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As a Senior PCB Design Engineer, you will take on a leadership position within our hardware design ... Mentor and oversee junior team members and interns in PCB design. * Translate board-level ...
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Internship Rfic Design Engineer information
What is the difference between Internship Rfic Design Engineer vs RFIC Design Engineer?
| Aspect | Internship RFIC Design Engineer | RFIC Design Engineer |
|---|---|---|
| Qualifications | Enrolled in or recent graduate of electrical engineering or related field | Bachelor's or master's in electrical engineering, with specialized RFIC knowledge |
| Work Environment | Internship programs, entry-level projects, supervised tasks | Full-time professional role, independent project work, team collaboration |
| Responsibilities | Assisting in RFIC design tasks, learning industry tools, supporting senior engineers | Designing, testing, and optimizing RFICs for communication systems |
The main difference between an Internship RFIC Design Engineer and an RFIC Design Engineer lies in experience, responsibilities, and career stage. Internships are designed for students or recent graduates gaining industry exposure, while RFIC Design Engineers are experienced professionals responsible for full project execution.
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Contractor
Re-posted 3 days ago
Job description
Role Overview:
As a Senior PCB Design Engineer, you will take on a leadership position within our hardware design group. Your key duties will revolve around crafting, executing, and validating mixed-signal (Digital & RF) Printed Circuit Boards (PCBs) customized for application in satellite and other orbital systems. These applications encompass a diverse spectrum, encompassing digital control/processing, motor drive units, onboard processors, and mass-storage units, all of which utilize cutting-edge space technologies.
Key Responsibilities:
- Lead the digital/analog PCB design for space environments.
- Mentor and oversee junior team members and interns in PCB design.
- Translate board-level requirements into a comprehensive design concept (incorporating architecture, I/Os, key components, power dissipation estimates, FPGA integration, software integration, etc.).
- Collaborate closely with FPGA, software, and test designers to finalize functional concepts and streamline integration.
- Complete or review the schematic capture level design.
- Identify and manage technology and design risks.
- Provide guidance to ensure Design for Manufacture/Test in space environments.
- Supervise and review design layout constraints, parts placement, manufacturing, and assembly drawings.
- Prepare or review lists of long lead items, bills of materials, and ensure parts qualifications for space.
- Conduct and review circuit simulations (using tools like SPICE, Hyperlynx, ADS, etc.) and various design analyses (e.g., worst-case scenarios, FMECA).
- Coordinate with various specialized teams (structural, thermal, packaging, manufacturing, quality assurance, etc.) to conduct necessary reviews for PCB component placement and layout.
- Oversee board assembly and manufacturing tests.
- Prepare and review various documents, including review presentations, test plans, test procedures, etc.
- Lead and guide junior team members in testing, troubleshooting, and debugging complex mixed-signal boards.
- Provide support for environmental and functional tests and validation for space missions.
- Report progress and address issues to the program lead or manager.
Required Qualifications:
- Bachelor's degree in electrical engineering, computer engineering, or equivalent field.
- Minimum of seven (7) years of experience in designing processor, digital, analog, high-speed, or mixed-signal PCBs.
- Demonstrated expertise in at least one of these areas of competence.
- Proficiency in coaching and supervising junior team members and interns.
- Experience in design architecture and handling multidisciplinary specifications and reviews (FPGA, software, mechanical, etc.).
- Proficiency in tools/software languages such as Excel spreadsheets, Python, MathCAD, Spice, Matlab, JIRA, etc.
- Strong understanding of electronic circuits and communication protocols, coupled with extensive PCB design experience.
- Knowledge of PCB manufacturing processes.
- Exposure to mechanical packaging is a valuable asset.
- Experience conducting analyses (FMECA, WCA, signal integrity, power integrity, etc.) using various tools like SPICE, ADS SiPro, Hyperlynx, etc.
About Hikinex
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Hikinex is a multi-channel integrated service provider designed to help Companies scale fast and drive more profit. We leverage diverse resources to provide Superior services at a fraction of the cost.
Industry
Strategic planning consulting services
Company size
51 - 200 Employees
Headquarters location
San Francisco, CA, US
Year founded
2016