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Rivian is on a mission to keep the world adventurous forever. This goes for the emissions-free Electric Adventure Vehicles we build, and the curious, courageous souls we seek to attract. 

As a company, we constantly challenge what’s possible, never simply accepting what has always been done. We reframe old problems, seek new solutions and operate comfortably in areas that are unknown. Our backgrounds are diverse, but our team shares a love of the outdoors and a desire to protect it for future generations. 

Thermal design and validation of low-voltage electrical hardware is a mission-critical function at Rivian, ensuring the long-term reliability and performance of our core electronic control units (ECUs) in the most demanding vehicle environments. In this role, you will lead the development of high-fidelity thermal strategies for our in-house ECU portfolio—bridging the gap between silicon-level performance and vehicle-level environmental integration.

You will be responsible for owning the "digital-to-physical" loop, from chip/package-level modeling to system-wide steady-state and transient simulations. By establishing the "gold standard" for simulation-to-test correlation, you will ensure our hardware survives rigorous thermal cycling and AEC-Q reliability standards. This role involves pushing the boundaries of electronic packaging—optimizing thermal stack-ups, TIM interfaces, and PCB-to-chassis heat pathways—to ensure our vehicle electronics achieve industry-leading efficiency, minimal mass, and mission-critical thermal reliability.

• Lead thermal strategy, conceptualize designs, and perform numerical simulations to address complex thermal challenges for leading-edge vehicle electrical hardware.
• Develop electronic cooling and packaging solutions for next-generation vehicle architectures and electronic systems.
• Define and support CFD workflows. Perform detailed steady-state and transient simulations—ranging from chip/package-level and PCB-level to full-system integration—as well as Board Level Reliability (BLR) analysis to drive design optimization for high-power thermal requirements.
• Establish simulation-to-test correlation methodologies. Build physical mockups, manage thermocouple instrumentation, and execute extensive chamber testing to validate and refine digital models.
• Define and execute board-mounting and heat-sinking strategies for LV systems. Optimize PCB layout, via density, and thermal pathways to the chassis to ensure component junction temperatures remain within derating limits.
• Provide detailed, actionable design feedback—including thermal stack-ups, cooling layouts, and material selections—to engineering teams responsible for vehicle electronics design.
• Analyze the impact of the under-hood vehicle environment on low-voltage electronics and define design requirements that account for real-world environmental stressors.
• Develop strategies for optimizing thermal and mechanical components by minimizing mass, cost, and material usage.
• Drive the characterization and selection of thermal hardware, including blowers, fans, heat pipes and heat sinks, utilizing advanced airflow measurement techniques to verify system performance.
• Author detailed technical documentation, present simulation results to cross-functional stakeholders, lead trade-off studies, and provide expert support for reliability qualification and product readiness milestones.
• Provide actionable design suggestions regarding thermal stack-ups, Thermal Interface Material (TIM) selection, assembly tolerances, and stack preload to identify and mitigate long-term thermal reliability risks.
• Coordinate and work with cross-functional analysts to align on analysis methodologies and design constraints.
• Own and drive thermal methodologies, deliverables, and test specifications to support modeling efforts.
• Work in multidisciplinary teams to drive product and engineering excellence.

• Education & Experience:
  • Master’s degree in Mechanical or Thermal Engineering (or equivalent) with 6-8+ years or PhD in Mechanical or Thermal Engineering (or equivalent)
  • 4-6+ years of relevant industry experience in providing electronic cooling solutions, including thermal layout, heat sink design, fan/blower development, and characterization of Thermal Interface Materials (TIMs).
• Advanced Simulation Suite: Expert-level proficiency in industry-standard CFD and thermal analysis tools, including Ansys Icepak (Classic & EDT), Fluent, Flotherm, and Star-CCM+. Advanced competency in pre-and post-processing software—specifically ANSA and META—for geometry simplification, high-fidelity meshing, and data visualization.
• Component-to-System Modeling: Experience with chip and IC package-level thermal modeling is highly preferred, demonstrating an understanding of heat transfer from the silicon junction through the board stack-up.
• Hands-On Validation: Proven experience with thermal prototype builds, thermocouple instrumentation, data acquisition (DAQ) systems, and extensive environmental chamber testing.
• Core Technical Knowledge: Deep understanding of conduction, convection, and radiation. Solid grasp of under-hood vehicle thermal management, including the environmental impacts on low-voltage electronic reliability.
• Standards & Compliance: Solid understanding of automotive reliability standards, including AEC-Q stress test qualification, and relevant ISO standards for electronic component reliability.
• Engineering Acumen: Strong experience with 3D CAD, scripting for automation/data analysis, and robust failure analysis methodologies..
• Adaptability: Proven ability to thrive in a fast-paced, iterative R&D environment where design requirements evolve rapidly based on vehicle integration and testing feedback.
• Problem-Solving: A "first-principles" approach to engineering; ability to simplify complex thermal problems into actionable design solutions while maintaining a high standard for safety and performance.
• Leadership & Communication: Excellent verbal and written communication skills with a proven track record of documenting test results and leading or mentoring multidisciplinary engineering teams.

