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Internship Signal Integrity Engineer Jobs in Warren, NJ

QCi

Senior Hardware Engineer

Hoboken, NJ · On-site

$120K - $161K/yr

Engineering Reports to : Hardware Engineering Manager About Us: Quantum Computing Inc. (QCi ... Familiarity with PCB design best practices related to Signal Integrity, Power Integrity, and EMI ...

Synaptrix Labs

Internship Program

New York, NY · On-site

$18.25 - $23.75/hr

... signal processing, and computational neuroscience. We're seeking passionate, creative, and technically driven interns to join our team across multiple disciplines: Software Engineering, Hardware ...

Synaptrix Labs

Internship Program

New York, NY

$18.25 - $23.75/hr

... signal processing, and computational neuroscience. We're seeking passionate, creative, and technically driven interns to join our team across multiple disciplines: Software Engineering, Hardware ...

Synaptrix Labs

Internship Program

New York, NY

$18.25 - $23.75/hr

... signal processing, and computational neuroscience. We're seeking passionate, creative, and technically driven interns to join our team across multiple disciplines: Software Engineering, Hardware ...

Onto

Staff Electrical Engineer

Budd Lake, NJ · On-site

$115K - $172K/yr

Job Summary & Responsibilities We are seeking a highly experienced Staff Electrical Engineer with ... signal integrity. * Experience integrating motors, sensors, power systems, and mixedsignal ...

ZeroMark

Electrical Design Engineer

New York, NY · On-site

What You'll Do As an Electrical Design Engineer, you'll be instrumental in designing, developing ... Designing multi-layer printed circuit boards (PCBs) with a focus on signal integrity, power ...

CoreWeave

Senior Firmware Engineer, BIOS

New York, NY · Remote

$182K - $242K/yr

... integrity * Engineer and maintain critical Power-On Self Test (POST) logic for diverse hardware ... Who Are You Minimum Qualifications * 5+ years of non-internship professional software development ...

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Internship Signal Integrity Engineer information

See Warren, NJ salary details

$13

$26

$40

How much do internship signal integrity engineer jobs pay per hour?

As of Sep 4, 2026, the average hourly pay for internship signal integrity engineer in Warren, NJ is $26.40, according to ZipRecruiter salary data. Most workers in this role earn between $21.49 and $29.95 per hour, depending on experience, location, and employer.

What is an internship signal integrity engineer?

Internship Signal Integrity Engineers are students or recent graduates who assist in analyzing and improving the quality of electrical signals within electronic circuits and systems. They typically work under the supervision of experienced engineers to learn about signal integrity concepts, testing methods, and simulation tools. Their responsibilities may include assisting in the design, simulation, and validation of high-speed circuits to minimize issues like noise, crosstalk, and signal loss. These internships provide hands-on experience and exposure to industry-standard tools and practices, preparing individuals for full-time engineering roles in the field.

What do internship signal integrity engineers do?

As an Internship Signal Integrity Engineer, you can expect to work on projects that involve analyzing and optimizing high-speed signal transmission within electronic circuits and PCBs. Typical tasks include running simulations using industry tools (such as SPICE or HFSS), assisting with measurement and validation of signal integrity in lab settings, and collaborating with senior engineers to troubleshoot issues related to noise, crosstalk, and timing. Interns often participate in cross-functional meetings, gaining exposure to both hardware and PCB design teams, which provides a valuable learning experience and insight into the product development lifecycle.

What are the key skills and qualifications needed to thrive as an internship signal integrity engineer?

To thrive as an Internship Signal Integrity Engineer, you need a solid understanding of electrical engineering fundamentals, transmission line theory, and signal integrity concepts, often supported by coursework or a degree in electrical or electronics engineering. Familiarity with simulation tools like SPICE, HFSS, or SI analysis software, as well as experience with oscilloscopes and network analyzers, is typically required. Strong analytical thinking, attention to detail, and effective communication help you collaborate with teams and solve complex problems. These skills ensure accurate analysis, successful project outcomes, and the ability to contribute meaningfully in high-speed electronic design environments.

What is the difference between Internship Signal Integrity Engineer vs Signal Integrity Engineer?

AspectInternship Signal Integrity EngineerSignal Integrity Engineer
CredentialsTypically pursuing or recently completed a relevant degreeBachelor's or Master's in Electrical Engineering or related field
Work EnvironmentInternship programs, entry-level projects, supervised tasksFull-time professional role, independent project work
Industry UsageUsed in training and development phasesEstablished role in electronics, telecommunications, and chip design

The main difference is that an Internship Signal Integrity Engineer is a temporary, entry-level position aimed at gaining experience, while a Signal Integrity Engineer is a full-time professional responsible for designing and analyzing high-speed signal paths in electronic systems.

