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Pcb Manufacturing Remote information

What are the key skills and qualifications needed to thrive as a PCB Manufacturing Remote professional, and why are they important?

To excel as a PCB Manufacturing Remote professional, you need expertise in PCB design, manufacturing processes, and quality assurance, typically supported by an engineering degree or relevant technical certification. Familiarity with CAD PCB design software (like Altium Designer or Eagle), manufacturing execution systems (MES), and remote collaboration tools is essential. Strong attention to detail, problem-solving abilities, and effective communication skills help you collaborate with on-site teams and manage production issues remotely. These competencies ensure the efficient, high-quality manufacturing of PCBs while overcoming the challenges of remote coordination.

What is the difference between Pcb Manufacturing Remote vs Pcb Assembly Technician?

AspectPcb Manufacturing RemotePcb Assembly Technician
Work EnvironmentPrimarily remote, office-based or home officeOn-site manufacturing or assembly facility
Required SkillsDesign, engineering, quality control, communication skillsHands-on assembly, soldering, component placement
CertificationsElectronics or engineering certifications often preferredElectronics or technical certifications often required
Industry UsageDesign, testing, and quality assurance in PCB productionAssembling and testing PCBs in manufacturing plants

While Pcb Manufacturing Remote roles focus on design, quality, and oversight from a remote setting, Pcb Assembly Technicians work directly in manufacturing facilities assembling and testing PCBs. Both roles require technical knowledge but differ in work environment and daily tasks.

What is PCB manufacturing remote?

PCB manufacturing remote refers to the process of designing, ordering, and overseeing the production of printed circuit boards (PCBs) without being physically present at the manufacturing facility. Professionals in this role use online platforms and communication tools to coordinate with manufacturers, review production progress, and handle quality control remotely. This approach allows engineers, designers, and companies to manage PCB fabrication efficiently from any location, often working with global suppliers. Remote PCB manufacturing has become increasingly popular due to advancements in digital collaboration tools and increased demand for flexible work arrangements.

What are some common challenges faced by remote PCB manufacturing professionals, and how can they be addressed?

Remote PCB manufacturing professionals often face challenges such as coordinating with on-site teams, ensuring clear communication across time zones, and maintaining quality control without direct access to physical prototypes. To address these issues, effective use of digital collaboration tools, regular virtual meetings, and leveraging cloud-based design and testing platforms are essential. Additionally, establishing clear documentation and feedback channels helps ensure that project requirements are met efficiently and accurately.
What are popular job titles related to Pcb Manufacturing Remote jobs in Arizona? For Pcb Manufacturing Remote jobs in Arizona, the most frequently searched job titles are:
What job categories do people searching Pcb Manufacturing Remote jobs in Arizona look for? The top searched job categories for Pcb Manufacturing Remote jobs in Arizona are:
What cities in Arizona are hiring for Pcb Manufacturing Remote jobs? Cities in Arizona with the most Pcb Manufacturing Remote job openings:
Pcb Manufacturing Remote jobs near you
Infographic showing various Pcb Manufacturing Remote job openings in Arizona as of June 2026, with employment types broken down into 95% Full Time, 3% Contract, and 2% Nights. Highlights an 96% Physical, 2% Hybrid, and 2% Remote job distribution.

System IC Architect - Advanced Power Systems

NXP Semiconductors

Chandler, AZ • On-site, Remote

$239K/yr

Full-time

Posted 17 days ago

Job description

Department: Advanced Power Systems (APS). This role emphasizes Advanced Power Management System IC Architecture for Point of Load (PoL) solutions.

Role Overview

We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next-generation Point of Load (PoL) solutions for APS, driving innovation in advanced power management with System-in-Package (SiP) integration.
We're looking for a candidate to define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet latest system-level requirements. Key focus areas include high-performance core power for automotive applications and AI compute platforms. The role centers on Advanced Power Management for PoL solutions. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.

Key Responsibilities - Advanced Power Management & System IC ArchitectureProduct Definition & Strategy

  • Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.

  • Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.

  • Translate customer requirements into innovative packaging and power management solutions. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.

  • Support development through thermal optimization and electrical analysis.

System-Level Integration

  • Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.

  • Lead integration of ICs and power semiconductors into advanced packages and systems. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.

  • Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical. Automotive Power Management experience is a plus, highly valued.

Thermal Management & Advisory

  • Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.

Cross-Functional Leadership

  • Collaborate with system, modeling, design, packaging and manufacturing engineering teams to validate and optimize high-performance compute Power designs.

  • Act as a technical liaison with customers, supporting co-development and design-in activities.

Technical Advisory & Reporting

  • Provide strategic insights on state-of-the-art power management technologies and benchmark readiness. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.

  • Report KPIs and project status to executive stakeholders.

Preferred Qualifications - Power Semiconductor Architect Expertise

  • Master's degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).

  • 15+ years of experience in power semiconductors, packaging, and system-level integration. This role emphasizes Advanced Power Management for Point of Load (PoL) solutions. Expertise in System-in-Package (SiP) integration is essential.

  • Proven track record in product definition through revenue realization.

  • Strong expertise in thermal management, electrical performance, and advanced reliability.

  • Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.

  • Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.

  • Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).

  • Demonstrated ability to lead cross-functional, global teams and manage complex projects.

  • Excellent communication and interpersonal skills; ability to collaborate across diverse teams.

  • Creative mindset with strong problem-solving capabilities.

  • Willingness to travel globally.

Location:

This position can be done from anywhere in the United States and is open to 100% remote, however some travel to our Chandler site where the team sits will be required each quarter in addition to any necessary customer visits. This position is also open to locations in EMEA and especially France.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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