digital communication tools such as Slack, Zoom, and project management platforms. While core design work is often done independently, frequent coordination with verification engineers, layout teams, and project managers is crucial to ensure alignment on specifications and progress. Teams usually hold regular virtual meetings and design reviews to discuss challenges, troubleshoot issues, and synchronize on project milestones. Adapting to clear documentation and proactive communication helps maintain smooth workflow and minimizes the impact of physical distance.

What is a remote ASIC design engineer?

A Remote ASIC Design engineer is a professional who specializes in designing application-specific integrated circuits (ASICs) while working from a location outside of a traditional office environment. These engineers use specialized software tools to develop, simulate, and verify custom hardware chips that meet specific client or project requirements. Remote work in this field requires strong communication skills, the ability to collaborate with global teams, and expertise in digital or analog circuit design. The role often involves tasks such as RTL coding, timing analysis, and working closely with verification and fabrication teams.

What are the key skills and qualifications needed to thrive as a remote ASIC design engineer?

To thrive as a Remote ASIC Design Engineer, you need a strong background in digital design principles, hardware description languages (HDLs) like Verilog or VHDL, and a relevant engineering degree. Proficiency with EDA tools such as Synopsys, Cadence, and simulation software, along with experience in version control systems, is typically required. Excellent problem-solving skills, attention to detail, and effective remote communication are crucial soft skills for collaborating with distributed teams. These abilities ensure accurate, efficient ASIC development and seamless integration within global engineering projects.

What is the difference between Remote Asic Design vs Remote FPGA Design?

AspectRemote Asic DesignRemote FPGA Design
Required CredentialsBachelor's/Master's in Electrical Engineering or Computer Engineering, experience with ASIC toolsBachelor's/Master's in Electrical Engineering or related field, FPGA development experience
Work EnvironmentDesigning custom integrated circuits for manufacturingDeveloping programmable logic devices for prototyping and specific applications
Industry UsageSemiconductors, consumer electronics, automotivePrototyping, testing, and specialized hardware solutions
Common Search/ComparisonYesYes

Remote Asic Design and Remote FPGA Design share similar credentials and work environments, both involving digital hardware development. However, ASIC design focuses on creating custom chips for mass production, while FPGA design emphasizes programmable hardware for flexible applications. Understanding these differences helps professionals choose the right career path or project focus within the hardware design industry.

What job categories do people searching Remote Asic Design jobs in Rosemount, MN look for? The top searched job categories for Remote Asic Design jobs in Rosemount, MN are:
Infographic showing various Remote Asic Design job openings in Rosemount, MN as of June 2026, with employment types broken down into 95% Full Time, 1% Part Time, and 4% Contract. Highlights an 35% Physical, 3% Hybrid, and 62% Remote job distribution, with an average salary of $153,559 per year, or $73.8 per hour.

Thermal Imaging Platform Architect

skywater

Minneapolis, MN • On-site, Remote

Full-time

Posted 2 days ago

New


Job description

Position Summary:

The Thermal Imaging Technology Platform Architect is an enterprise technical leader responsible for connecting customer system requirements, market opportunities, and technology platform capabilities in thermal imaging. Blending deep engineering expertise with business strategy, this role serves as the primary technical interface for customers and ecosystem partners during opportunity development, technology definition, and platform adoption activities. Working closely with Business Unit leadership, Platform Managers, Sales, and Technology Development teams, the Technology Platform Architect translates customer and market requirements into actionable development priorities and solutions. The role combines technical leadership, customer engagement, and market insight to ensure SkyWater technologies remain aligned with evolving customer needs and emerging market opportunities. This opportunity can be a remote or hybrid position.

Major Areas of Accountability:

  • Lead technical discoveries with customers and ecosystem partners and assess solution fit. 
  • Define solution architectures and translate requirements into scopes of work.
  • Drive internal scoping, prioritization, and opportunity reviews.
  • Lead enterprise-level customer system  understanding and  technology tradeoffs across the entire Thermal Imaging platform.
  • Support platform strategy with customer and market insights.
  • Produce technical content and reference architecture for sales, marketing, and onboarding including white papers and conference presentations.
  • Serve as the primary technical interface from concept to project kickoff
  • Demonstrate SkyWater capabilities, support key customer technical issue resolutions, and advance opportunities
  • Build strong customer relationships to position SkyWater as a trusted partner.
  • Collaborate with sales, engineering, and business teams to align solutions.
  • Lead creation of proposals and SOWs aligned with customer and business goals.

Required Qualifications:

  • Education: BS required in Engineering, Physics or Material Science.
  • 8-12 years plus of progressive experience in field applications, design, or process development/integration within the semiconductor industry preferably in foundries.
  • Required experience in Analog, Mixed Signal, ASIC design, ideally with 90nm and 130nm CMOS nodes technologies, demonstrating a deep understanding of the challenges and opportunities these older technologies present.
  • Demonstrated impact on platform revenue.
  • Led multiple development programs from concept through qualification.
  • Deep domain expertise in assigned platform or market including a strong understanding of semiconductor technology development and commercialization.
  • Able to lead customer and industry discussions uncovering system level requirements via technical discovery workshops, document results, and turn into requirements to support technology development.
  • Ability to translate ambiguous customer needs into structured project requirements.
  • Strong customer-facing communication skills.
  • Travel Requirements: 25%.
  • Working knowledge/experience with Cadence Tool set for PDKs, layout, DRCs.
  • Analog & Mixed Signal IC design experience (in addition to reference to ASIC design).
  • Experience working with 3rd party partners: Tool vendors, Design Partners, IP provider.
  • US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
 

Preferred Qualifications:

  • Education. MS preferred. Engineering, physics, material science.
  • 5+ years in system architecture or product design in assigned area.
  • Working knowledge/experience with Cadence Tool set for PDKs, layout, DRCs.
  • Analog & Mixed Signal IC design experience (in addition to reference to ASIC design).
  • Experience working with 3rd party partners: Tool vendors, Design Partners, and IP providers.
  • Participation in industry groups and ability to present to Executive level.
  • Platform or Product Launch Experience.
  • Regulated/Defense.