Principal Substrate and Packaging Engineer Fully onsite in the San Francisco Bay Area Full time opportunity $400-500K total compensation package- base, bonus, stock (depends on skillset/experience ...
Principal Substrate and Packaging Engineer Fully onsite in the San Francisco Bay Area Full time opportunity $400-500K total compensation package- base, bonus, stock (depends on skillset/experience ...
Principal Substrate and Packaging Engineer Fully onsite in the San Francisco Bay Area Full time opportunity $400-500K total compensation package- base, bonus, stock (depends on skillset/experience ...
Principal Substrate and Packaging Engineer Fully onsite in the San Francisco Bay Area Full time opportunity $400-500K total compensation package- base, bonus, stock (depends on skillset/experience ...
We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and ...
We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and ...
We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and ...
We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and ...
Packaging Substrate Engineer
$181K - $318K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...
Packaging Substrate Engineer
$181K - $318K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...
System Integration & Release Packaging Engineer Location: Bay Area, CA Duration: 12 Months Years of Experience: 8+ Yrs. Required Hours/Week: 40hrs./Week Job Requirements: * Package and manage ...
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System Integration & Release Packaging Engineer Location: Bay Area, CA Duration: 12 Months Years of Experience: 8+ Yrs. Required Hours/Week: 40hrs./Week Job Requirements: * Package and manage ...
Packaging Substrate Engineer
$181K - $318K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...
Packaging Substrate Engineer
$181K - $318K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...
Packaging Substrate Engineer
$126K - $220K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...
Packaging Substrate Engineer
$126K - $220K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...
Packaging Substrate Engineer
$126K - $220K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...
Packaging Substrate Engineer
$126K - $220K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...
Package Integration Engineer
Bodega Bay, CA · On-site
$181K - $318K/yr
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Package Integration Engineer
Bodega Bay, CA · On-site
$181K - $318K/yr
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Silicon Photonics & Optical Packaging Engineer
$257K - $386K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Engineer
$257K - $386K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Engineer
$257K - $386K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Engineer
$257K - $386K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Process Engineer
$181K - $318K/yr
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...
Process Engineer
$181K - $318K/yr
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...
Process Engineer
$181K - $318K/yr
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...
Process Engineer
$181K - $318K/yr
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...
Silicon Photonics & Optical Packaging Eng
$181K - $318K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Eng
$181K - $318K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Eng
Bodega Bay, CA · On-site
$181K - $318K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Eng
Bodega Bay, CA · On-site
$181K - $318K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Principal IC Package Design Engineer - TeraWave
Bodega Bay, CA · On-site
$230K - $323K/yr
... focused on advanced packaging technologies for mmWave AiPs and complex SoCs. You will be ... Lead the package engineering team to deliver state-of-the-art packaging solutions for various RF ...
Principal IC Package Design Engineer - TeraWave
Bodega Bay, CA · On-site
$230K - $323K/yr
... focused on advanced packaging technologies for mmWave AiPs and complex SoCs. You will be ... Lead the package engineering team to deliver state-of-the-art packaging solutions for various RF ...
... Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an ...
... Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an ...
... Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an ...
... Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an ...
Management of ASIC Package/Subsystem development and system integration including package design ... Excellent understanding of Electrical Engineering principles, RF/Microwave theory, and high ...
Management of ASIC Package/Subsystem development and system integration including package design ... Excellent understanding of Electrical Engineering principles, RF/Microwave theory, and high ...
Packaging Engineer information
See Rohnert Park, CA salary details
$21.83 - $26.60
2% of jobs
$26.60 - $31.37
6% of jobs
$35.92 is the 25th percentile. Wages below this are outliers.
$31.37 - $36.14
17% of jobs
$36.14 - $40.91
16% of jobs
The median wage is $43.29 / hr.
$40.91 - $45.68
16% of jobs
$45.68 - $50.45
12% of jobs
$52.71 is the 75th percentile. Wages above this are outliers.
$50.45 - $55.22
11% of jobs
$55.22 - $59.98
6% of jobs
$59.98 - $64.75
5% of jobs
$64.75 - $69.52
4% of jobs
$69.52 - $74.29
3% of jobs
$21
$46
$74
How much do packaging engineer jobs pay per hour?
How much do packaging engineers make in the US?
How does a Packaging Engineer typically collaborate with other departments during the product development process?
What engineering jobs pay $500,000?
What Is a Packaging Engineer?
A packaging engineer is an engineer who specializes in developing containers and packages for products that meet the manufacturer’s needs. As a packaging engineer, your responsibilities and duties include working with the product manufacturer to decide what kind of package or container (box, bottle, bag, stretch wrap, molded forms, etc.) is best for the product. You discuss what material (paper, plastic, glass, metal, etc.) is best. You determine the most efficient method to produce the containers and how they will appear. This job often requires travel to meet with clients.
What is the difference between Packaging Engineer vs Packaging Technician?
| Aspect | Packaging Engineer | Packaging Technician |
|---|---|---|
| Credentials | Bachelor's degree in engineering, packaging science, or related field | High school diploma or equivalent; technical training often preferred |
| Work Environment | Design, development, and testing of packaging solutions; collaboration with R&D and manufacturing | Implementation, setup, and troubleshooting of packaging processes on the production line |
| Employer & Industry Usage | Manufacturers, consumer goods, food & beverage, pharmaceuticals | Packaging facilities, manufacturing plants, distribution centers |
Packaging Engineers focus on designing and developing packaging solutions, requiring technical degrees and working in R&D or design settings. Packaging Technicians handle the practical implementation and maintenance of packaging processes on the production floor, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and required qualifications.
What does a packaging engineer do?
What are the key skills and qualifications needed to thrive as a Packaging Engineer, and why are they important?
What engineers make $300,000 a year?
Job description
Principal Substrate and Packaging Engineer
Fully onsite in the San Francisco Bay Area
Full time opportunity
$400-500K total compensation package- base, bonus, stock (depends on skillset/experience level)
Industry leader in semiconductor design focused on advanced IC packaging and high‑speed interconnect technologies. In the role, you will have primarily be responsible for the layout, routing, and functionality of packages and substrates, including design of high-speed lines.
What You’ll Do
- Design and layout advanced IC packages, substrates, and interposers, including high‑speed signal routing
- Collaborate closely with electrical, mechanical, SI/PI, and program teams during front‑end and detailed layout
- Define layout rules, panelization strategies, and stack‑ups with substrate and package vendors
- Perform peer design reviews and contribute to layout best practices and flow improvements
- Execute DRC and LVS checks to ensure layout correctness
- Support post‑fab evaluation, including visual inspection, electrical validation, and high‑speed characterization
- Develop and apply script‑based layout automation to improve efficiency and quality
- Simulate layouts and recommend design optimizations to meet performance and reliability targets
Required Background
- BS/MS/PhD in Electrical, Computer, Mechanical Engineering, or related field
- 10+ years of hands‑on experience in IC substrate and package layout
- Deep expertise with EDA layout tools, such as: Calibre/Klayout, Cadence Allegro Package Designer, Innovus and Virtuoso
- Multilayer and high‑speed layout
- RF design fundamentals
- Package/substrate manufacturing processes and materials
- Surface‑mount technology (SMT)
About Fidelis Education
Sourced by ZipRecruiter
Industry
Education programs administration
Company size
11 - 50 Employees
Headquarters location
Mountain View, CA, US
Year founded
2011