Process Integration Engineer Jobs in Portland, OR

Job Description

As a Module Development Engineer, you will be at the forefront of Intel's semiconductor manufacturing innovation, driving the design and development of advanced manufacturing processes and enabling technologies. Your contributions will shape Intel's ability to deliver cutting-edge devices, enhance production efficiency, and influence the future of semiconductor technology. In this role, you will collaborate with world-class teams and industry-leading suppliers to pioneer materials, equipment, and process integration strategies that push the boundaries of technological possibilities. By joining Intel, you will have the opportunity to make a profound impact on our technology roadmap and help maintain Intel's leadership in a dynamic and competitive marketplace.
Key Responsibilities:

• Develop and optimize advanced manufacturing processes including material selection, parameter adjustments, equipment metrology, and system design
• Conduct feasibility studies and pathfinding activities to support innovative device architectures and manufacturing roadmaps
• Design and implement modifications to operating equipment to improve efficiency and production output
• Collaborate with equipment and material suppliers to establish enabling technology solutions and integrate them into manufacturing processes
• Perform process technology feasibility studies using theoretical simulations and practical engineering methods
• Stay informed on industry trends and technological advancements to align manufacturing processes with evolving semiconductor needs
• Drive the development of cost-sensitive technology roadmaps in partnership with vendors and internal stakeholders

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

• PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field with at least 6+ months relevant experience

Relevant experience includes, but is not limited to:

• Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materials
• Experience with experimental design, data collection, and statistical analysis
• Ability to analyze process results and clearly document findings in technical reports and presentations
• Strong problem solving skills and ability to work independently while collaborating in cross functional teams
• Effective written and verbal communication skills in a technical environment
• Willingness to work in a fab or lab environment and follow strict safety and contamination control protocols

Preferred Qualifications:

• PhD research focus specifically related to plasma etch, pattern transfer, or advanced logic/memory process integration
• Hands on experience with production or pilot line dry etch tools (e.g., Lam, Applied Materials, TEL, ASM, Hitachi)
• Knowledge of advanced node challenges such as high aspect ratio etching, CD control, etch selectivity, and damage mitigation
• Experience with Design of Experiments (DOE) and statistical process control (SPC)
• Familiarity with process integration, yield learning, or technology development methodologies
• Programming or scripting experience for data analysis or automation (e.g., Python, MATLAB, JMP, or similar tools)
• Exposure to foundry or industrial semiconductor Research and Development environments through internships, collaborations, or joint research programs
• Ability to manage multiple experiments or development tasks in a fast paced, manufacturing driven Research and Development setting
• Demonstrated interest in transitioning academic research into high volume manufacturing solutions
• Hands on research experience with dry etch-related topics (e.g., plasma etching, RIE, ICP, ALE) through academic research, dissertation work, or internships
• Working understanding of semiconductor manufacturing process flows and device structures
• Familiarity with common semiconductor characterization techniques (e.g., SEM, TEM, AFM, XPS, ellipsometry)

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experienceWorking ModelThis role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.