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Packaging Engineer Jobs in Kent, WA (NOW HIRING)

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Semiconductor Packaging Engineer Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production ...

Sigma Design

Semiconductor Packaging Engineer

Redmond, WA · On-site

$115K - $145K/yr

Semiconductor Packaging Engineer Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production ...

Nintendo

Structural Packaging Engineer

Redmond, WA · Hybrid

... packaged in accordance to specifications. * Conducts production part performance evaluations following internal and industrial test standards. Provides engineering solutions based on test result ...

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field. * 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.

K2 Space

Principal ASIC Package Design Engineer

Seattle, WA · On-site

$200K - $280K/yr

Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die ... Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a ...

K2 Space

Principal ASIC Package Design Engineer

Seattle, WA · On-site

$200K - $280K/yr

Engineered to survive the harshest radiation environments and to fully capitalize on today's and ... Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die ...

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field. * 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.

SpaceX

RFIC Layout Designer (RFIC Engineering)

Redmond, WA · On-site

$115K - $145K/yr

Work with the integrated circuit designers and chip leads to determine the chip floor plan; this includes strategies for power and ground distribution as well as working with packaging engineer to ...

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All JobsPackaging Engineer JobsPackaging Engineer Jobs in Kent, WA

Packaging Engineer information

See Kent, WA salary details

$22

$47

$75

How much do packaging engineer jobs pay per hour?

As of Jul 26, 2026, the average hourly pay for packaging engineer in Kent, WA is $47.83, according to ZipRecruiter salary data. Most workers in this role earn between $36.92 and $55.62 per hour, depending on experience, location, and employer.

How does a Packaging Engineer typically collaborate with other departments during the product development process?

Packaging Engineers work closely with teams in product design, marketing, manufacturing, and quality assurance to ensure that packaging solutions are functional, cost-effective, and align with brand requirements. They frequently attend cross-functional meetings to gather input on packaging needs, address manufacturability concerns, and ensure regulatory compliance. This collaborative approach helps streamline the launch of new products and resolves issues quickly, making strong communication skills essential for success in this role.

What Is a Packaging Engineer?

A packaging engineer is an engineer who specializes in developing containers and packages for products that meet the manufacturer’s needs. As a packaging engineer, your responsibilities and duties include working with the product manufacturer to decide what kind of package or container (box, bottle, bag, stretch wrap, molded forms, etc.) is best for the product. You discuss what material (paper, plastic, glass, metal, etc.) is best. You determine the most efficient method to produce the containers and how they will appear. This job often requires travel to meet with clients.

What is the difference between Packaging Engineer vs Packaging Technician?

AspectPackaging EngineerPackaging Technician
CredentialsBachelor's degree in engineering, packaging science, or related fieldHigh school diploma or equivalent; technical training often preferred
Work EnvironmentDesign, development, and testing of packaging solutions; collaboration with R&D and manufacturingImplementation, setup, and troubleshooting of packaging processes on the production line
Employer & Industry UsageManufacturers, consumer goods, food & beverage, pharmaceuticalsPackaging facilities, manufacturing plants, distribution centers

Packaging Engineers focus on designing and developing packaging solutions, requiring technical degrees and working in R&D or design settings. Packaging Technicians handle the practical implementation and maintenance of packaging processes on the production floor, often with technical training. Both roles are essential in the packaging industry but differ in responsibilities and required qualifications.

What does a Packaging Engineer do?

A Packaging Engineer is responsible for designing, developing, and testing packaging solutions for products. They work to ensure that packaging is cost-effective, meets safety and regulatory standards, and protects the product during shipping and storage. Packaging Engineers collaborate with product development, manufacturing, and marketing teams to create packaging that is functional, sustainable, and appealing to customers. They may also research new materials and technologies to improve packaging performance and reduce environmental impact.

What are the key skills and qualifications needed to thrive as a Packaging Engineer, and why are they important?

To thrive as a Packaging Engineer, you need a solid background in materials science, mechanical engineering, and packaging design, often supported by a bachelor's degree in engineering or a related field. Familiarity with CAD software, packaging testing equipment, and regulatory standards such as ISTA or ASTM is typically required. Strong problem-solving, project management, and collaboration skills help you innovate and work effectively with cross-functional teams. These abilities ensure the creation of cost-effective, sustainable, and compliant packaging solutions that protect products and meet business objectives.
More about Packaging Engineer jobs
What are popular job titles related to Packaging Engineer jobs in Kent, WA? For Packaging Engineer jobs in Kent, WA, the most frequently searched job titles are:
What cities near Kent, WA are hiring for Packaging Engineer jobs? Cities near Kent, WA with the most Packaging Engineer job openings:
Packaging Engineer jobs near you
Infographic showing various Packaging Engineer job openings in Kent, WA as of July 2026, with employment types broken down into 93% Full Time, 3% Part Time, and 4% Contract. Highlights an 89% Physical, 4% Hybrid, and 7% Remote job distribution, with an average salary of $99,477 per year, or $47.8 per hour.
Semiconductor Packaging Engineer

Semiconductor Packaging Engineer

Sigma Design

Redmond, WA • On-site

$115K - $145K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 9 days ago

Job description

Semiconductor Packaging Engineer

Sigma Design is a product development, engineering, and manufacturing firm. Based out of the Pacific Northwest, we offer innovative concept through production services to diverse clients around the globe. Sigma Design believes in hiring, developing, and recognizing the best. We offer competitive compensation, a 401(k) with up to 4% company match, quarterly bonus program, 15-days of accrued PTO and 9 company paid holidays. In addition, Sigma Design has multiple options for medical insurance and dental insurance. We also offer voluntary benefits: vision, long-term disability, and life insurance. 
Position Details:
  • This position will be In-Office
  • $115,000 - $140,000 annually
  • This is a contract position with an expected duration of 12 months and the opportunity to be extended. 

