Micro Electronics Jobs in Phoenix, AZ (NOW HIRING)

Spirit is seeking a high-caliber Senior Sales Engineer to accelerate the growth of our advanced microelectronics engineering, backend foundry services, custom assembly, and MIL-STD testing business units.

This is not a transactional, off-the-shelf component sales role. You will combine deep technical acumen in semiconductor packaging and EEE components with sharp commercial strategy to sell customized, high-reliability engineering solutions. Serving as the vital technical bridge between Spirit’s internal engineering team and our clients, you will translate complex backend architectures into bulletproof value propositions. Your primary focus will be capturing market share in hyper-stringent industries where failure is not an option: Aerospace & Defense, Automotive (EV Sensors & Qualification), Medical Devices, and Advanced MEMS / Micro-electronic Modules.

• Strategic Account Development: Cultivate and expand deep-level technical relationships with Tier 1 aerospace, defense, automotive, and medical device accounts.
• Value-Driven Technical Selling: Conduct technical presentations, capabilities briefings, and facility tours showcasing Spirit’s sophisticated foundry services, advanced packaging/assembly, and MIL-STD qualification testing.
• Collaborative Solution Architecting: Partner closely with internal IC Packaging, Test Engineering, and Program Management teams to design customized backend workflows that meet strict customer application and reliability targets.
• Deal Execution & RFP Capture: Own the technical sales lifecycle for complex engineering services—from initial technical discovery and RFP/RFQ mapping to negotiating high-value contracts and closing deals.
• Market Intelligence & Technical Leadership: Stay ahead of evolving industry standards (AEC-Q100, MIL-STD-883/750, ISO 13485) to position Spirit as the premier high-reliability backend partner. Represent the company at key semiconductor and aerospace trade shows.
• Pipeline Management: Maintain an accurate, data-driven sales pipeline using CRM tools, working in lockstep with Corporate Sales and Business Development to align with …

• Industry Experience: 5+ years of successful Technical Sales, Sales Engineering, or Applications Engineering experience, specifically selling high-reliability components, semiconductor backend services (OSAT), micro-electronics packaging, or complex testing services.
• Technical Foundation: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a deeply technical field. A strong semiconductor/microelectronics background is required.
• High-Rel Domain Expertise: High familiarity with the requirements of mission-critical ecosystems:
  • Components & Packaging: Solid understanding of EEE components, wafer bumping, wire bonding, flip‑chip, MEMS, and EV sensors.
  • Standards: Deep familiarity with MIL-STD testing procedures, with a strong understanding of what it takes to qualify hardware for extreme environments (AEC‑Q100, IATF 16949, ISO 13485).
  • Supply Chain: Familiarity with supply chain logistics and inventory management concepts unique to aerospace, defense, and high-reliability manufacturing.
• Commercial Track Record: Proven ability to meet or exceed quotas in long-cycle, high-value, highly technical B2B or government sales environments.
• Elite Communication: Ability to code‑switch effortlessly—speaking "physics-of-failure" with a customer's packaging engineer, and "ROI/Timeline" with their procurement director.
• Tools & Travel: Proficiency in CRM/ERP platforms and MS Excel. Willingness to travel for face‑to‑face customer engineering reviews and industry events.

• High‑Value, High‑Stakes Portfolio: You won't be competing on pennies per unit for commoditized chips. You will sell high‑margin, critical engineering and qualification solutions that protect mission‑critical applications.
• Collaborative Culture: Work alongside brilliant engineering minds in an agile environment where your technical field input directly shapes our service roadmap and future capabilities.