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Process Integration Device Engineer Jobs in Texas

Staff R&D Device Engineer

Austin, TX ยท On-site

$150K - $210K/yr

About the role As an Staff R&D Device Engineer at Fab2, you are the vital link bridging process development, electrical test, and integration. You will define initial transistor architectures and ...

Staff R&D Device Engineer

Austin, TX ยท On-site

$150K - $210K/yr

About the role As an Staff R&D Device Engineer at Fab2, you are the vital link bridging process development, electrical test, and integration. You will define initial transistor architectures and ...

Texas Instruments is seeking a process development / integration engineering intern within the ... We work to define and develop the next generation process and device technologies for TI; driving ...

Senior Deposition Process Engineer

Austin, TX ยท On-site

$103K - $133K/yr

Support process integration across the G2 solar cell fab, working closely with equipment ... Partner with cross-functional teams including device engineering, materials, and operations to meet ...

Showing results 41-60

Process Integration Device Engineer information

What is the difference between Process Integration Device Engineer vs Process Development Engineer?

AspectProcess Integration Device EngineerProcess Development Engineer
Primary FocusIntegrating semiconductor fabrication processes to improve device performance and yieldDeveloping and optimizing manufacturing processes for new or existing semiconductor devices
Skills & CertificationsKnowledge of CMOS fabrication, process control, and metrology; often requires a degree in electrical engineering or materials scienceExpertise in process engineering, materials, and device physics; similar educational background
Work EnvironmentCleanroom environments within semiconductor fabs, collaborating with process and design teamsResearch labs or manufacturing facilities focusing on process innovation and scaling

Process Integration Device Engineers focus on seamlessly combining fabrication steps to enhance device performance, while Process Development Engineers concentrate on creating and refining manufacturing processes. Both roles require similar technical skills and often work closely within semiconductor manufacturing environments.

What does a Process Integration Device Engineer do?

A Process Integration Device Engineer designs and develops manufacturing processes for semiconductor devices, focusing on integrating various process steps to improve device performance and yield. They work with tools like lithography, etching, and deposition equipment, often using simulation software and maintaining process documentation to ensure quality and efficiency in chip fabrication.
Infographic showing various Process Integration Device Engineer job openings in Texas as of August 2026, with employment types broken down into 1% As Needed, 82% Full Time, 13% Part Time, 3% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution.

FAB Device Engineer Intern - Summer 2027

Austin, TX โ€ข On-site

$16.50 - $21.50/hr

Full-time

Posted 5 days ago


Job description

NXP's Technology & Operations organization plays an essential role in the company's success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers.

Job Summary:
  • Primary responsibilities include functional yield enhancement (wafer probe), maintaining and improving parametric process control, developing integration changes to reduce cost or enhance device functionality.

  • Should have demonstrated abilities to work independently and work within a team-based project environment. Should have keen interest in problem-solving using electrical testing, physical analyses, and statistical data analyses.

  • Specific projects may include a facet of integration development or integration optimization.


Job Qualifications:
  • Working toward an Electrical engineering degree is required or in another technical field with related experience (Chemical engineering, Materials science).

  • Classroom and/or lab familiarity with some of the following: device parametric extraction methods, discrete device operation (MOS, BJT), microfabrication and unit process integration concepts, key statistical analysis and control concepts, materials analysis techniques, materials metrology operation and techniques.

  • Preferable would be previous educational, research, or industrial experience (co-op or internship) applying Solid State Physics, Electrical Engineering, Electronic Materials principles to microelectronics-related tasks.

  • Experience in JMP, PROMIS, SQL,LabView orbench probe characterizationis a plus.

In order to be considered for a summer internship with NXP you must be returning to school or graduating at the conclusion of the internship term. If you are graduating prior to July 2027 please apply to Entry Level full-time roles.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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