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Phd Semiconductor Packaging Engineer Bonding Jobs

Fab2

Semiconductor Packaging Engineer

Austin, TX · On-site

$110K - $155K/yr

You'll be working on things like process development, recipe creation, lithography, deposition, die attaching, bonding, etc. We are seeking an experienced Semiconductor Packaging Engineer with deep ...

Quantinuum

Chief Packaging Engineer - 906

Broomfield, CO · On-site

$208K - $260K/yr

Minimum PhD with 12+ years' experience in advanced semiconductor packaging development * Due to ... PhD in Physics or Engineering * Experience with advanced large area multi-chip semiconductor ...

Steneg

Head of Packaging Engineering

Boulder, CO · On-site

Master's degree or PhD in Physics, Electrical Engineering, Materials Science or a related engineering discipline. * Experience with advanced large-area multi-chip semiconductor packaging technologies.

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Phd Semiconductor Packaging Engineer Bonding information

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How much do phd semiconductor packaging engineer bonding jobs pay per hour?

As of Sep 13, 2026, the average hourly pay for phd semiconductor packaging engineer bonding in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is the difference between Phd Semiconductor Packaging Engineer Bonding vs Phd Semiconductor Packaging Engineer Testing?

AspectPhd Semiconductor Packaging Engineer BondingPhd Semiconductor Packaging Engineer Testing
Primary FocusDeveloping and optimizing bonding techniques for semiconductor packagesDesigning and executing testing procedures to ensure package reliability
Skills RequiredMaterial science, bonding processes, microscopyElectrical testing, failure analysis, data interpretation
Work EnvironmentCleanrooms, R&D labs, manufacturing facilitiesTesting labs, quality assurance departments
Industry UsageSemiconductor manufacturing, packaging developmentQuality control, product validation, reliability testing

While both roles require a PhD and focus on semiconductor packaging, the Bonding engineer specializes in bonding techniques, whereas the Testing engineer concentrates on testing and validation processes. Both are essential for ensuring high-quality semiconductor packages but differ in their core responsibilities and skill sets.

What are popular job titles related to Phd Semiconductor Packaging Engineer Bonding jobs?

For Phd Semiconductor Packaging Engineer Bonding jobs, the most frequently searched job titles are:

Infographic showing various Phd Semiconductor Packaging Engineer Bonding job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 89% Full Time, 7% Part Time, and 3% Contract. Highlights an 84% Physical, 5% Hybrid, and 11% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Semiconductor Packaging Engineer

Austin, TX • On-site

Fab2
See more jobs at Fab2external

$110K - $155K/yr

Other

Medical, Dental, Vision, Life, Retirement, PTO

Posted 26 days ago

Job description

About fab2

The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves.
We're looking for exceptional, hands-on people who can iterate to the limits of what's possible.

fab2 was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.

About the role

As a Packaging Engineer at fab2, you’ll work with a full-stack team to develop a complete process for fabricating semiconductor packaging devices. You’ll be working on things like process development, recipe creation, lithography, deposition, die attaching, bonding, etc.

We are seeking an experienced Semiconductor Packaging Engineer with deep expertise in packaging methods and a passion for exploring new technologies. This person will play a critical role in developing and optimizing processes that leverage 3D printing to create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating 3D printing into semiconductor packaging.

Responsibilities

  • Working with the team to explore and validate innovative semiconductor packaging processes.

  • Conducting hands-on lab experiments end-to-end to test.

  • Innovating novel materials for packaging, considering factors such as conductivity, mechanical strength, and thermal expansion.

  • Evaluating the process to continuously improve performance.

  • Collaborating closely with team members to provide technical support for experiments and methodologies.

  • Creating thorough documentation, including Standard Operating Procedures (SOPs), and maintaining equipment to ensure optimal performance and safety.

Required Experience

  • Masters or equivalent experience in Electrical Engineering, Material Science, Mechanical Engineering, or a related field

  • 5+ years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies.

  • Knowledge of packaging materials, thermal management, and reliability testing

  • Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively.

Nice-to-have

  • Experience in 3d printing

  • Experience in metal plating

  • Mechanical-related background

  • Knowledge of electronic design

Working at fab2

We’re an early-stage hardware startup with solid funding, world-class advisors, and offices in Austin and San Francisco.

Compensation:

fab2 is committed to fair and equitable compensation practices. The annual salary range for this role is $110,000 – $155,000. Compensation is determined based on your qualifications and experience. Our total compensation package also includes generous equity in fab2.

Benefits:

fab2 Semi offers the following benefits, subject to applicable eligibility requirements:

  • Medical, Dental, and Vision insurance

  • Generous Paid Time Off inclusive of Holidays and Sick Time

  • Visa Sponsorship

  • Life and Disability Insurance

  • Paid Parental Leave

  • 401(k) retirement plan

  • Weekly Learning & Development opportunities

  • Commuter Benefits including Parking and Late Night Uber rides from the office

  • Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts

We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses.

Export Control Analysis:

This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.

fab2, formerly known as Atomic Semi

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