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Internship High Performance Computing Engineer Jobs in North Carolina

Nvidia

Senior GPU Memory Architect

Durham, NC

NVIDIA has pioneered programmable GPUs and the CUDA language and is a world leader in high-performance computing technology, with aggressive plans for future processors. This position offers the ...

UNC-Chapel Hill

HPC DevOps Engineer

Chapel Hill, NC · On-site

$45 - $61.50/hr

  • Medical

  • Life

  • Retirement

  • PTO

... High Performance Computing (HPC) as well as High Throughput Computing (HTC). Responsibilities of the HPC DevOps Engineer include leading and contributing to a variety of areas within Research ...

Penguin Computing

Manager, Software Engineering

Durham, NC · On-site

$165K - $195K/yr

  • Medical

  • Dental

  • Vision

  • Life

  • Retirement

  • PTO

That engineering expertise positions us to power the next generation of AI workloads, from training ... High Performance Computing (HPC) * Enterprise SaaS platforms Location Hybrid in Raleigh/Durham, NC ...

Nvidia

Senior System Simulation Architect

Durham, NC

... high-performance computing (HPC) workloads. * Port/extend/develop system software (firmware, OS, and drivers) to meet workload simulation needs. * Support CPU architects and performance engineers in ...

Nvidia

HPC Operations Engineer

Durham, NC · Hybrid

$67K - $90K/yr

As an HPC Operations Engineer at NVIDIA, you will play a pivotal role in ensuring the flawless operation of our high-performance computing (HPC) environment. This opportunity is outstanding as you ...

Vadum, Inc.

Electronic Warfare Systems Architect

Raleigh, NC · On-site

$125K - $180K/yr

  • Medical

  • Retirement

Familiarity with FPGA, GPU, embedded systems, or high-performance computing architectures. * Strong ... Prior technical leadership, Chief Engineer, or Principal Engineer experience. * Experience with ...

Lenovo

HPC and AI Sales Specialist

Morrisville, NC · On-site

HPC And AI Sales Specialist Are you passionate about High Performance Computing (HPC) and AI? Join ... Bachelor's degree in Engineering, Information Technology, Business, or related field (or equivalent ...

New

Berriehill Research

Senior AI Systems Engineer

Raleigh, NC · On-site +1

$92K - $126K/yr

Proficiency with DevOps and MLOps practices, including CI/CD pipelines, Git-based workflows ... high-performance computing environments. * Familiarity with security frameworks and compliance ...

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All JobsHigh Performance Computing Engineer JobsInternship High Performance Computing Engineer JobsInternship High Performance Computing Engineer Jobs in North Carolina

Internship High Performance Computing Engineer information

What is an internship high performance computing engineer?

An Internship High Performance Computing (HPC) Engineer is a student or early-career professional who works with advanced computing systems designed for processing large data sets and complex calculations at high speeds. During the internship, they assist in developing, optimizing, and maintaining HPC infrastructure, software, or applications used in scientific research, engineering, or data analysis. The role often involves learning about parallel computing, cluster management, and performance tuning, while gaining hands-on experience with cutting-edge technologies. Interns work under the supervision of experienced HPC engineers, contributing to projects that advance computational capabilities in various fields.

What types of projects can I expect to work on as an internship high performance computing engineer?

As an Internship High Performance Computing (HPC) Engineer, you will typically contribute to projects involving optimization of scientific applications, performance analysis, and cluster management. Interns often assist with benchmarking software, troubleshooting issues in parallel computing environments, and supporting researchers with technical solutions. You'll likely collaborate closely with senior HPC engineers, system administrators, and academic researchers to ensure efficient use of computing resources. This hands-on experience provides valuable insight into real-world challenges faced in HPC environments and helps build a strong foundation for future roles in the field.

What are the key skills and qualifications needed to thrive as an internship high performance computing engineer?

To thrive as an Internship High Performance Computing Engineer, you need a solid background in computer science fundamentals, programming (especially in C/C++ or Python), and a familiarity with parallel computing concepts, often supported by coursework or relevant project experience. Experience with Linux environments, HPC clusters, and distributed computing frameworks, as well as tools like MPI, OpenMP, or Slurm, is commonly required. Strong problem-solving skills, attention to detail, and the ability to collaborate effectively within technical teams help interns stand out. These skills ensure you can efficiently support computational research, resolve technical challenges, and contribute meaningfully to HPC projects.

