Packaging Engineer Jobs in Rohnert Park, CA (NOW HIRING)

Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Description
• In this fast-paced environment, your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies.
• Must be a good negotiator and influencer to drive industry to meet company needs.
• We are looking for individuals who are very innovative with a proven track record to reduce package development cycle and qualify devices into a high-volume manufacturing environment.","responsibilities":"Define new package characteristics based on unique module and system level performance, cost, and footprint requirements.
Define package/packaging specifications.
Work with external suppliers on package design, new material, new equipment selection and process flow development.
Perform initial proof of concept sample build, POR establishment, package and process qualification, reliability test, yield analysis and enhancement.
Coordinate with other packaging and cross-functional team members to comply with product development/ramp schedule.
Deliver package/packaging milestones on time.
Define packaging roadmap based on long term packaged product requirements.
Work closely and Manage suppliers’ R&D activities.
Preferred Qualifications
M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 10 years of experience in IC packaging. AutoCAD, APD and multi-physics simulation knowledge is a plus.
Industry experience and work on WLP either in IDM or Fabless companies.
Knowledge and hands-on experience on Wafer Bumping and Dielectric materials and their pros/cons is a must.
Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape & Reel.
In-depth knowledge in Wafer Level Chip Scale Packaging (RDL/Wafer Bumping & BEOL Assembly processes for Fan-In & Fan-Out designs).
Good knowledge on Package Qualification and Reliability testing.
Expert level knowledge of common reliability failure modes. Able to understand device physics and component/board level reliability testing.
Proven track record to bring a product/package from conceptual stage to development and to HVM environment.
Ability to construct Designs of Experiments and down-select materials and processes.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings.
Able to perform independent research and development work with minimal supervision.
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Pay & Benefits
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.