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Manager Intel Quantum Computing Jobs in North Carolina

Coordination with management and internal teams * Automating tasks through appropriate tools and ... Quantum computing * Interactive debugging tool (XDC) and dump reading experience * Attention to ...

NC · On-site

$17 - $22.75/hr

Risk Management - Help identify and mitigate supply chain risks. * Process Improvement - Analyze ... At IBM, we pride ourselves on being an early adopter of artificial intelligence, quantum computing ...

Procurement Intern: 2027

Asheville, NC

$17 - $23/hr

Risk Management - Help identify and mitigate supply chain risks. * Process Improvement - Analyze ... At IBM, we pride ourselves on being an early adopter of artificial intelligence, quantum computing ...

Procurement Intern: 2027

Research Triangle Park, NC · On-site

$17 - $22.75/hr

Risk Management - Help identify and mitigate supply chain risks. * Process Improvement - Analyze ... At IBM, we pride ourselves on being an early adopter of artificial intelligence, quantum computing ...

... computing products. You will lead vulnerability management and firmware/software coding tasks for ... Intel PTT, Intel TXT). * Experience collaborating in a leadership capacity across multiple ...

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Manager Intel Quantum Computing information

What is the difference between Manager Intel Quantum Computing vs Quantum Software Engineer?

AspectManager Intel Quantum ComputingQuantum Software Engineer
Required CredentialsAdvanced degree in Computer Science, Physics, or related field; leadership experienceDegree in Computer Science, Physics, or Engineering; programming skills in quantum languages
Work EnvironmentTeam leadership, project management, collaboration with R&D teamsDeveloping and testing quantum algorithms, coding in Qiskit, Cirq, or similar
Employer & Industry UsageResearch labs, tech companies, industry R&D departmentsTech firms, startups, research institutions focused on quantum software development

The main difference is that the Manager Intel Quantum Computing oversees projects and teams, focusing on strategy and coordination, while the Quantum Software Engineer concentrates on developing and implementing quantum algorithms. Both roles require technical knowledge, but their responsibilities and work focus differ significantly.

What are the most commonly searched types of Intel Quantum Computing jobs in North Carolina?

The most popular types of Intel Quantum Computing jobs in North Carolina are:

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For Manager Intel Quantum Computing jobs in North Carolina, the most frequently searched job titles are:

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The top searched job categories for Manager Intel Quantum Computing jobs in North Carolina are:

What cities in North Carolina are hiring for Manager Intel Quantum Computing jobs?

Cities in North Carolina with the most Manager Intel Quantum Computing job openings:

Infographic showing various Manager Intel Quantum Computing job openings in North Carolina as of August 2026, with employment types broken down into 84% Full Time, 13% Part Time, 1% Temporary, 1% Contract, and 1% Nights. Highlights an 84% Physical, 3% Hybrid, and 13% Remote job distribution.

Vice President of Foundry Operations

Morrisville, NC

QUANTUM COMPUTING, INC.
Computer and Peripheral Equipment Manufacturing • 51 - 200 employees

Full-time

Posted 12 days ago


Job description

Job Title: Vice President of Foundry Operations

Location: Morrisville, NC

Division: Nhanced


About Us: 

Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cyber security as well as remote sensing applications.

Scope of the Job:

This position directs all development, pilot-line, and high-volume manufacturing (HVM) operations for a $100M production scale facility utilizing sub-micron hybrid bonding tech and supporting >100 on-site employees. This unique leadership role bridges low-volume R&D scaling for multi-size, multi-substrate architectures with the operational rigor of a 24/7 high-volume 300mm manufacturing line. 

Duties / Responsibilities:

  • P&L & Dual-Mode Operations: Own the operating budget, CapEx, and line-balancing for a hybrid facility that simultaneously handles high-mix/low-volume R&D (50mm–200mm) and high-volume 300mm production.
  • Hybrid Bonding Execution: Drive operational excellence and yield optimization across sub-micron particle-sensitive processes, specifically Die-to-Wafer (D2W) and Wafer-to-Wafer (W2W) hybrid bonding.
  • Multi-Substrate Engineering Control: Supervise the intake, handling, and custom processing variations for a wide variety of substrate materials (e.g., Silicon, Glass, Compound Semiconductors).
  • Advanced Process Management: Oversee a complex process flow including Custom BEoL (Back-End-of-Line), TSV (Through-Silicon Via) insertion and reveal, precision wafer thinning, and silicon/glass interposer fabrication.
  • Team Leadership & Scale: Lead, mentor, and align a 100+ person multi-disciplinary team comprising cleanroom operators, equipment technicians, pilot-line development engineers, and HVM production supervisors.
  • Yield & Cleanroom Discipline: Enforce strict surface-preparation and contamination-control protocols required for successful hybrid bonding, ensuring high reliability and SPC compliance. 

Required Skills & Experience:

  • Education: Bachelor’s degree in Materials Science, Chemical, Mechanical, or Electrical Engineering; Master’s or Ph.D. with a focus on advanced semiconductor packaging is highly preferred.
  • Experience: Minimum 10 years in advanced semiconductor manufacturing or packaging, with at least 5 years of experience managing a fab line that bridges pilot development and high-volume manufacturing.
  • Technical Expertise: Direct operational exposure to hybrid bonding, TSV reveal, CMP (Chemical Mechanical Planarization) for surface flatness, precision wafer thinning/carrier bonding, and multi-size wafer handling (50mm to 300mm).
  • Operational Capabilities: Demonstrated ability to manage rapid product-mix changes on development lines while maintaining uptime, OTD (On-Time Delivery), and cycle-time discipline on an HVM line.

Quantum Computing Inc. (QCi) is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law.

Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above. Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.