What is the difference between Internship High Performance Computing Engineer vs Internship Data Scientist?

AspectInternship High Performance Computing EngineerInternship Data Scientist
Required SkillsProgramming (C++, Python), parallel computing, HPC systemsStatistics, machine learning, data analysis, Python/R
Work EnvironmentResearch labs, tech companies, academia with focus on HPC systemsTech firms, finance, healthcare, research institutions
Industry UsageHigh-performance computing projects, scientific simulationsData analysis, predictive modeling, business insights

Internship High Performance Computing Engineers focus on developing and optimizing computational systems for large-scale scientific and engineering problems, requiring skills in parallel programming and HPC environments. In contrast, Internship Data Scientists analyze data to extract insights, using statistical and machine learning techniques. Both roles are valuable in tech and research sectors but differ in technical focus and daily tasks.

What are the most commonly searched types of High Performance Computing Engineer jobs in North Carolina?

The most popular types of High Performance Computing Engineer jobs in North Carolina are:

What are popular job titles related to Internship High Performance Computing Engineer jobs in North Carolina?

For Internship High Performance Computing Engineer jobs in North Carolina, the most frequently searched job titles are:

What job categories do people searching Internship High Performance Computing Engineer jobs in North Carolina look for?

The top searched job categories for Internship High Performance Computing Engineer jobs in North Carolina are:

What cities in North Carolina are hiring for Internship High Performance Computing Engineer jobs?

Cities in North Carolina with the most Internship High Performance Computing Engineer job openings:

Internship High Performance Computing Engineer jobs near you
Infographic showing various Internship High Performance Computing Engineer job openings in North Carolina as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution.

Vice President of Foundry Operations

QUANTUM COMPUTING, INC.

Morrisville, NC

$300K - $400K/yr

Full-time

Posted 2 days ago

New

Job description

Job Title: Vice President of Foundry Operations

Location: Morrisville, NC

Division: Nhanced


About Us:

Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cyber security as well as remote sensing applications.

Scope of the Job:

This position directs all development, pilot-line, and high-volume manufacturing (HVM) operations for a $100M production scale facility utilizing sub-micron hybrid bonding tech and supporting >100 on-site employees. This unique leadership role bridges low-volume R&D scaling for multi-size, multi-substrate architectures with the operational rigor of a 24/7 high-volume 300mm manufacturing line.

Duties / Responsibilities:

  • P&L & Dual-Mode Operations: Own the operating budget, CapEx, and line-balancing for a hybrid facility that simultaneously handles high-mix/low-volume R&D (50mm–200mm) and high-volume 300mm production.
  • Hybrid Bonding Execution: Drive operational excellence and yield optimization across sub-micron particle-sensitive processes, specifically Die-to-Wafer (D2W) and Wafer-to-Wafer (W2W) hybrid bonding.
  • Multi-Substrate Engineering Control: Supervise the intake, handling, and custom processing variations for a wide variety of substrate materials (e.g., Silicon, Glass, Compound Semiconductors).
  • Advanced Process Management: Oversee a complex process flow including Custom BEoL (Back-End-of-Line), TSV (Through-Silicon Via) insertion and reveal, precision wafer thinning, and silicon/glass interposer fabrication.
  • Team Leadership & Scale: Lead, mentor, and align a 100+ person multi-disciplinary team comprising cleanroom operators, equipment technicians, pilot-line development engineers, and HVM production supervisors.
  • Yield & Cleanroom Discipline: Enforce strict surface-preparation and contamination-control protocols required for successful hybrid bonding, ensuring high reliability and SPC compliance.

Required Skills & Experience:

  • Education: Bachelor’s degree in Materials Science, Chemical, Mechanical, or Electrical Engineering; Master’s or Ph.D. with a focus on advanced semiconductor packaging is highly preferred.
  • Experience: Minimum 10 years in advanced semiconductor manufacturing or packaging, with at least 5 years of experience managing a fab line that bridges pilot development and high-volume manufacturing.
  • Technical Expertise: Direct operational exposure to hybrid bonding, TSV reveal, CMP (Chemical Mechanical Planarization) for surface flatness, precision wafer thinning/carrier bonding, and multi-size wafer handling (50mm to 300mm).
  • Operational Capabilities: Demonstrated ability to manage rapid product-mix changes on development lines while maintaining uptime, OTD (On-Time Delivery), and cycle-time discipline on an HVM line.

Quantum Computing Inc. (QCi) is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law.

Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above. Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.