The salary range for this role is $149,000 - $187,000 for Palo Alto, CA based applicants and $137,000 - $172,000 for Irvine, CA based applicants. This is the lowest to highest salary we in good faith believe we would pay for this role at the time of this posting. An employee’s position within the salary range will be based on several factors including, but not limited to, specific competencies, relevant education, qualifications, certifications, experience, skills, geographic location, shift, and organizational needs. The successful candidate may be eligible for annual performance bonus and equity awards. 

We offer a comprehensive package of benefits for full-time and part-time employees, their spouse or domestic partner, and children up to age 26, including but not limited to paid vacation, paid sick leave, and a competitive portfolio of insurance benefits including life, medical, dental, vision, short-term disability insurance, and long-term disability insurance to eligible employees. You may also have the opportunity to participate in Rivian’s 401(k) Plan and Employee Stock Purchase Program if you meet certain eligibility requirements. Full-time employee coverage is effective on their first day of employment. Part-time employee coverage is effective the first of the month following 90 days of employment. More information about benefits is available at rivianbenefits.com.

You can apply for this role through careers.rivian.com (or through internal-careers-rivian.icims.com if you are a current employee). This job is not expected to be closed any sooner than May 15, 2026.

Rivian is an equal opportunity employer and complies with all applicable federal, state, and local fair employment practices laws. All qualified applicants will receive consideration for employment without regard to race, color, religion, national origin, ancestry, sex, sexual orientation, gender, gender expression, gender identity, genetic information or characteristics, physical or mental disability, marital/domestic partner status, age, military/veteran status, medical condition, or any other characteristic protected by law.

Rivian is committed to ensuring that our hiring process is accessible for persons with disabilities. If you have a disability or limitation, such as those covered by the Americans with Disabilities Act, that requires accommodations to assist you in the search and application process, please email us at candidateaccommodations@rivian.com.

Rivian may collect, use and disclose your personal information or personal data (within the meaning of the applicable data protection laws) when you apply for employment and/or participate in our recruitment processes (“Candidate Personal Data”). This data includes contact, demographic, communications, educational, professional, employment, social media/website, network/device, recruiting system usage/interaction, security and preference information. Rivian may use your Candidate Personal Data for the purposes of (i) tracking interactions with our recruiting system; (ii) carrying out, analyzing and improving our application and recruitment process, including assessing you and your application and conducting employment, background and reference checks; (iii) establishing an employment relationship or entering into an employment contract with you; (iv) complying with our legal, regulatory and corporate governance obligations; (v) recordkeeping; (vi) ensuring network and information security and preventing fraud; and (vii) as otherwise required or permitted by applicable law. 

Rivian may share your Candidate Personal Data with (i) internal personnel who have a need to know such information in order to perform their duties, including individuals on our People Team, Finance, Legal, and the team(s) with the position(s) for which you are applying; (ii) Rivian affiliates; and (iii) Rivian’s service providers, including providers of background checks, staffing services, and cloud services. 

Rivian may transfer or store internationally your Candidate Personal Data, including to or in the United States, Canada, the United Kingdom, and the European Union and in the cloud, and this data may be subject to the laws and accessible to the courts, law enforcement and national security authorities of such jurisdictions.  

Please note that we are currently not accepting applications from third party application services.

• Education & Experience:
  • Master’s degree in Mechanical or Thermal Engineering (or equivalent) with 6-8+ years or PhD in Mechanical or Thermal Engineering (or equivalent)
  • 4-6+ years of relevant industry experience in providing electronic cooling solutions, including thermal layout, heat sink design, fan/blower development, and characterization of Thermal Interface Materials (TIMs).
• Advanced Simulation Suite: Expert-level proficiency in industry-standard CFD and thermal analysis tools, including Ansys Icepak (Classic & EDT), Fluent, Flotherm, and Star-CCM+. Advanced competency in pre-and post-processing software—specifically ANSA and META—for geometry simplification, high-fidelity meshing, and data visualization.
• Component-to-System Modeling: Experience with chip and IC package-level thermal modeling is highly preferred, demonstrating an understanding of heat transfer from the silicon junction through the board stack-up.
• Hands-On Validation: Proven experience with thermal prototype builds, thermocouple instrumentation, data acquisition (DAQ) systems, and extensive environmental chamber testing.
• Core Technical Knowledge: Deep understanding of conduction, convection, and radiation. Solid grasp of under-hood vehicle thermal management, including the environmental impacts on low-voltage electronic reliability.
• Standards & Compliance: Solid understanding of automotive reliability standards, including AEC-Q stress test qualification, and relevant ISO standards for electronic component reliability.
• Engineering Acumen: Strong experience with 3D CAD, scripting for automation/data analysis, and robust failure analysis methodologies..
• Adaptability: Proven ability to thrive in a fast-paced, iterative R&D environment where design requirements evolve rapidly based on vehicle integration and testing feedback.
• Problem-Solving: A "first-principles" approach to engineering; ability to simplify complex thermal problems into actionable design solutions while maintaining a high standard for safety and performance.
• Leadership & Communication: Excellent verbal and written communication skills with a proven track record of documenting test results and leading or mentoring multidisciplinary engineering teams.