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Packaging Engineering Jobs in Boise, ID (NOW HIRING)

Micron

Sr RDA Engineer, Advanced Packaging

Boise, ID · On-site

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the ... Bachelor's Degree in Electrical Engineering, Chemical Engineering, Materials Science & Engineering ...

Packaging Corporation of America

Designer

Nampa, ID · On-site

$63K - $95K/yr

Education equivalent to a bachelor's degree in graphic design, structural design, art, engineering, or packaging preferred. Strong working knowledge of production methods, printing methods, materials ...

Schnabel Engineering

Senior Mechanical Engineer

Boise, ID · On-site

$83K - $133K/yr

Recognized by CE News as one of the Best Engineering Firms to Work for, Schnabel provides employees with a competitive benefits package including maternity leave, tuition reimbursement for continuing ...

DC Engineering, Inc.

Sr. Structural Engineer

Meridian, ID · On-site

$94K - $128K/yr

DC Engineering offers a competitive compensation and benefit package that includes: * Health, Dental, and Vision Coverage * FSA, HSA Plans * Company-paid Term Life Insurance Policy * Company-paid ...

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Packaging Engineering information

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How much do packaging engineering jobs pay per hour?

As of Aug 7, 2026, the average hourly pay for packaging engineering in Boise, ID is $40.32, according to ZipRecruiter salary data. Most workers in this role earn between $31.11 and $46.92 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a packaging engineer, and why are they important?

To thrive as a Packaging Engineer, you need a solid background in engineering principles, materials science, and packaging design, usually supported by a degree in packaging engineering or a related field. Proficiency with CAD software, packaging simulation tools, and knowledge of regulatory standards are typically required. Strong problem-solving, project management, and communication skills help you collaborate effectively and innovate solutions. These skills ensure product safety, cost efficiency, and compliance throughout the packaging lifecycle.

What are some common challenges packaging engineers face when balancing sustainability with cost and functionality?

Packaging engineers often encounter the challenge of designing solutions that are environmentally friendly while still being cost-effective and meeting product protection requirements. Sustainable materials can sometimes be more expensive or less readily available, and may require adjustments in manufacturing processes. Additionally, engineers must ensure that the chosen packaging maintains product integrity during shipping and storage. Collaboration with suppliers, marketing, and manufacturing teams is essential to find a balance that aligns with company goals and regulatory standards.

What is the difference between Packaging Engineering vs Packaging Technician?

AspectPackaging EngineeringPackaging Technician
CredentialsBachelor's degree in engineering or related fieldTechnical diploma or associate degree
Work EnvironmentDesign, development, and testing of packaging solutionsImplementing and troubleshooting packaging processes
Industry UsageDesigning new packaging systems for productsMaintaining and operating packaging equipment
Common Search IntentUnderstanding roles in packaging design and developmentLearning about packaging process support and technical tasks

Packaging Engineering focuses on designing and developing packaging solutions, requiring engineering knowledge and design skills. Packaging Technicians support these systems by implementing and maintaining packaging processes, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and qualifications.

What is packaging engineering?

Packaging engineering is a specialized field of engineering that focuses on the design, development, testing, and production of packaging for products. Packaging engineers work to ensure that products are protected, preserved, and presented in a way that is efficient, cost-effective, and sustainable. They consider factors such as materials, manufacturing processes, safety regulations, and environmental impact. This role often involves collaboration with product designers, manufacturers, and marketing teams to create packaging solutions that meet both functional and aesthetic requirements.

What does a packaging engineer do?

A packaging engineer designs and develops packaging solutions to protect products during storage, handling, and transportation. They analyze materials, create prototypes, and ensure compliance with safety and industry standards, often using CAD software and testing methods. Their work helps optimize packaging for cost, sustainability, and efficiency.
What are popular job titles related to Packaging Engineering jobs in Boise, ID? For Packaging Engineering jobs in Boise, ID, the most frequently searched job titles are:
What job categories do people searching Packaging Engineering jobs in Boise, ID look for? The top searched job categories for Packaging Engineering jobs in Boise, ID are:
Packaging Engineering jobs near you
Infographic showing various Packaging Engineering job openings in Boise, ID as of July 2026, with employment types broken down into 81% Full Time, 17% Part Time, and 2% Contract. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $83,869 per year, or $40.3 per hour.

MTS Design Engineer, Bonding and Packaging

Micron Technology

Boise, ID • On-site

$129K/yr

Full-time

Medical, Dental, Vision, PTO

Posted 7 days ago

Micron Technology rating

8.6

Company rating: 8.6 out of 10

Based on 43 frontline employees who took The Breakroom Quiz

27th of 156 rated electronics manufacturers

Job description

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of cutting-edge memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration!
We are seeking a highly experienced Design Engineer to enable our APTD team in the Bonding & Packaging Design space. In this role you will drive the electrical, thermal, and thermo-mechanical design and characterization of next-generation semiconductor packages, including High Bandwidth Memory (HBM), wafer-to-wafer (W2W), Chip-on-Wafer (COW), Flip Chip, and Through-Silicon-Via (TSV) technologies. You will work closely with global multidisciplinary teams to turn complex simulation results into practical design guidelines and future technology roadmaps. A key focus of the role is leveraging AI and machine learning tools, including generative AI and predictive analytics to improve learning, accelerate simulations, and enable data-driven decision making within Advanced Packaging R&D.
Job Responsibilities
  • Maintain deep subject-matter knowledge of semiconductor and advanced electronics packaging technologies such as HBM, W2W, COW, Flip Chip, and TSV
  • Drive design advancements through a detailed understanding of electrical parasitics, insertion loss, and impedance mismatches of various interconnects as a function of materials, geometries, temperature, and humidity, capturing the corresponding multiphysics mechanisms in simulation
  • Propose short and long-term solutions to improve thermals and kick off projects aligned to thermal improvement roadmaps.
  • Apply understanding of Chip-Package Interactions (CPI) in 2.5D, 3D systems, and internal qual packages; drive sensitivity studies and data collection to validate mechanical and thermo-mechanical stress/strain structural models; Propose design rules with clear justification and explanation for partnering teams.
  • Work with internal/external vendors and testing labs to design and implement effective testing procedures to characterize material dielectric constants and decay values for simulation analysis.
  • Integrate AI workflows into package design and package technology evaluations and creation; Drive AI-enabled technology development for advanced packaging and heterogeneous integration.

Minimum Qualifications
  • MS or Ph.D. in Electrical Engineering, Material Science, Applied Physics, or a related field
  • 15-20 years of professional experience in a relevant engineering area with at least 10 years of direct experience in electrical, thermal, and mechanical package analysis, modeling, and validation of electronic packages in the semiconductor industry or equivalent.
  • Solid understanding of design and process impacts on thermal performance, including the contribution of each layer to total thermal impedance
  • Proficiency with engineering tools for Design of Experiments (DOE) and statistical analysis (e.g., JMP or equivalent)
  • Demonstrated ability to integrate AI/ML and generative AI tools into engineering workflows, technical assessments, and daily productivity

Preferred Qualifications
  • Experience in Signal Integrity analysis and high-speed package designs, defining characterization (CHAR) plans, and defining DOEs needed to develop package solutions for specific problems
  • Familiarity with Cadence layout tools to open and review designs of test vehicles or new memory concepts
  • Data acquisition experience and numerical analysis proficiency in MATLAB, Excel, JMP, etc.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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