Req ID: JR91774 Memory Design Engineer, HBM Our vision is to transform how the world uses ... This role collaborates globally across design, verification, product engineering, test, probe ...
Req ID: JR91774 Memory Design Engineer, HBM Our vision is to transform how the world uses ... This role collaborates globally across design, verification, product engineering, test, probe ...
This role collaborates globally across design, verification, product engineering, test, probe ... The position drives innovation in future memory generations and supplies to silicontosystem ...
This role collaborates globally across design, verification, product engineering, test, probe ... The position drives innovation in future memory generations and supplies to silicontosystem ...
Req ID: JR101081 Circuit / Memory Design Engineer | HBM - TPG Our vision is to transform how the ... The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads ...
Req ID: JR101081 Circuit / Memory Design Engineer | HBM - TPG Our vision is to transform how the ... The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads ...
The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads ... As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and ...
As a Senior Memory Design Engineer at Micron, you will have the outstanding opportunity to impact ... Partner with Probe, Test, Product Engineering, Assembly, Marketing, and Process Integration to ...
As a Senior Memory Design Engineer at Micron, you will have the outstanding opportunity to impact ... Partner with Probe, Test, Product Engineering, Assembly, Marketing, and Process Integration to ...
Responsibilities * Design digital, analog, and memory core circuits using CMOS logic and ... Collaborate with global build, verification, product engineering, test, probe, process integration ...
Responsibilities * Design digital, analog, and memory core circuits using CMOS logic and ... Collaborate with global build, verification, product engineering, test, probe, process integration ...
The Memory Design Engineer develops and optimizes digital and analog circuits for advanced DRAM products. This role focuses on circuit design, simulation, validation, and multi-functional ...
The Memory Design Engineer develops and optimizes digital and analog circuits for advanced DRAM products. This role focuses on circuit design, simulation, validation, and multi-functional ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
The Memory Design Engineer develops and optimizes digital and analog circuits for advanced DRAM products. This role focuses on circuit design, simulation, validation, and multi-functional ...
The Memory Design Engineer develops and optimizes digital and analog circuits for advanced DRAM products. This role focuses on circuit design, simulation, validation, and multi-functional ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
... memory products ... This role collaborates globally across design, verification, product engineering, test, probe ...
Circuit / Memory Design Engineer | HBM - TPG Richardson, Texas, United States of America Pubbli[...]
Richardson, TX · On-site
## Circuit / Memory Design Engineer | HBM - TPGRichardson, Texas, United States of AmericaApply ... The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads ...
Circuit / Memory Design Engineer | HBM - TPG Richardson, Texas, United States of America Pubbli[...]
Richardson, TX · On-site
## Circuit / Memory Design Engineer | HBM - TPGRichardson, Texas, United States of AmericaApply ... The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads ...
Contribute to new product opportunities by supporting overall circuit design, layout, and ... Bachelor's degree in Electrical Engineering or related field (or equivalent practical experience ...
Contribute to new product opportunities by supporting overall circuit design, layout, and ... Bachelor's degree in Electrical Engineering or related field (or equivalent practical experience ...
Memory Product Engineer information
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Memory Design Engineer, HBM
Richardson, TX • On-site
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Re-posted 8 days ago
Micron Technology rating
8.6
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Job description
Req ID: JR91774 Memory Design Engineer, HBM
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. You will collaborate with Micron’s various design and verification teams around the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time‑to‑market, and customer satisfaction.
The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment.
Responsibilities- Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.
- Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.
- Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.
- Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.
- Prepare and maintain design documentation while giving best‑known practices and departmental training.
- Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.
- Lead layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.
- Prepare project status reports and lead design reviews to communicate progress and technical decisions.
- Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.
- Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
- Strong analytical and problem‑solving skills with validated significant technical contributions and a record of innovation.
- Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.
- Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.
- Self‑motivated with strong problem‑solving abilities and an aim to discover new solutions.
- Deep knowledge of industry‑specific technologies and competitive trends.
- Excellent communication and interpersonal skills for multi‑functional collaboration.
- BS or MS in Electrical Engineering or related field plus 3 years of experience in DRAM design, product, or system.
Job Profile(s): Semiconductor Design Engineer 2 - Semiconductor Design Engineer 3
Relocation Level: TBD
Benefits- Choice of medical, dental, and vision plans available in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget.
- Benefit programs that help protect income if unable to work due to illness or injury.
- Paid family leave.
- Robust paid time‑off program and paid holidays.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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About Micron Technology
Sourced by ZipRecruiter
Industry
Semiconductor and electronic component manufacturing
Company size
10,000+ Employees
Headquarters location
Boise, ID, US
Year founded
2019