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Internship Software Reverse Engineer Jobs in Arizona

... repair reverse engineering, including material selection, parameter optimization, equipment ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: • Bachelor ...

FPGA Engineer

Phoenix, AZ

$128.90K - $165.60K/yr

Apply Now RTL, C/C++, Python, VHDL, Verilog, Tcl, cryptography, hardware, embedded software, System ... reverse engineering, cocotb, pyuvm Full Time Travel required to 10%. Must be able to apply for and ...

About Automation Engineering Roles at Danaher Are you energized by solving technical problems ... internship start * Experience with hands-on lab testing and technical documentation (e.g., lab ...

About Automation Engineering Roles at Danaher Are you energized by solving technical problems ... internship start * Experience with hands-on lab testing and technical documentation (e.g., lab ...

About Automation Engineering Roles at Danaher Are you energized by solving technical problems ... internship start * Experience with hands-on lab testing and technical documentation (e.g., lab ...

We are seeking a full-time Software Engineer 1 at our office in Chandler, AZ. In this role, you ... Outstanding academics (cumulative GPA greater than or equal to 3.5) * Previous work or internship ...

Test Module Development Engineer

Phoenix, AZ · On-site

$94.30K - $133.20K/yr

... repair reverse engineering, including material selection, parameter optimization, equipment ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: • Bachelor ...

NET Core Software Engineer 1 in Chandler, AZ. In this role, you will be responsible for developing ... internship experience in design, particularly for consumer products Company : WHERE DO WE START?

... experience, internship experience and / or schoolwork/classes/research. The preferred ... Engineering or in a related STEM field. * 4+ years of experience in software development (e.g., C#/

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Internship Software Reverse Engineer information

What are the key skills and qualifications needed to thrive as an Internship Software Reverse Engineer, and why are they important?

To thrive as an Internship Software Reverse Engineer, you need a strong understanding of programming languages (such as C/C++), computer architecture, and operating systems, often supported by coursework or relevant project experience. Familiarity with tools like IDA Pro, Ghidra, debuggers, and possibly certifications like OSCP or CEH can be valuable. Analytical thinking, attention to detail, and perseverance are important soft skills that set candidates apart in this role. These competencies enable you to effectively dissect software, uncover vulnerabilities, and contribute to secure software development.

What types of projects or tasks can an Internship Software Reverse Engineer expect to work on during their internship?

As an Internship Software Reverse Engineer, you will typically assist in analyzing and understanding software binaries, identifying vulnerabilities, and documenting findings. Interns often work on real-world projects involving malware analysis, debugging, and creating tools to automate reverse engineering tasks. You will collaborate closely with experienced engineers, security analysts, and sometimes legal or compliance teams, gaining exposure to industry-standard tools and methodologies. This hands-on experience not only builds technical proficiency but also enhances problem-solving and teamwork skills, laying a strong foundation for a career in cybersecurity or software engineering.

What does an Internship Software Reverse Engineer do?

An Internship Software Reverse Engineer assists in analyzing and understanding how software works by deconstructing its code, often without access to source files. Interns in this role typically use specialized tools to examine compiled programs, identify vulnerabilities, and help create documentation or patches. Their work can support cybersecurity efforts, software compatibility, or malware analysis. The internship provides hands-on experience with reverse engineering techniques and tools in a supervised learning environment.

What is the difference between Internship Software Reverse Engineer vs Software Developer?

AspectInternship Software Reverse EngineerSoftware Developer
Required CredentialsTypically pursuing or recent graduate in Computer Science or related fieldBachelor's degree in Computer Science or related field often required
Work EnvironmentInternship setting, often in cybersecurity or software firmsFull-time employment in various industries including tech, finance, etc.
Employer & Industry UsageUsed in cybersecurity, software security firms, tech companiesUsed across all software development industries
Comparison Search IntentUnderstanding entry-level reverse engineering rolesUnderstanding software development roles

The Internship Software Reverse Engineer role focuses on analyzing and understanding software through reverse engineering techniques, often in cybersecurity contexts. In contrast, a Software Developer designs, codes, and maintains software applications. While both roles require programming skills and a background in computer science, the internship emphasizes reverse engineering skills, whereas the developer role centers on software creation and implementation.

What are the most commonly searched types of Software Reverse Engineer jobs in Arizona? The most popular types of Software Reverse Engineer jobs in Arizona are:
What cities in Arizona are hiring for Internship Software Reverse Engineer jobs? Cities in Arizona with the most Internship Software Reverse Engineer job openings:
Test Module Development Engineer

Test Module Development Engineer

INTEL

Phoenix, AZ

$127.40K - $179.90K/yr

Full-time

Medical, Retirement, PTO

Posted 12 days ago


Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

9th of 137 rated electronics manufacturers


Job description

Job Description

Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that extend beyond traditional methods to enable the future of high-performance computing.

Primary Focus:

• Advanced semiconductor packaging technologies beyond conventional approaches
• 3D packaging innovations and chiplet integration
• High‑performance computing packaging for data centers and AI applications
• Heterogeneous integration across diverse chip technologies
• Scaling packaging density while enhancing thermal and electrical performance

Key Objectives:

• Advance Moore's Law through cutting‑edge packaging technologies
• Reduce system‑level power consumption while improving overall performance
• Support Intel's IDM 2.0 strategy and Intel Foundry Services
• Develop packaging solutions tailored to emerging workloads such as AI and edge computing

Test Module Development Engineer responsibilities include but are not limited to:

• Executes test technology development and enablement for high‑mix, low‑volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
• Implements design and development of technically sophisticated test processes and/or repair reverse engineering, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
• Executes pathfinding and development activities in support of the Intel Foundry advanced packaging roadmap.
• Implements modifications for test equipment/collateral to improve efficiency, manufacturing techniques, and optimize production output for existing products.
• Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
• Executes technology feasibility studies through theoretical simulations and/or practical engineering methods.
• Remains updated on relevant industrial process and materials manufacturing trends and develops a perspective on the Intel Foundry Advanced Packaging roadmap to drive industry leadership by collaborating with vendor ecosystems for cost‑effective solutions.

Behavioral traits:

• Excellent verbal and written communication skills.
• Initiative, self-motivated and ability to work independently.

This position requires regular onsite presence.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.


Minimum Qualifications:


• Bachelor's degree in engineering, physics, chemistry or related STEM field with 6+ years of experience.

OR
• Master's degree in engineering, physics, chemistry or related STEM field with 4+ years of experience.

OR
• Ph.D. degree in engineering, physics, chemistry or related field.


• The experience outlined above should reflect a combination of the following competencies:


- Electrical test–related experience
- Application of statistical controls
- FMEA and/or DOE methodologies
Preferred Qualifications:


• Prior related work experience with semiconductor package design, test software, and/or test equipment/collateral/fixture development.
• Product ownership, change control management and data systems
• Project management and delivering results for time-critical technical projects.
• Technical innovation and deliver results for complex, time-critical technical projects.

Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experienceWorking ModelThis role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

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Intel logo

About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968