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Module Process Engineer Jobs in Endicott, NY (NOW HIRING)

Digital Design Engineer

Endicott, NY · On-site

$129K/yr

Support test and troubleshooting of systems, modules and sub-assemblies of digital modules, working ... Embedded processors, PCIe, Ethernet, 1553, SERDES, Fiber Optic, DDR3/DDR4 * CAD based schematic ...

Digital Design Engineer

Endicott, NY · On-site

$129K/yr

Support test and troubleshooting of systems, modules and sub-assemblies of digital modules, working ... Embedded processors, PCIe, Ethernet, 1553, SERDES, Fiber Optic, DDR3/DDR4 * CAD based schematic ...

... kernel modules (C language, kbuild/DKMS). * Strong knowledge of core Linux internals (process ... Proficient in systems level C programming and familiar with kernel coding style and static analysis ...

Firmware Engineer II

Greene, NY · On-site

$83K - $130K/yr

Responsible for the design and quality of a single module or component that comprises a larger ... Python for testing, tooling, and process automation; 5. Development applications with ARM ...

Firmware Engineer II

Greene, NY · On-site

$83K - $130K/yr

Responsible for the design and quality of a single module or component that comprises a larger ... Python for testing, tooling, and process automation; 5. Development applications with ARM ...

Eng Sr Prin - HW

Endicott, NY · On-site

$118K - $201K/yr

Lead/Mentor a team of junior engineers * Support test and troubleshooting of systems, modules and ... Embedded processors, PCIe, Ethernet, 1553, SERDES, Fiber Optic, DDR3/DDR4 * CAD based schematic ...

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Showing results 1-20

Module Process Engineer information

See Endicott, NY salary details

$47.2K

$87.8K

$135.9K

How much do module process engineer jobs pay per year?

As of Aug 5, 2026, the average yearly pay for module process engineer in Endicott, NY is $87,760.00, according to ZipRecruiter salary data. Most workers in this role earn between $71,100.00 and $98,200.00 per year, depending on experience, location, and employer.

What is the difference between Module Process Engineer vs Process Engineer?

AspectModule Process EngineerProcess Engineer
CredentialsBachelor's in Chemical, Mechanical, or Industrial Engineering; often certifications in process improvementBachelor's in Engineering or related field; similar certifications in process optimization
Work EnvironmentManufacturing plants, semiconductor, or electronics industries focusing on module assemblyVarious industries including manufacturing, chemical, or energy sectors
Employer & Industry UsageElectronics, semiconductor, and specialized manufacturing companiesBroad industry use across manufacturing, chemical, and industrial sectors

The Module Process Engineer specializes in optimizing processes for specific modules or components within manufacturing, especially in electronics or semiconductor industries. In contrast, the Process Engineer has a broader role across various processes and industries. Both roles require similar technical skills and certifications but differ in focus and application.

What are the key skills and qualifications needed to thrive as a module process engineer, and why are they important?

To thrive as a Module Process Engineer, you need a strong background in chemical engineering, materials science, or a related field, often backed by a relevant bachelor's or master’s degree. Familiarity with process simulation software, statistical process control tools, and experience with semiconductor manufacturing equipment are typically required. Strong analytical thinking, problem-solving abilities, and effective communication skills help you collaborate with cross-functional teams and drive process improvements. These competencies are crucial for optimizing production efficiency, ensuring product quality, and maintaining competitiveness in advanced manufacturing environments.

What is a module process engineer?

A Module Process Engineer is a specialist who designs, develops, and optimizes the manufacturing processes for specific modules or components in industries like semiconductors, electronics, or solar panels. They work to improve process efficiency, yield, and quality while ensuring that production meets technical and safety standards. Module Process Engineers often collaborate with cross-functional teams to troubleshoot issues, implement new technologies, and support scale-up efforts from prototype to mass production.

What are some common challenges faced by module process engineers in semiconductor manufacturing, and how can they be addressed?

Module Process Engineers often encounter challenges such as maintaining process stability, minimizing defects, and meeting tight production schedules in a fast-paced semiconductor environment. These issues require strong analytical skills to quickly identify root causes and implement effective solutions, often while collaborating with cross-functional teams like equipment engineers and quality assurance. Staying updated with the latest process technologies and continuously improving process parameters are key to overcoming these challenges. Effective communication and adaptability are also essential, as priorities can shift rapidly based on production demands.
What cities near Endicott, NY are hiring for Module Process Engineer jobs? Cities near Endicott, NY with the most Module Process Engineer job openings:
Infographic showing various Module Process Engineer job openings in Endicott, NY as of July 2026, with employment types broken down into 93% Full Time, 4% Part Time, and 3% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $87,760 per year, or $42.2 per hour.

Digital Design Engineer

Sapsol Technologies Inc

Endicott, NY • On-site

$129K/yr

Full-time

Re-posted 21 days ago


Job description

Job Description
This role will be supporting engineering development, integration, test and transition to production efforts on complex electronic modules. Candidate will provide electrical engineering support to a dynamic engineering development team, leading first unit test, design verification test, integration and transition to production tasks on complex digital circuit cards and modules.
The successful candidate must possess strong technical aptitude, communication skills and ability to work cross-functionally within the hardware organization and with other engineering disciplines/functions. Must be able to exercise discretion and independent judgment in technical areas.
This position may include the following activities:

  • Design of complex high speed digital circuit card assemblies including PCIe
  • Lead/Mentor a team of junior engineers
  • Support test and troubleshooting of systems, modules and sub-assemblies of digital modules, working directly with program engineering personnel as required
  • Interface with Engineering, Operations, Quality and other supporting functions to drive defect resolution to root cause
  • Generate and implement improvements in product and test design and methodologies to reduce cost, increase yield, and improve throughput
  • Generate and review the technical content of test procedures, drawings, engineering specifications, reports, Engineering Change Orders, and other documentation
  • Interface with governmental customers and suppliers as required
  • Provide training and support to technicians and manufacturing personnel as required
  • Support Root Cause and Corrective Action activities
  • Mentor peers and more junior engineers in areas of expertise


Required Education, Experience, & Skills

  • Typically, a bachelor's degree and 8 years work experience or equivalent experience
  • High speed digital design of circuit card assemblies
  • Experience with the design, build, integration and/or test of complex electronic systems.
  • Able to research and apply electrical engineering principles and theories to solve electrical engineering problems.
  • Eligible for DOD Security Clearance


Preferred Education, Experience, & Skills
Industrial temperature or better digital circuit card design

  • FPGA based circuit card design.
  • Embedded processors, PCIe, Ethernet, 1553, SERDES, Fiber Optic, DDR3/DDR4
  • CAD based schematic capture and simulation (Mentor/Siemens Xpedition)
  • Able to direct layout and routing rules
  • Pre & Post routing simulation using HyperLynx
  • Demonstrated design success - meet difficult design requirements
  • Strong technical writing and verbal communication skills.
  • Motivated self-starter with leadership skills and ability to effectively work in a team environment - Team Leader
  • Excellent problem-solving skills, judgment, and analytical capability.
  • Ability to close on discrete tasking in a timely manner and lead others to closure - Own the Design
  • Experience presenting technical information to program teams and/or customers.