Process Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Development Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Development Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
As a Senior Engineer, Field Process, you will help expand ASM's advanced film technologies at our ... using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors. * Demonstrated ...
As a Senior Engineer, Field Process, you will help expand ASM's advanced film technologies at our ... using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors. * Demonstrated ...
Process Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Engineer 5
Tualatin, OR · On-site
The group you'll be a part of The Office of the CTO is where innovation takes center stage. We ... Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively ...
Process Engineer 5
Tualatin, OR · On-site
The group you'll be a part of The Office of the CTO is where innovation takes center stage. We ... Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively ...
Process Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Development Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Development Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Advanced Packaging Engineer
Portland, OR · On-site
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Advanced Packaging Engineer
Portland, OR · On-site
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Advanced Packaging Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Advanced Packaging Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Development Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Process Development Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Advanced Packaging Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Advanced Packaging Engineer
$148K - $209K/yr
... technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging ...
Module Development Engineer
Hillsboro, OR · On-site
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
Hillsboro, OR · On-site
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
Hillsboro, OR · On-site
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
Hillsboro, OR · On-site
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
$201K - $284K/yr
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
$201K - $284K/yr
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
$201K - $284K/yr
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
$201K - $284K/yr
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
$201K - $284K/yr
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
$201K - $284K/yr
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
$201K - $284K/yr
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Module Development Engineer
$201K - $284K/yr
Deep experience with advanced etch technologies, such as: High aspect ratio plasma etch (HARC); Atomic Layer Etch (ALE), EUV patterned layer etch integration; Radical and Vapor phase isotropic ...
Substantial technical background in dry etch for advanced CMOS technologies, including plasma chemistry, conductor or dielectric etch, pattern transfer, spacer etch, hard mask open, or atomic layer ...
Substantial technical background in dry etch for advanced CMOS technologies, including plasma chemistry, conductor or dielectric etch, pattern transfer, spacer etch, hard mask open, or atomic layer ...
Substantial technical background in dry etch for advanced CMOS technologies, including plasma chemistry, conductor or dielectric etch, pattern transfer, spacer etch, hard mask open, or atomic layer ...
Substantial technical background in dry etch for advanced CMOS technologies, including plasma chemistry, conductor or dielectric etch, pattern transfer, spacer etch, hard mask open, or atomic layer ...
Module Development Engineer
Hillsboro, OR · On-site
Perform process technology feasibility studies using theoretical simulations and practical ... Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor ...
Module Development Engineer
Hillsboro, OR · On-site
Perform process technology feasibility studies using theoretical simulations and practical ... Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor ...
Plasma Tech information
What are the key skills and qualifications needed to thrive as a plasma tech?
To thrive as a Plasma Tech, you need a solid understanding of phlebotomy, plasma collection procedures, and relevant safety protocols, typically backed by completion of a medical technician program or certification. Familiarity with automated plasmapheresis machines, donor management systems, and quality control equipment is crucial. Excellent attention to detail, communication skills, and the ability to remain calm under pressure help ensure a positive donor experience. These skills are essential for maintaining donor safety, ensuring regulatory compliance, and supporting efficient plasma collection operations.
What are some common challenges faced by plasma techs when working with plasma equipment, and how can they be addressed?
Plasma Techs often encounter challenges such as maintaining strict safety protocols, troubleshooting equipment malfunctions, and ensuring precision in plasma generation and application. Adhering to detailed operating procedures, staying up to date with ongoing training, and collaborating closely with engineers and maintenance teams can help address these issues. Additionally, regular calibration and preventive maintenance are key to minimizing downtime and ensuring reliable results in the lab or production environment.
What is the difference between Plasma Tech vs Medical Equipment Technician?
| Aspect | Plasma Tech | Medical Equipment Technician |
|---|---|---|
| Certifications | Often requires specialized training in plasma systems | Requires certifications in medical equipment repair and maintenance |
| Work Environment | Industrial or research labs, manufacturing facilities | Hospitals, clinics, healthcare facilities |
| Industry Usage | Plasma technology, manufacturing, research | Healthcare, medical device maintenance |
While both roles involve technical skills, Plasma Tech focuses on plasma systems used in industrial or research settings, whereas Medical Equipment Technicians specialize in maintaining medical devices in healthcare environments. The certifications and work environments differ, but both require technical expertise and safety knowledge.
How long does it take to become a plasma technician?
Becoming a plasma technician typically requires completing a post-secondary program in medical technology or a related field, which can take from several months to two years. Additionally, on-the-job training and certification in blood bank procedures or plasma processing are often necessary before fully qualifying for the role.
What are popular job titles related to Plasma Tech jobs in Oregon?
For Plasma Tech jobs in Oregon, the most frequently searched job titles are:
What job categories do people searching Plasma Tech jobs in Oregon look for?
The top searched job categories for Plasma Tech jobs in Oregon are:
$148K - $209K/yr
Full-time
Medical, Retirement, PTO
Posted 23 days ago
Intel rating
8.7
Based on 147 frontline employees who took The Breakroom Quiz
19th of 157 rated electronics manufacturers
Job description
Job Description
Qualifications
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.
Key Responsibilities
- Develop and optimize plasma etch processes for advanced packaging applications
- Design experiments (DOE) to characterize process windows and optimize etch performance
- Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
- Partner with equipment suppliers to design, test, and implement innovative process solutions.
- Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
- Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
- Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.
Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates
Minimum Qualifications
- Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
- Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
Experience listed above should be a combination of the following:
- Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
- Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.
- Experience with plasma etch equipment platforms
Preferred Qualifications
- Experience in wafer-level assembly, advanced packaging, or related technologies.
- Demonstrated success in leading programs from initial strategy development through high-volume production.
- Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
- Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.
Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology. Join us to help shape the future of innovation. Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $148,100.00-$209,100.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
About Intel
Sourced by ZipRecruiter
Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
Industry
Manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US
Year founded
1968