... IC packages ... Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging ...
... IC packages ... Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging ...
... IC packages ... Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging ...
... IC packages ... Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging ...
IC packaging Technical Program Manager
Santa Clara, CA · On-site
$150K - $194K/yr
This facility will produce chips for applications such as power management IC, display drivers ... Must be familiar with all phases of IC packaging processes and equipment. The TPM will coordinate ...
IC packaging Technical Program Manager
Santa Clara, CA · On-site
$150K - $194K/yr
This facility will produce chips for applications such as power management IC, display drivers ... Must be familiar with all phases of IC packaging processes and equipment. The TPM will coordinate ...
Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging ... You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams ...
Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging ... You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams ...
IC Packaging Engineer
Cupertino, CA · On-site
$150K - $225K/yr
... semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor ... Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At ...
IC Packaging Engineer
Cupertino, CA · On-site
$150K - $225K/yr
... semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor ... Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At ...
IC Packaging Engineer
$150K - $225K/yr
... semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor ... Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At ...
IC Packaging Engineer
$150K - $225K/yr
... semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor ... Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At ...
IC Packaging Engineer
Cupertino, CA · On-site
$150K - $225K/yr
... semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor ... Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At ...
IC Packaging Engineer
Cupertino, CA · On-site
$150K - $225K/yr
... semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor ... Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At ...
IC Packaging Engineer
Cupertino, CA · On-site
$150K - $225K/yr
... semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor ... Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At ...
IC Packaging Engineer
Cupertino, CA · On-site
$150K - $225K/yr
... semiconductor package levels. Optimize advanced Integrated Circuit (IC) design scheme/floor ... Analyze simulation and measurement results to enhance product thermal management. 40 hours/week. At ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$148K/yr
## IC Packaging Design & Layout EngineerApplyremote type: Onsite Requiredlocations: Cambridge, MAtime ... Able to manage a task with multiple cross functional members and effectively communicates status to ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$148K/yr
## IC Packaging Design & Layout EngineerApplyremote type: Onsite Requiredlocations: Cambridge, MAtime ... Able to manage a task with multiple cross functional members and effectively communicates status to ...
... of management, and the freedom to make meaningful contributions in a setting that encourages ... Requisition ID: 78373 Description Join Skyworks' Advanced IC Packaging team and play a key role in ...
New
... of management, and the freedom to make meaningful contributions in a setting that encourages ... Requisition ID: 78373 Description Join Skyworks' Advanced IC Packaging team and play a key role in ...
New
Senior IC Packaging Engineer
San Jose, CA · On-site
$122K - $168K/yr
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and ... Influence product roadmap, risk management, and investment decisions through technical insight.
Senior IC Packaging Engineer
San Jose, CA · On-site
$122K - $168K/yr
Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and ... Influence product roadmap, risk management, and investment decisions through technical insight.
Technical Program Manager, IC Development
Richardson, TX · Hybrid
$116K - $150K/yr
As our Technical Program Manager, IC Development , you should have specific technical expertise in ... an extensive benefits package offering including, but not limited to PTO, Holiday Pay, full ...
Technical Program Manager, IC Development
Richardson, TX · Hybrid
$116K - $150K/yr
As our Technical Program Manager, IC Development , you should have specific technical expertise in ... an extensive benefits package offering including, but not limited to PTO, Holiday Pay, full ...
This leader will be accountable for setting team direction, developing talent, managing cross ... Deep expertise in IC electronic packaging structures, assembly processes, reliability testing and ...
This leader will be accountable for setting team direction, developing talent, managing cross ... Deep expertise in IC electronic packaging structures, assembly processes, reliability testing and ...
General Summary This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization ... Ability to manage competing priorities across multiple programs and business units. * Demonstrated ...
General Summary This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization ... Ability to manage competing priorities across multiple programs and business units. * Demonstrated ...
We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of ... Collaborate with and manage multiple foundries and OSATs to advance packaging solutions from ...
We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of ... Collaborate with and manage multiple foundries and OSATs to advance packaging solutions from ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$82K - $220K/yr
The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced ... Able to manage a task with multiple cross functional members and effectively communicates status to ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$82K - $220K/yr
The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced ... Able to manage a task with multiple cross functional members and effectively communicates status to ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$82K - $220K/yr
The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced ... Able to manage a task with multiple cross functional members and effectively communicates status to ...
IC Packaging Design & Layout Engineer
Cambridge, MA · On-site
$82K - $220K/yr
The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced ... Able to manage a task with multiple cross functional members and effectively communicates status to ...
