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Intern High Performance Computing Engineer Jobs in Pennsylvania

Cornelis Networks

Mechanical Engineer

Wayne, PA · Hybrid

The mechanical engineer will be involved in all phases of mechanical architecture and hardware ... Experience with high-performance computing (HPC) or data center hardware environments.

Cornelis Networks

Mechanical Engineer

Wayne, PA · On-site

The mechanical engineer will be involved in all phases of mechanical architecture and hardware ... Experience with high-performance computing (HPC) or data center hardware environments.

Introl

Data Center Technician

Philadelphia, PA · On-site

$30 - $36/hr

... high-performance computing deployments, supporting the advancement of AI computing with precision, speed, and minimal downtime. Our network of 1,000+ field engineers operates globally, tackling the ...

Introl

Data Center Technician

Pittsburgh, PA · On-site

$30 - $36/hr

... high-performance computing deployments, supporting the advancement of AI computing with precision, speed, and minimal downtime. Our network of 1,000+ field engineers operates globally, tackling the ...

Cornelis Networks

Thermal Design Engineer

Wayne, PA · Hybrid

Cornelis Networks is hiring a talented Entry-Level Thermal Engineer with a foundational ... Exposure to high-performance computing (HPC) or data center environments. Location This position is ...

Cornelis Networks

Thermal Design Engineer

Wayne, PA · On-site

Cornelis Networks is hiring a talented Entry-Level Thermal Engineer with a foundational ... Exposure to high-performance computing (HPC) or data center environments. Location This position is ...

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Mechanical Engineer

Cornelis Networks, Inc.

Wayne, PA • On-site

Other

Posted 6 days ago

Job description

Cornelis Networks is hiring a talented Mechanical Engineer with experience in system and printed circuit board (PCB) assembly mechanical design. The mechanical engineer will be involved in all phases of mechanical architecture and hardware development for high-performance electronics, focusing primarily on the next-generation Cornelis Networks Fabric platforms (adapters and switches). 


The ability to effectively focus a significant amount of computational power on solving critical problems through the use of artificial intelligence, data analytics, and modeling/simulation techniques is vital to many scientific, commercial, and government organizations, and it is the mission of Cornelis Networks to deliver innovative purpose-built interconnect solutions that enable our customers to optimally apply vast computational resources to solve the world’s toughest problems. 


Key tasks include: 

  • Mechanical Design & Architecture: Lead the mechanical design of high-performance interconnect products including PCIe adapters, networking switches, and complex electronic assemblies. 
  • NPI & Mass Production: Drive products through the complete NPI lifecycle, from early architecture and EVT/DVT validation to tooling release and high-volume mass production (MP). 
  • Manufacturing & DFM: Apply deep expertise in manufacturing processes—specifically die casting, sheet metal fabrication, and extrusion—to ensure designs are optimized for mass production, cost, and reliability. 
  • CAD & PLM Ownership: Create, maintain, and manage 3D models, 2D drawings, and BOMs using PTC Creo and Windchill (or similar enterprise CAD/PLM tools). 
  • Cross-Functional Collaboration: Partner closely with thermal, electrical, regulatory, and manufacturing teams to manage trade-offs involving mechanical envelopes, structural integrity, and thermal constraints. 
  • Prototyping & Lab Testing: Drive physical prototyping, tolerance stack-up analysis, and mechanical qualification testing (e.g., shock, vibration, environmental) in the lab. 


Minimum qualifications 

  • BS in Mechanical Engineering or a closely related field. 
  • 5+ years of experience in the mechanical design of electronics packaging, adapters, or networking hardware. 
  • Strong expertise in standard datacenter form factors (PCIe, OCP 3.0, EIA-310) and rack-level mechanical integration. 
  • Deep understanding of volume manufacturing processes including die casting, sheet metal, and extrusion. 
  • Proven track record of managing global CMs/ODMs, driving tooling kickoffs, and resolving factory escalations during volume ramp-up. 
  • Proficiency with MCAD and PLM tools (PTC Creo and Windchill strongly preferred; SolidWorks, NX, or similar acceptable). 
  • Experience driving Root Cause Analysis (RCA) and tolerance stack-up analysis for mechanical assemblies and failures. 
  • Excellent communication and interpersonal skills; accustomed to cross-disciplinary teamwork. 


Preferred qualifications: 

  • Experience with high-performance computing (HPC) or data center hardware environments. 
  • Familiarity with advanced high-performance cooling solutions, including large-scale heat sinks, TIMs, and Direct Liquid Cooling (DLC) architectures. 


Location:

This position is hybrid (on-site with some remote work possible) at the headquarters in the Chesterbrook Corporate Center in Wayne, PA. The successful candidate resides within commuting distance. 


Cornelis Networks is an equal opportunity employer, and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity or expression, pregnancy, age, national origin, disability status, genetic information, protected veteran status, or any other characteristic protected by law.