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Internship High Performance Computing Engineer Jobs in Phoenix, AZ

This role supports the development of high-performance computing solutions by ensuring thermal requirements are met across silicon, package, and platform levels. The engineer will contribute to ...

... high-performance computing and extreme low-power products. This position offers the unique ... Collaborates with architects, design, verification, and validation engineers during the execution ...

Senior Process Engineer - H1 Location : Tempe, AZ Department : Operations Reports to : Director of ... high-performance computing, artificial intelligence, cyber security as well as remote sensing ...

Solution Architect I

Phoenix, AZ

$59.75 - $78.75/hr

Every day, you will be responsible for specific application, database, network, infrastructure, and/or engineering portfolios/platforms, and will support high-performance computing architecture. This ...

... high-performance computing deployments, supporting the advancement of AI computing with precision, speed, and minimal downtime. Our network of 1,000+ field engineers operates globally, tackling the ...

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Internship High Performance Computing Engineer information

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How much do internship high performance computing engineer jobs pay per hour?

As of Jun 12, 2026, the average hourly pay for internship high performance computing engineer in Phoenix, AZ is $59.68, according to ZipRecruiter salary data. Most workers in this role earn between $48.94 and $67.55 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as an Internship High Performance Computing (HPC) Engineer, and why are they important?

To thrive as an Internship High Performance Computing Engineer, you need a solid background in computer science fundamentals, programming (especially in C/C++ or Python), and a familiarity with parallel computing concepts, often supported by coursework or relevant project experience. Experience with Linux environments, HPC clusters, and distributed computing frameworks, as well as tools like MPI, OpenMP, or Slurm, is commonly required. Strong problem-solving skills, attention to detail, and the ability to collaborate effectively within technical teams help interns stand out. These skills ensure you can efficiently support computational research, resolve technical challenges, and contribute meaningfully to HPC projects.

What is the difference between Internship High Performance Computing Engineer vs Internship Data Scientist?

AspectInternship High Performance Computing EngineerInternship Data Scientist
Required SkillsProgramming (C++, Python), parallel computing, HPC systemsStatistics, machine learning, data analysis, Python/R
Work EnvironmentResearch labs, tech companies, academia with focus on HPC systemsTech firms, finance, healthcare, research institutions
Industry UsageHigh-performance computing projects, scientific simulationsData analysis, predictive modeling, business insights

Internship High Performance Computing Engineers focus on developing and optimizing computational systems for large-scale scientific and engineering problems, requiring skills in parallel programming and HPC environments. In contrast, Internship Data Scientists analyze data to extract insights, using statistical and machine learning techniques. Both roles are valuable in tech and research sectors but differ in technical focus and daily tasks.

What is an Internship High Performance Computing Engineer?

An Internship High Performance Computing (HPC) Engineer is a student or early-career professional who works with advanced computing systems designed for processing large data sets and complex calculations at high speeds. During the internship, they assist in developing, optimizing, and maintaining HPC infrastructure, software, or applications used in scientific research, engineering, or data analysis. The role often involves learning about parallel computing, cluster management, and performance tuning, while gaining hands-on experience with cutting-edge technologies. Interns work under the supervision of experienced HPC engineers, contributing to projects that advance computational capabilities in various fields.

What types of projects can I expect to work on as an Internship High Performance Computing Engineer?

As an Internship High Performance Computing (HPC) Engineer, you will typically contribute to projects involving optimization of scientific applications, performance analysis, and cluster management. Interns often assist with benchmarking software, troubleshooting issues in parallel computing environments, and supporting researchers with technical solutions. You'll likely collaborate closely with senior HPC engineers, system administrators, and academic researchers to ensure efficient use of computing resources. This hands-on experience provides valuable insight into real-world challenges faced in HPC environments and helps build a strong foundation for future roles in the field.
What are popular job titles related to Internship High Performance Computing Engineer jobs in Phoenix, AZ? For Internship High Performance Computing Engineer jobs in Phoenix, AZ, the most frequently searched job titles are:
What job categories do people searching Internship High Performance Computing Engineer jobs in Phoenix, AZ look for? The top searched job categories for Internship High Performance Computing Engineer jobs in Phoenix, AZ are:
What cities near Phoenix, AZ are hiring for Internship High Performance Computing Engineer jobs? Cities near Phoenix, AZ with the most Internship High Performance Computing Engineer job openings:
Thermal data Analysis Engineer

