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Ic Failure Analysis Engineer Jobs (NOW HIRING)

Foxconn WI

Failure Analysis Engineer

Mount Pleasant, WI · On-site

Failure Analysis Engineer Department: L10 /L11 Test Engineering Employment Type: Full Time Location: 868 Description FII USA, Inc ., a Foxconn Technology Group Company, is seeking a Failure Analysis ...

Amphenol TCS

Failure Analysis Engineer

Nashua, NH · On-site

Failure Analysis Engineer Location: Nashua, NH Amphenol High Speed Products Group is the market leader for high speed, high bandwidth electrical connectors for the Telecom/Datacom market (Mobile ...

Amphenol TCS

Failure Analysis Engineer

Nashua, NH · On-site

Failure Analysis Engineer Location: Nashua, NH Amphenol High Speed Products Group is the market leader for high speed, high bandwidth electrical connectors for the Telecom/Datacom market (Mobile ...

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How much do ic failure analysis engineer jobs pay per year?

As of Sep 10, 2026, the average yearly pay for ic failure analysis engineer in the United States is $93,179.00, according to ZipRecruiter salary data. Most workers in this role earn between $70,000.00 and $118,000.00 per year, depending on experience, location, and employer.

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Infographic showing various Ic Failure Analysis Engineer job openings in the United States as of August 2026, with employment types broken down into 85% Full Time, 13% Part Time, and 2% Contract. Highlights an 82% Physical, 4% Hybrid, and 14% Remote job distribution, with an average salary of $93,179 per year, or $44.8 per hour.

Failure Analysis Engineer

Durham, NC • On-site

Foxconn Assembly LLC
See more jobs at Foxconn Assembly LLCexternal

Full-time

Posted 7 days ago

Job description

Overview
We are seeking a highly skilled and motivated Failure Analysis Engineer (FAE) to join our team. The successful candidate will work directly with clients to ensure deliverables fall within the applicable scope and budget. We are seeking a highly skilled and motivated Senior Engineering Team Member to support the resolution of hardware issues related to our ESSN Server Products portfolio. The role involves close collaboration with customers, as well as internal teams including Foxconn R&D, Product Engineering, and Quality Engineering. This position focuses on identifying elevated factory and field failure symptoms, conducting in-depth circuit failure analysis, and determining root causes, leading to corrective actions that improve product quality and customer satisfaction.
Duties and Responsibilities
  • Troubleshoots, debugs, and determines root cause at multiple system levels for customer devices.
  • Analyzes circuits and topologies to identify marginal failure root causes.
  • Drives recovery actions and repairs for failing devices.
  • Engineering Investigations: Lead engineering investigations of significant customer field and factory escalations related to hardware issues, ensuring timely resolution.
  • Customer Satisfaction & Quality Improvement: Enhance customer satisfaction and product quality by addressing hardware-related issues promptly and efficiently.
  • Cross-functional Collaboration: Work directly with design and manufacturing teams to investigate hardware issues down to the component level.
  • Internal Collaboration: Collaborate with multiple internal engineering disciplines (HW, SW, Diags, Quality, Product, Mechanical, Materials, Reliability) to resolve complex hardware issues.
  • Capture Programs Support: Facilitate the execution of special capture programs such as Early Field Capture, Selective Field Capture, ORT, L6, L10, L11 Factory Operations, and RMA.
  • Feedback & Process Improvement: Provide feedback to internal and external teams based on analytical findings to improve process and design methodologies.
  • RMA & Service Support: Assist in communicating best practices for WW RMA & Service Centers to improve product knowledge and streamline operations.
  • Operational Excellence: Promote "best practices" across WW Operational, RMA, and Service Sites, driving efficiencies and quality improvements.
  • Miscellaneous Duties: Perform additional duties as required, based on business needs

Skill/Knowledge Requirements:
  • Engineering Knowledge: Deep understanding of Industry Standard Servers & Storage architecture and peripherals.
  • RMA & Service Manufacturing Expertise: Familiarity with PCA, system, and RMA & service manufacturing environments.
  • Clear Communication: Strong verbal and written communication skills, with the ability to convey complex ideas effectively.
  • Analytical Problem-Solving: Ability to isolate and resolve hardware failures, including safely injecting failures during debugging to pinpoint root causes.
  • Linux Knowledge: Working knowledge of Linux commands and structures, including exposure to SEL and IPMI tools.
  • Debugging Tools & Algorithm Development: Proficient in developing and debugging algorithms, creating test tools to assist with failure isolation, and documenting findings for team sharing.
  • Strong understanding of semiconductor device physics, IC design, and fabrication processes.
  • Experience with EDA (Electronic Design Automation) tools and layout editing software.
  • Strong problem-solving skills with the ability to diagnose and resolve complex circuit issues.

Education and Experience:
  • Bachelor's degree or higher in Electrical Engineering, Microelectronics, Physics, or a related field (or equivalent experience).
  • Minimum of seven (7) years of experience in FA, at best with hands-on experience in technique enablement and development of supporting HW for Fault-Isolation and/or vacuum-based microscopic systems (e.g., SEM, DMM).
  • Technical Skills: Proven ability to debug complex hardware issues using logic analyzers, oscilloscopes, and other test equipment.
  • Server Technology Knowledge: Familiarity with key server technologies such as x86 & ARM multi-core processors, DDR4/5, NAND memory, PCI-e protocols, SAS, SCSI, SATA, FibreChannel, Ethernet, WiFi, Bluetooth, NVMe, and SSD technologies.
  • Self-Motivation: Must be a self-driven team player, able to perform in a fast-paced, customer-focused environment with minimal supervision.
  • Development Lifecycle: Familiarity with the full hardware/software development lifecycle, and hardware/firmware/software development and testing methodologies.
  • Collaboration: Proven experience working with internal and external partners.
  • Knowledge of failure analysis techniques and methodologies.

Additional Requirements Experience:
  • Physical Requirements: Ability to perform various physical tasks such as walking, standing, bending, and lifting to 20 lbs. Must also be able to perceive depth, operate motor vehicles, and use equipment related to the job.
  • Work Conditions: The role may require working in environments with machines, electrical energy, and other potentially hazardous conditions. Candidates should be flexible regarding irregular hours and travel by various means of transportation (car, van, bus, and airplane).
  • Tools & Equipment: Must be comfortable working with computers, related equipment, typewriters, calculators, copiers, fax machines, telephones, and automobiles as part of daily responsibilities

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