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Overnight Rf Ic Design Engineer Jobs in Tempe, AZ

Crane Company

RF Design Engineer Manager

Chandler, AZ · On-site

The RF Design Engineer Manager will drive cross-functional teams to develop best-in-class RF, Microwave and mmW integrated solutions (IMAs). These IMAs will include RF, Power management, Digital ...

Crane Company

Sr. RF Design Engineer

Chandler, AZ · On-site

Crane Aerospace and Electronics has an exciting opportunity fora Sr. RF Design Engineer at our Chandler, AZ location. About Crane: Crane Aerospace & Electronics provides high-performance systems and ...

Raytheon

RF Design Engineer II

Phoenix, AZ

... engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world. Effector RF Design ...

Raytheon

Senior RF Design Engineer

Phoenix, AZ

... engineering expertise to meet the needs of today's mission and stay ahead of tomorrow's threat. Our team solves tough, meaningful problems that create a safer, more secure world. Effector RF Design ...

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All JobsRf Ic Design Engineer JobsOvernight Rf Ic Design Engineer JobsOvernight Rf Ic Design Engineer Jobs in Tempe, AZ

Overnight Rf Ic Design Engineer information

See Tempe, AZ salary details

$35.4K

$112.7K

$175.3K

How much do overnight rf ic design engineer jobs pay per year?

As of Aug 8, 2026, the average yearly pay for overnight rf ic design engineer in Tempe, AZ is $112,711.00, according to ZipRecruiter salary data. Most workers in this role earn between $93,400.00 and $133,100.00 per year, depending on experience, location, and employer.

What does an Overnight RF IC Design Engineer do?

An Overnight RF IC Design Engineer specializes in designing and testing radio frequency integrated circuits (RF ICs) during overnight shifts. These engineers work on developing and optimizing components used in wireless communication devices, such as amplifiers, mixers, and oscillators. Their role involves circuit simulation, layout design, prototype testing, and troubleshooting to ensure performance and reliability. Working overnight may be necessary to support round-the-clock product development or manufacturing processes, especially in global or fast-paced industries.

What are some common challenges faced by an Overnight RF IC Design Engineer, and how can they be managed effectively?

Overnight RF IC Design Engineers often navigate challenges such as tight project deadlines, troubleshooting complex analog and RF circuit issues, and ensuring seamless communication with global teams working across different time zones. Managing these challenges effectively involves strong organizational skills, proactive documentation, and regular updates with daytime engineering teams to maintain project continuity. Additionally, leveraging simulation tools and rigorous testing protocols can help identify and resolve potential design issues before they escalate, ensuring high-quality outcomes even when working independently during overnight shifts.

What are the key skills and qualifications needed to thrive as an Overnight RF IC Design Engineer?

To thrive as an Overnight RF IC Design Engineer, you need a deep understanding of RF circuit design, semiconductor physics, and analog/digital integration, typically supported by a degree in electrical engineering or a related field. Proficiency with industry-standard tools such as Cadence, ADS, and SPICE simulators, along with familiarity with layout and verification processes, is essential. Strong problem-solving abilities, attention to detail, and effective communication skills help you collaborate across teams and troubleshoot complex issues efficiently. These skills ensure the successful design and implementation of high-performance RF integrated circuits that meet stringent specifications and project timelines.

What is the difference between Overnight Rf Ic Design Engineer vs RF Circuit Design Engineer?

AspectOvernight Rf Ic Design EngineerRF Circuit Design Engineer
CredentialsBachelor's or Master's in Electrical Engineering, specialized in RF designBachelor's or Master's in Electrical Engineering, with RF focus
Work EnvironmentDesign labs, office settings, often project-basedDesign labs, office settings, often project-based
Industry UsagePrimarily in semiconductor and integrated circuit companiesIn semiconductor, telecommunications, and electronics industries
Common Search IntentComparing specific RF IC design roles and responsibilitiesUnderstanding RF circuit design roles and career paths

The Overnight Rf Ic Design Engineer focuses specifically on designing integrated RF circuits, often working on chip-level components for wireless devices. The RF Circuit Design Engineer has a broader scope, including designing RF circuits at the board or system level. Both roles require similar technical skills and credentials but differ in scope and application within the industry.

What cities near Tempe, AZ are hiring for Overnight Rf Ic Design Engineer jobs? Cities near Tempe, AZ with the most Overnight Rf Ic Design Engineer job openings:
Overnight Rf Ic Design Engineer jobs near you
Infographic showing various Overnight Rf Ic Design Engineer job openings in Tempe, AZ as of August 2026, with employment types broken down into 1% Internship, 86% Full Time, 8% Part Time, and 5% Contract. Highlights an 84% Physical, 5% Hybrid, and 11% Remote job distribution, with an average salary of $112,711 per year, or $54.2 per hour.

IC Packaging Design Engineer

Comprehensive Resources Inc.

Chandler, AZ • On-site

$138K/yr

Other

Posted 7 days ago

Job description

Job Title: IC Packaging Design Engineer

Location: Chandler, AZ or Hillsboro, OR (100% Onsite)

Duration: Long-Term Contract (12+ Months)

Employment Type: C2C / W2

Openings: 4

Job Description

We are seeking experienced IC Packaging Design Engineers with strong expertise in package substrate design and advanced package layout. The ideal candidate should have hands-on experience with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro Advanced Package Designer (APD/SiP) and a solid understanding of IC package design methodologies.

Required Qualifications
  • Bachelor's or Master's degree in Electrical/Electronics Engineering.
  • Senior Level: 10+ years of IC Packaging / Package Design experience.
  • Mid Level: 4-6+ years (MS) or 6+ years (BS) of relevant experience.
  • Strong hands-on experience with Siemens (Mentor) Xpedition (XPD) (Preferred).
  • Experience with Cadence Allegro APD / SiP is also acceptable.
  • Strong understanding of package substrate design and layout.

Required Skills
  • IC Package Physical Design & Layout
  • Substrate Design & Layout
  • SI/PI Aware Design Implementation
  • Design Rule Compliance (DRC)
  • Design for Performance, Manufacturability, Yield & Reliability
  • Package Floor Planning
  • High-Speed Signal Routing
  • Package Stack-up Design
  • Cross-functional collaboration with SI/PI, Mechanical, and Manufacturing teams

Preferred Skills
  • FCBGA, FCCSP, SiP, or Advanced Packaging experience
  • High-speed interfaces such as PCIe, DDR, HBM, or SerDes
  • Strong problem-solving and debugging skills

Please send your updated resume to:

C2C & W2 candidates are welcome.

Apply