Primary Function:
The Semiconductor Packaging Engineer is responsible for developing, executing, and optimizing semiconductor and advanced packaging assembly and integration processes. This role supports the design, fabrication, and validation of advanced electronic packaging solutions for heterogeneous, flexible, and stretchable electronic systems, while collaborating across research, hardware, and manufacturing teams to improve device performance, reliability, and scalability.
Essential Job Functions - Responsibilities:
  • Lead assembly and integration engineering efforts with emphasis on Surface Mount Technology (SMT), Die Bond/Wire Bond processes, and support activities related to molding, laser fabrication, panel or wafer lamination, and component thinning, planarization, and dicing.
  • Develop and implement advanced packaging solutions to enable heterogeneous, flexible, and stretchable integration of electronic components and devices.
  • Design and oversee internal, external, and hybrid manufacturing workflows to accelerate development, integration, and scale-up of advanced electronic packaging technologies.
  • Develop new methods and processes to close technology gaps, improve device performance, and increase manufacturing yield through process innovation and optimization.
  • Design and execute experiments (DOE), analyze experimental results, and apply findings to improve packaging processes, device performance, and yield.
  • Execute hands-on fabrication workflows using advanced packaging and assembly equipment, identify in-line process issues, and propose solutions or workarounds to improve manufacturing performance.
  • Collaborate closely with researchers, hardware engineers, system integration teams, and external manufacturing partners to support the development and production of advanced electronic packaging solutions.
  • Support the development and use of high-performance electronic materials in advanced packaging environments.
  • Contribute to instrumentation development, process characterization, mechanical or layout design, and data analysis methods used in hardware research and development environments.
  • Follow Business Technology policies to protect sensitive data and reduce information security occurrences.

Education and Experience: (Knowledge, Skills, & Abilities)
  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Materials Science, or related technical field or equivalent professional experience required
  • Minimum of 1+ years of relevant work experience in semiconductor manufacturing, advanced packaging, or related electronics manufacturing environments preferred
  • Strong background in semiconductor or advanced packaging processes, including wafer-level or panel-level manufacturing
  • Hands-on experience working with semiconductor assembly and packaging equipment
  • Experience designing and executing Design of Experiments (DOE), analyzing results, and optimizing manufacturing yield
  • Experience collaborating across research and development, hardware engineering, and manufacturing teams
  • Strong analytical, troubleshooting, and problem-solving skills with an innovation and scalability mindset
  • Experience with advanced packaging technologies such as Flexible Printed Circuits (FPC), Printed Circuit Board Assembly (PCBA), 2.5D/3D integration, or related electronic packaging technologies
  • Experience working with back-end-of-line (BEOL) and advanced packaging processes including technologies such as thinning, grinding, dicing, soldering, eutectic bonding, electrochemical deposition or metal finishing, through-silicon vias (TSV), flip-chip bonding, wire or die bonding, bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill processes, and overmolding or encapsulation
  • Experience handling and integrating thinned electronic components as part of advanced packaging workflows
  • Demonstrated success developing or maturing hardware research processes including instrumentation, characterization, mechanical or layout design, and/or advanced data analysis techniques
  • Experience developing or applying high-performance electronic materials in semiconductor or advanced packaging environments
  • Experience with advanced packaging domains including Flexible Printed Circuits (FPC), Multi-Chip Modules (MCM), System-in-Package (SiP), 2.5D/3D integration, Flexible Hybrid Electronics (FHE), or similar technologies preferred
  • Experience performing reliability testing and failure analysis including die or ball shear testing, wire pull testing, X-ray inspection, C-SAM inspection, thermal cycling, and environmental testing preferred
  • Experience with wearable technologies or technical soft goods preferred
  • Experience with hermetic or MEMS packaging, thermal management materials, or injection/transfer molding processes preferred
  • Experience using Finite Element Analysis (FEA) modeling or simulation tools to accelerate design and prevent failures preferred
  • Experience in System-in-Package (SiP) or Multi-Chip Module (MCM) design, manufacturing, and validation preferred
  • Experience with signal integrity or power integrity simulation tools (e.g., HFSS) and validation preferred
  • Strong written and verbal English language communication skills
  • Excellent teamwork/interpersonal skills and the ability to communicate effectively
  • Demonstrated ability to work collaboratively, both within and outside one's own work group
  • Demonstrate commitment and adherence to Sigma Design Core Values
  • Pass a post-offer background verification

Work Environment
Standard lab/production environment. Appropriate safety garments (PPE) must be worn. Occasionally may be required to work in environmental conditions that emulate typical user environments in order to facilitate design testing and validation. Occasionally may be required to travel as required to other facilities, clients, or suppliers. Must be able to stand and work as long as 12 hours in different positions. Must be able to lift up to 50 pounds unassisted.
 

SigmaDesign is an Equal Opportunity Employer

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