Thermal data Analysis Engineer

Intel

Phoenix, AZ

Full-time

Medical, Retirement, PTO

Posted 8 days ago


Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 139 rated electronics manufacturers


Job description

Job Details:Job Description: 

The Role and Impact

The Thermal Engineer will drive thermal design and analysis for GPU, AI accelerators, and data center products through both simulation and hands-on experimental work. This role supports the development of high-performance computing solutions by ensuring thermal requirements are met across silicon, package, and platform levels. The engineer will contribute to thermal performance optimization, laboratory testing, and the development of innovative thermal characterization methodologies for next-generation computing products.

Key Responsibilities

Thermal Design and Analysis

  • Support the development of packaging thermal solutions for GPU and AI products.
  • Develop thermal design strategies for advanced packaging technologies, including chiplets and multi-chip modules.
  • Perform thermal, electrical, and mechanical co-design optimization activities.
  • Conduct thermal simulations and analyses to support product development and performance objectives.

Laboratory and Experimental Work

  • Design and execute experiments to characterize thermal performance from advanced package to system-level cooling solutions.
  • Develop innovative thermal metrology techniques for next-generation thermal management solutions, including two-phase cooling systems and microchannel heat spreaders.
  • Correlate experimental data with simulation results to improve predictive modeling accuracy.
  • Support the development and validation of thermal characterization methodologies and test plans.

Cross-Functional Collaboration

  • Partner with silicon design, packaging, platform, and system engineering teams to ensure thermal compliance and performance targets are achieved.
  • Collaborate across engineering disciplines to optimize thermal solutions for advanced computing products.
  • Engage with external customers and ecosystem partners to align thermal solutions with product requirements and industry needs.
  • Communicate technical findings and recommendations to stakeholders across multiple organizations.

Behavioral Skills

  • Strong analytical and problem-solving skills with the ability to evaluate complex technical challenges and develop effective solutions.
  • Ability to work effectively in cross-functional and multidisciplinary teams.
  • Strong verbal and written communication skills, with the ability to clearly communicate technical concepts to both technical and non-technical audiences.
  • Ability to translate simulation results, experimental findings, and technical analyses into actionable design recommendations.
  • Demonstrated ability to manage multiple priorities and work effectively in a fast-paced environment.
  • Strong attention to detail and commitment to technical excellence.
  • Self-motivated with the ability to work independently while contributing to team objectives.
  • Demonstrated collaboration and stakeholder management skills when working with internal and external partners.
Qualifications:

Minimum Qualifications

  • PhD in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, Chemical Engineering, or a related technical field; OR a Master's degree in one of these disciplines with 2+ years of experience in thermal engineering, thermal sciences, or a related field.
  • 2+ years of experience using thermal simulation tools such as Computational Fluid Dynamics (CFD) and/or Finite Element Analysis (FEA) OR
  • 2+ years of experience performing thermal characterization, validation, and experimental testing in a laboratory environment OR
  • 2+ years of experience applying heat transfer principles to thermal management solutions for electronic, semiconductor, data center, or high-performance computing products.

Preferred Qualifications

  • 2+ years of experience supporting semiconductor, GPU, AI accelerator, server, or high-performance computing products.
  • Experience with advanced cooling technologies such as immersion cooling, two-phase cooling, microchannel cooling, or liquid cooling solutions.
  • Experience developing thermal metrology and measurement techniques.
  • Experience with thermal instrumentation and data acquisition systems, including thermocouples, infrared cameras, flow meters, and related equipment.
  • Experience correlating simulation results with experimental data.
  • Experience with prototype development and rapid testing methodologies.
  • Familiarity with statistical analysis and experimental data processing.
  • Understanding of power electronics and energy efficiency concepts.
  • Experience translating experimental results into thermal design recommendations.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968