What cities near Warren, NJ are hiring for Internship Signal Integrity Engineer jobs?

Cities near Warren, NJ with the most Internship Signal Integrity Engineer job openings:

Internship Signal Integrity Engineer jobs near you

Quantum TSV Integration Engineer

GlobalFoundries

New York, NY • On-site

$113K - $153K/yr

Full-time

Re-posted 18 days ago

GlobalFoundries rating

8.3

Company rating: 8.3 out of 10

Based on 35 frontline employees who took The Breakroom Quiz

66th of 545 rated manufacturers

Job description

GlobalFoundries Fab8 is seeking a highly skilled and motivated R&D TSV engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.
About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Job Summary
GlobalFoundries Fab8 is seeking a highly skilled and motivated R&D TSV engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.
Essential Responsibilities
  • Lead development of through-silicon via (TSV) processes for cryogenic and superconducting applications.
  • Define TSV architectures including:
    • Superconducting liners (e.g., Nb, Al-based)
    • Dielectric isolation schemes
    • Via geometries (diameter, depth, pitch)
  • Ensure TSV designs are optimized for:
    • Low-loss electrical/RF signal transport
    • Cryogenic thermal and mechanical stability
  • Own end-to-end TSV integration flows across:
    • Via etch, liner deposition, dielectric, and metallization
    • Wafer thinning, reveal, and backside processing
    • Integration into 2.5D/3D packaging stacks
  • Drive process integration planning to enable prototyping and qualification across programs.
  • Develop TSV solutions for superconducting interposers and 3D integration platforms
  • Support integration with:
    • Bump/interconnect layers
    • Redistribution routing layers (RDL)
    • Assembly and bonding flows
  • Ensure TSVs enable high-density vertical interconnects for quantum system scaling.
  • Enable prototype builds and development lots, ensuring smooth execution through fab and assembly flows.
  • Support transition from R&D to pilot to manufacturable flows.
  • Collaborate with device/test teams to ensure TSVs meet:
    • Cryogenic electrical performance requirements (DC + RF/microwave)
    • Low resistance and minimal loss for superconducting operation
  • Support characterization of:
    • Signal integrity (noise, crosstalk)
    • Thermal leakage across vias
  • Develop strategies to improve:
    • TSV yield and process robustness
    • Integration reliability under cryogenic conditions
  • Identify and analyze failure modes such as:
    • Liner defects / discontinuities
    • Delamination or cracking during thermal cycling
    • Void formation or via integrity issues
  • Lead root-cause analysis and corrective actions.
  • Work closely with materials teams to:
    • Select TSV liner and dielectric materials compatible with superconducting operation
    • Understand cryogenic behavior (CTE mismatch, stress, superconductivity limits)
  • Optimize interface integrity between via liner, dielectric, and substrate.
  • Define requirements for TSV-specific process tools:
    • Deep silicon etch (DRIE)
    • Conformal deposition (PVD/CVD/ALD)
    • Wafer thinning and reveal
  • Collaborate with equipment vendors and suppliers to develop new capabilities.
  • Support qualification of new tooling and materials.
  • Interface across:
    • Interconnect (bump / RDL) teams
    • Assembly and integration engineers
    • Device / qubit / system engineers
  • Ensure co-optimization of TSVs with full packaging stack.
  • Drive development of next-generation TSV scaling, including:
    • Smaller diameters and higher aspect ratios
    • Alignment with micro-bump pitch scaling
  • Contribute to cryogenic 3DHI roadmap and APPC capability build-out.
  • Evaluate novel via concepts (e.g., superconducting-lined, partially filled, or air-gap vias).
  • Generate:
    • TSV integration flows and specifications
    • Design rules and process documentation
  • Provide technical updates, reports, and data-driven insights.
  • Contribute to IP, publications, and conference outputs.

Other Responsibilities
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
  • Take part in hiring of other Advanced Packaging team members in Singapore.
  • Mentor and guide new hires to assume their roles and responsibilities.
  • Other duties as assigned by manager.

Required Qualifications
  • Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
  • MS degree with at least 8 years of prior related work experience.
  • Must have at least an overall 3.0 GPA and proven good academic standing.
  • Language Fluency - English (Written & Verbal).
  • Travel - Up to 20%.

Preferred Qualifications
  • Education - PhD education level preferred with at least 5 years of prior related work experience.
  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
  • Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning & organizational skills.

Additional Information
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard. As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities. All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.
Expected Salary Range
$98,000.00 - $176,000.00
The exact Salary will be determined based on qualifications, experience and location.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law

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