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Internship Rfic Design Engineer Jobs in Montreal, QC

Fuse

Internship

Montreal, QC · On-site

Support the design, build, and testing of TITAN and related pulsed-power hardware alongside the engineering team. * Contribute hands-on to assembly, troubleshooting, and iteration as machines move ...

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Internship Rfic Design Engineer information

What is the difference between Internship Rfic Design Engineer vs RFIC Design Engineer?

AspectInternship RFIC Design EngineerRFIC Design Engineer
QualificationsEnrolled in or recent graduate of electrical engineering or related fieldBachelor's or master's in electrical engineering, with specialized RFIC knowledge
Work EnvironmentInternship programs, entry-level projects, supervised tasksFull-time professional role, independent project work, team collaboration
ResponsibilitiesAssisting in RFIC design tasks, learning industry tools, supporting senior engineersDesigning, testing, and optimizing RFICs for communication systems

The main difference between an Internship RFIC Design Engineer and an RFIC Design Engineer lies in experience, responsibilities, and career stage. Internships are designed for students or recent graduates gaining industry exposure, while RFIC Design Engineers are experienced professionals responsible for full project execution.

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For Internship Rfic Design Engineer jobs in Montreal, QC, the most frequently searched job titles are:

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Internship Rfic Design Engineer jobs near you
Infographic showing various Internship Rfic Design Engineer job openings in Montreal, QC as of August 2026, with employment types broken down into 90% Full Time, 7% Part Time, and 3% Contract. Highlights an 85% Physical, 5% Hybrid, and 10% Remote job distribution.

Senior PCB Design Engineer for Fastwater Staffing

HIKINEX

Montreal, QC • On-site

Contractor

Re-posted 23 days ago

Job description

Role Overview:

As a Senior PCB Design Engineer, you will take on a leadership position within our hardware design group. Your key duties will revolve around crafting, executing, and validating mixed-signal (Digital & RF) Printed Circuit Boards (PCBs) customized for application in satellite and other orbital systems. These applications encompass a diverse spectrum, encompassing digital control/processing, motor drive units, onboard processors, and mass-storage units, all of which utilize cutting-edge space technologies.

Key Responsibilities:

  • Lead the digital/analog PCB design for space environments.
  • Mentor and oversee junior team members and interns in PCB design.
  • Translate board-level requirements into a comprehensive design concept (incorporating architecture, I/Os, key components, power dissipation estimates, FPGA integration, software integration, etc.).
  • Collaborate closely with FPGA, software, and test designers to finalize functional concepts and streamline integration.
  • Complete or review the schematic capture level design.
  • Identify and manage technology and design risks.
  • Provide guidance to ensure Design for Manufacture/Test in space environments.
  • Supervise and review design layout constraints, parts placement, manufacturing, and assembly drawings.
  • Prepare or review lists of long lead items, bills of materials, and ensure parts qualifications for space.
  • Conduct and review circuit simulations (using tools like SPICE, Hyperlynx, ADS, etc.) and various design analyses (e.g., worst-case scenarios, FMECA).
  • Coordinate with various specialized teams (structural, thermal, packaging, manufacturing, quality assurance, etc.) to conduct necessary reviews for PCB component placement and layout.
  • Oversee board assembly and manufacturing tests.
  • Prepare and review various documents, including review presentations, test plans, test procedures, etc.
  • Lead and guide junior team members in testing, troubleshooting, and debugging complex mixed-signal boards.
  • Provide support for environmental and functional tests and validation for space missions.
  • Report progress and address issues to the program lead or manager.

Required Qualifications:

  • Bachelor's degree in electrical engineering, computer engineering, or equivalent field.
  • Minimum of seven (7) years of experience in designing processor, digital, analog, high-speed, or mixed-signal PCBs.
  • Demonstrated expertise in at least one of these areas of competence.
  • Proficiency in coaching and supervising junior team members and interns.
  • Experience in design architecture and handling multidisciplinary specifications and reviews (FPGA, software, mechanical, etc.).
  • Proficiency in tools/software languages such as Excel spreadsheets, Python, MathCAD, Spice, Matlab, JIRA, etc.
  • Strong understanding of electronic circuits and communication protocols, coupled with extensive PCB design experience.
  • Knowledge of PCB manufacturing processes.
  • Exposure to mechanical packaging is a valuable asset.
  • Experience conducting analyses (FMECA, WCA, signal integrity, power integrity, etc.) using various tools like SPICE, ADS SiPro, Hyperlynx, etc.
Employment Type: CONTRACTOR
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About Hikinex

Sourced by ZipRecruiter

Hikinex is a multi-channel integrated service provider designed to help Companies scale fast and drive more profit. We leverage diverse resources to provide Superior services at a fraction of the cost.

Industry

Strategic planning consulting services

Company size

51 - 200 Employees

Headquarters location

San Francisco, CA, US

Year founded

2016

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