We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and ...
We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and ...
We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and ...
We are looking for a self-motivated Materials Characterization Engineer who is proficient in materials science and experimental mechanics. Join our Advanced Technologies Group - Packaging team and ...
Packaging Substrate Engineer
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...
Packaging Substrate Engineer
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...
Packaging Substrate Engineer
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...
Packaging Substrate Engineer
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Proven fundamentals in material/chemistry/mechanical engineering field(s). In-depth knowledge of ...
System Integration & Release Packaging Engineer Location: Bay Area, CA Duration: 12 Months Years of Experience: 8+ Yrs. Required Hours/Week: 40hrs./Week Job Requirements: * Package and manage ...
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System Integration & Release Packaging Engineer Location: Bay Area, CA Duration: 12 Months Years of Experience: 8+ Yrs. Required Hours/Week: 40hrs./Week Job Requirements: * Package and manage ...
Packaging Substrate Engineer
$129K - $225K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...
Packaging Substrate Engineer
$129K - $225K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...
Packaging Substrate Engineer
$129K - $225K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...
Packaging Substrate Engineer
$129K - $225K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple's internal and custom external components of hardware for its consumer ...
Package Integration Engineer
$184K - $324K/yr
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Package Integration Engineer
$184K - $324K/yr
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Advanced Package Development Engineer
$184K - $324K/yr
Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging ...
Advanced Package Development Engineer
$184K - $324K/yr
Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging ...
Silicon Photonics & Optical Packaging Engineer
$262K - $394K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Engineer
$262K - $394K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Advanced Package Development Engineer
$184K - $324K/yr
Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging ...
Advanced Package Development Engineer
$184K - $324K/yr
Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging ...
Silicon Photonics & Optical Packaging Engineer
$262K - $394K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Engineer
$262K - $394K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Process Engineer
$184K - $324K/yr
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...
Process Engineer
$184K - $324K/yr
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...
Process Engineer
$184K - $324K/yr
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...
Process Engineer
$184K - $324K/yr
Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own the ...
Silicon Photonics & Optical Packaging Eng
$184K - $324K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Eng
$184K - $324K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Eng
$184K - $324K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Silicon Photonics & Optical Packaging Eng
$184K - $324K/yr
We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co ...
Principal IC Package Design Engineer - TeraWave
Bodega Bay, CA · On-site
$230K - $323K/yr
... focused on advanced packaging technologies for mmWave AiPs and complex SoCs. You will be ... Lead the package engineering team to deliver state-of-the-art packaging solutions for various RF ...
Principal IC Package Design Engineer - TeraWave
Bodega Bay, CA · On-site
$230K - $323K/yr
... focused on advanced packaging technologies for mmWave AiPs and complex SoCs. You will be ... Lead the package engineering team to deliver state-of-the-art packaging solutions for various RF ...
... Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an ...
... Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an ...
... Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an ...
... Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an ...
Management of ASIC Package/Subsystem development and system integration including package design ... Excellent understanding of Electrical Engineering principles, RF/Microwave theory, and high ...
Management of ASIC Package/Subsystem development and system integration including package design ... Excellent understanding of Electrical Engineering principles, RF/Microwave theory, and high ...
Packaging Engineer information
See Rohnert Park, CA salary details
$21.83 - $26.60
2% of jobs
$26.60 - $31.37
6% of jobs
$35.92 is the 25th percentile. Wages below this are outliers.
$31.37 - $36.14
17% of jobs
$36.14 - $40.91
16% of jobs
The median wage is $43.29 / hr.
$40.91 - $45.68
16% of jobs
$45.68 - $50.45
12% of jobs
$52.71 is the 75th percentile. Wages above this are outliers.
$50.45 - $55.22
11% of jobs
$55.22 - $59.98
6% of jobs
$59.98 - $64.75
5% of jobs
$64.75 - $69.52
4% of jobs
$69.52 - $74.29
3% of jobs
$21
$46
$74
How much do packaging engineer jobs pay per hour?
How does a Packaging Engineer typically collaborate with other departments during the product development process?
What Is a Packaging Engineer?
A packaging engineer is an engineer who specializes in developing containers and packages for products that meet the manufacturer’s needs. As a packaging engineer, your responsibilities and duties include working with the product manufacturer to decide what kind of package or container (box, bottle, bag, stretch wrap, molded forms, etc.) is best for the product. You discuss what material (paper, plastic, glass, metal, etc.) is best. You determine the most efficient method to produce the containers and how they will appear. This job often requires travel to meet with clients.
What is the difference between Packaging Engineer vs Packaging Technician?
| Aspect | Packaging Engineer | Packaging Technician |
|---|---|---|
| Credentials | Bachelor's degree in engineering, packaging science, or related field | High school diploma or equivalent; technical training often preferred |
| Work Environment | Design, development, and testing of packaging solutions; collaboration with R&D and manufacturing | Implementation, setup, and troubleshooting of packaging processes on the production line |
| Employer & Industry Usage | Manufacturers, consumer goods, food & beverage, pharmaceuticals | Packaging facilities, manufacturing plants, distribution centers |
Packaging Engineers focus on designing and developing packaging solutions, requiring technical degrees and working in R&D or design settings. Packaging Technicians handle the practical implementation and maintenance of packaging processes on the production floor, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and required qualifications.
What does a Packaging Engineer do?
What are the key skills and qualifications needed to thrive as a Packaging Engineer, and why are they important?
$129K - $225K/yr
Full-time
Medical, Dental, Retirement
Posted 18 days ago
Apple rating
8.1
Based on 670 frontline employees who took The Breakroom Quiz
5th of 30 rated technology retailers
Job description
Description
As an IC Packaging Characterization Engineer, you will drive the mechanical and material evaluation of cutting-edge Integrated Circuit (IC) packages. You will pioneer new characterization methodologies, evaluate state-of-the-art packaging materials, and solve complex yield and reliability challenges to ensure our components meet Apple's uncompromising standards for performance and robustness.","responsibilities":"Package Characterization: Design and execute testing of IC packages under rigorous environmental and reliability stress conditions, including dynamic mechanical loading, thermal cycling, and moisture stressing.
Material Evaluation: Lead the characterization of advanced packaging materials (e.g., solders, polymers, dielectrics) and manage material characterization activities at external suppliers.
Methodology Development: Develop novel experimental methodologies, including designing custom fixtures, setting up specialized test equipment, and integrating advanced data acquisition systems.
Failure Analysis: Drive root-cause analysis and troubleshooting for complex packaging-related yield and reliability issues.
Preferred Qualifications
BS in Materials Science, Mechanical Engineering, Physics, or a related technical field, with 3+ years of relevant industry experience strongly preferred
Experimental Mechanics: Proven track record in experimental mechanics, material characterization, and the hands-on setup of test equipment.
Analytical Tools: Hands-on experience with advanced material and failure analysis techniques (e.g., SEM, EDX, FIB, CSAM).
Computational Skills: Proficiency with numerical simulation software, alongside strong programming capabilities in MATLAB and/or Scientific Python. Familiarity with Gen-AI, Machine Learning, and statistical data analysis is highly desirable.
Leadership & Communication: Ability to drive independent R&D initiatives, paired with excellent communication skills to confidently present complex data, ideas, and strategic plans to cross-functional teams.
Domain Expertise: Understanding of electronic packaging architectures, assembly processes, and package qualification requirements, coupled with a strong grasp of the mechanical behavior and reliability physics of packaging materials.
Minimum Qualifications
Minimum requirement of a bachelors degree
Pay & Benefits
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $129,300 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976