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Photonics Packaging Engineer Jobs (NOW HIRING)

Apple

Silicon Photonics EPM, Data Center SoC

Austin, TX

$166K - $296K/yr

Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management. Pay & Benefits At Apple, base pay is one part of our total compensation package and ...

Conductor

Packaging Engineer- Flip Chip

Boston, MA · On-site

We're seeking experienced engineers to contribute to flip chip package development and assembly ... Experience with III-V packaging, photonics packaging, and precision chip attach. Experience with ...

Conductor

Packaging Engineer- Flip Chip

Austin, TX · On-site

We're seeking experienced engineers to contribute to flip chip package development and assembly ... Experience with III-V packaging, photonics packaging, and precision chip attach. Experience with ...

Apple

Silicon Photonics EPM, Data Center SoC

Austin, TX

$175K - $311K/yr

Proven track record in AMS IP, Silicon Photonics, or optical interconnect design or design engineering management. Pay & Benefits At Apple, base pay is one part of our total compensation package and ...

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Photonics Packaging Engineer information

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How much do photonics packaging engineer jobs pay per hour?

As of Sep 11, 2026, the average hourly pay for photonics packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What does a photonics packaging engineer do?

A Photonics Packaging Engineer specializes in designing, developing, and testing the packaging solutions for photonic devices such as lasers, optical fibers, and sensors. Their work ensures that these devices are protected, efficiently connected, and can operate reliably in various environments. They address challenges related to thermal management, alignment, and integration with electronic components. These engineers often collaborate with cross-functional teams to bring photonic products from concept to production.

What are some typical challenges faced by photonics packaging engineers during the product development cycle?

Photonics Packaging Engineers often encounter challenges related to ensuring thermal stability, optical alignment, and maintaining signal integrity within compact form factors. Managing the integration of delicate optical components with electronic systems, while also considering manufacturability and cost, requires close collaboration with design, test, and manufacturing teams. Adapting to evolving industry standards and rapidly advancing photonics technology also means continuous learning and problem-solving throughout the development process.

What are the key skills and qualifications needed to thrive as a photonics packaging engineer, and why are they important?

To thrive as a Photonics Packaging Engineer, you need a strong background in optics, materials science, and mechanical or electrical engineering, typically supported by a relevant engineering degree. Familiarity with CAD software, optical simulation tools, cleanroom processes, and industry standards like IPC or ISO is essential. Attention to detail, problem-solving abilities, and strong teamwork and communication skills set top performers apart. These competencies are crucial for designing reliable photonic devices, ensuring precise assembly, and collaborating effectively across multidisciplinary teams.

What is the difference between Photonics Packaging Engineer vs Optical Engineer?

AspectPhotonics Packaging EngineerOptical Engineer
Required CredentialsBachelor's or higher in optical, electrical, or mechanical engineering; certifications in photonics or optical systemsBachelor's or higher in optical, electrical, or physics; certifications in optics or photonics
Work EnvironmentManufacturing facilities, R&D labs, cleanroomsResearch labs, design offices, testing facilities
Industry UsageTelecommunications, laser systems, data communicationsOptical systems design, imaging, laser applications

Photonics Packaging Engineers focus on designing and assembling optical components into robust packages, ensuring performance and reliability. Optical Engineers primarily develop and analyze optical systems and components. While both roles require similar educational backgrounds and certifications, Photonics Packaging Engineers work more in manufacturing and integration, whereas Optical Engineers focus on system design and analysis.

What are popular job titles related to Photonics Packaging Engineer jobs?

For Photonics Packaging Engineer jobs, the most frequently searched job titles are:

Infographic showing various Photonics Packaging Engineer job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 87% Full Time, 9% Part Time, and 3% Contract. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Silicon Photonics & Optical Packaging Eng

San Francisco, CA • On-site

Apple
Computer and Electronic Product Manufacturing • 10K+ employees
Learn more about Appleexternal

$152K - $196K/yr

Full-time

Re-posted 18 days ago

Apple rating

8.1

Company rating: 8.1 out of 10

Based on 684 frontline employees who took The Breakroom Quiz

Job description

Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.
Description
Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience
Preferred Qualifications
M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
Excellent teamwork and communication skills.
Strong theoretical background in optics and photonics fundamentals, device/module integration.
Hands-on experience in packaging and measuring fiber-coupled devices.
Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool.
Min. 5 years works experiences in the related field with M.S and or Ph.D.
Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, ...)
Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus.

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About Apple

Sourced by ZipRecruiter

Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Cupertino, CA, US

Year founded

1976

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