ZipRecruiter

Log In

1

Photonics Packaging Integration Jobs (NOW HIRING)

Cspeed

Packaging Integration Engineer

Palo Alto, CA · On-site

Collaborate with cross-functional teams including of silicon photonics, IC design, layout, test and reliability to drive the package/integration forward Work with external foundries and OSAT's on ...

Cspeed

Packaging Integration Engineer

Palo Alto, CA · On-site

... photonics, IC design, layout, test and reliability to drive the package/integration forward • Work with external foundries and OSAT's on process integration and packaging for interposer Expertise ...

next page

Showing results 1-20

All JobsPhotonics Packaging Integration Jobs

Photonics Packaging Integration information

See salary details

$33K

$91.6K

$143.5K

How much do photonics packaging integration jobs pay per year?

As of Jun 11, 2026, the average yearly pay for photonics packaging integration in the United States is $91,617.00, according to ZipRecruiter salary data. Most workers in this role earn between $63,500.00 and $121,000.00 per year, depending on experience, location, and employer.

What is Photonics Packaging Integration?

Photonics Packaging Integration refers to the process of assembling and integrating photonic components—such as lasers, modulators, and detectors—into a single, functional package. This field combines aspects of optical engineering, materials science, and manufacturing to ensure that photonic devices are protected, aligned, and connected for optimal performance. Proper packaging is essential to protect sensitive optical elements from environmental factors and to maintain precise alignment for efficient signal transmission. The integration process also involves electrical and thermal management to ensure reliability and scalability in applications like telecommunications, data centers, and sensing.

What are the key skills and qualifications needed to thrive as a Photonics Packaging Integration Engineer, and why are they important?

To excel in Photonics Packaging Integration, a strong background in optics, photonics, materials science, and hands-on experience with microfabrication processes is essential, usually supported by a degree in physics, electrical engineering, or a related field. Familiarity with CAD tools, optical simulation software, cleanroom procedures, and industry standards like ISO 9001 is typically required. Strong problem-solving abilities, attention to detail, and effective teamwork and communication skills help professionals navigate complex integration challenges. These competencies ensure reliable, high-performance photonic devices and successful collaboration across multidisciplinary engineering teams.

What is the difference between Photonics Packaging Integration vs Photonics Test Engineer?

AspectPhotonics Packaging IntegrationPhotonics Test Engineer
CredentialsBachelor's or Master's in Optical Engineering, Electrical Engineering, or related fieldsBachelor's or Master's in Electrical, Optical, or Photonics Engineering
Work EnvironmentDesign labs, cleanrooms, manufacturing facilitiesTesting labs, R&D centers, production environments
Industry UsageDeveloping and assembling photonic devices and modulesTesting and validating photonic components and systems

Photonics Packaging Integration focuses on designing and assembling photonic devices, while Photonics Test Engineers specialize in testing and validating these devices. Both roles require similar educational backgrounds and often work in overlapping environments within the photonics industry, but their core responsibilities differ in design versus testing.

What are some common challenges faced in Photonics Packaging Integration, and how can I prepare for them?

One of the main challenges in Photonics Packaging Integration is managing the alignment and coupling of optical components, which often requires high precision and specialized equipment. Additionally, ensuring thermal management and reliability under various operating conditions can be complex due to the sensitivity of photonic devices. To prepare, familiarize yourself with cleanroom protocols, advanced bonding techniques, and simulation tools used for design and analysis. Gaining hands-on experience through internships or academic labs can also help you build the practical skills needed to thrive in this field.
Infographic showing various Photonics Packaging Integration job openings in the United States as of June 2026, with employment types broken down into 1% As Needed, 87% Full Time, and 12% Part Time. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $91,617 per year, or $44 per hour.
PMTS Silicon Photonics Packaging Integration

PMTS Silicon Photonics Packaging Integration

GlobalFoundries

Essex Junction, VT • On-site

$131K - $241K/yr

Full-time

Posted 28 days ago

GlobalFoundries rating

8.2

Company rating: 8.2 out of 10

Based on 34 frontline employees who took The Breakroom Quiz

80th of 518 rated manufacturers

Job description

About GlobalFoundries:
  • GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:
As a Photonic Packaging Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.
Essential Responsibilities:
  • Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.

  • Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.

  • Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).

  • Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.

  • Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.

  • Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.

  • Support cost modeling and drive package cost reduction initiatives aligned with GF's B2B supply chain strategy.

  • Present technical updates and roadmaps to internal stakeholders and external partners.

Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications:
  • Master's degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.

  • 15+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.

  • Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.

  • Familiarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.

  • Understanding of reliability standards and qualification methodologies for optical modules.

  • Excellent analytical, problem-solving, and communication skills.

  • Experience in bringing packaged products from development into production.

  • Strong written and spoken English communication skills.

Preferred Qualifications:
  • Experience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).

  • Knowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.

  • Strong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).

  • Familiarity with GF's Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.

  • Experience working with OSATs and managing external development partners.

  • Demonstrated ability to lead cross-functional teams and influence technical direction.

Expected Salary Range
$131,900.00 - $241,500.00
The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

What GlobalFoundries employees say

Pay

Benefits

Hours and flexibility

Workplace

Get the full story on Breakroom

Apply