Understanding IC package design requirements for high-speed interfaces and setup constraints manager * Interface with the IC physical design teams for optimizing the die floor plan * Experience in ...
Quick apply
Understanding IC package design requirements for high-speed interfaces and setup constraints manager * Interface with the IC physical design teams for optimizing the die floor plan * Experience in ...
Packaging Assembly Engineer
Austin, TX · On-site
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Good program management skill
Packaging Assembly Engineer
Austin, TX · On-site
We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In ... Good program management skill
Package types include plastic molded leadframe packages, ceramic packages and metal packages for RF and Microwave IC's. We are looking for an individual who has a proven track record of managing ...
Package types include plastic molded leadframe packages, ceramic packages and metal packages for RF and Microwave IC's. We are looking for an individual who has a proven track record of managing ...
Manager Ic Packaging information
See salary details
$29.5K - $39.8K
5% of jobs
$39.8K - $50K
7% of jobs
$50K - $60.3K
9% of jobs
$61.8K is the 25th percentile. Wages below this are outliers.
$60.3K - $70.6K
26% of jobs
$70.6K - $80.9K
2% of jobs
The median wage is $81.6K / yr.
$80.9K - $91.1K
15% of jobs
$91.1K - $101.4K
7% of jobs
$105.9K is the 75th percentile. Wages above this are outliers.
$101.4K - $111.7K
9% of jobs
$111.7K - $122K
10% of jobs
$122K - $132.2K
6% of jobs
$132.2K - $142.5K
4% of jobs
$29.5K
$87.7K
$142.5K
How much do manager ic packaging jobs pay per year?
As of Sep 10, 2026, the average yearly pay for manager ic packaging in the United States is $87,669.00, according to ZipRecruiter salary data. Most workers in this role earn between $62,500.00 and $112,500.00 per year, depending on experience, location, and employer.
What are popular job titles related to Manager Ic Packaging jobs?
For Manager Ic Packaging jobs, the most frequently searched job titles are:
Senior IC Packaging Development Engineer
Santa Clara, CA • On-site
Nvidia Corporation •
Computer and Electronic Product Manufacturing • 10K+ employees10,000+ employees
Full-time
Re-posted 27 days ago
Nvidia rating
9.6
Based on 18 frontline employees who took The Breakroom Quiz
6th of 247 rated software companies
Job description
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction. Prior knowledge of Package related Failure Analysis is beneficial.
What you will be doing:
What we need to see:
With competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. If you're creative and autonomous with a real passion for your work, we want to hear from you!
Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 270,250 USD for Level 5, and 216,000 USD - 345,000 USD for Level 6.
You will also be eligible for equity and benefits.
Applications for this job will be accepted at least until July 19, 2026.
This posting is for an existing vacancy.
NVIDIA uses AI tools in its recruiting processes.
NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
What you will be doing:
- Package Development & Prototyping: Drive the process, mechanical, thermal, and material evaluation of the latest IC packages. Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases.
- Material Characterization: Pioneer new packaging & die-level processing methodologies and evaluate innovative packaging materials (e.g., molding compounds, substrates, adhesives).
- Failure Analysis & Debug: Coordinate comprehensive physical and electrical failure analysis on prototype builds, reliability-tested components to determine root causes of failures.
- Multi-functional Collaboration: You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams, process & product engineering. Collaborate with foundries and OSAT (Outsourced Semiconductor Assembly and Test) partners to develop & test the required processes, tooling, and workflows.
What we need to see:
- B.S., M.S., or Ph.D., or equivalent experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
- Packaging Expertise: Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
- Experience: 12+ years of hands-on experience in IC packaging development and/or package design, NPI (New Product Introduction).
- Design & Simulation Tools: Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and Finite Element Modeling (FEM) tools like ANSYS or ABAQUS is a strong plus.
- FA Tooling Proficiency: At a minimum, you'll need basic understanding of advanced packaging related FA techniques and equipment, such as SEM, EDX, CSAM, X-Ray, and LIT.
With competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. If you're creative and autonomous with a real passion for your work, we want to hear from you!
Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 270,250 USD for Level 5, and 216,000 USD - 345,000 USD for Level 6.
You will also be eligible for equity and benefits.
Applications for this job will be accepted at least until July 19, 2026.
This posting is for an existing vacancy.
NVIDIA uses AI tools in its recruiting processes.
NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
About Nvidia
Sourced by ZipRecruiter
NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It's a unique legacy of innovation that's fueled by great technology--and amazing people. Today, we're tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what's never been done before takes vision, innovation, and the world's best talent.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Santa Clara, CA, US