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Ibm Heterogeneous Integration Jobs (NOW HIRING)

Data Engineer - IBM Quantum

Yorktown Heights, NY · On-site

$122K - $146K/yr

Design Data Integration Solutions: Create and implement Extract, Transform, and Load (ETL) ... Support large-scale batch processing for high-volume, heterogeneous datasets, including system ...

Data Engineer - IBM Quantum

Manhattan, NY · On-site

$126K - $151K/yr

Design Data Integration Solutions: Create and implement Extract, Transform, and Load (ETL) ... Support large-scale batch processing for high-volume, heterogeneous datasets, including system ...

Data Engineer - IBM Quantum

Chicago, IL · On-site

$118K - $141K/yr

Design Data Integration Solutions: Create and implement Extract, Transform, and Load (ETL) ... Support large-scale batch processing for high-volume, heterogeneous datasets, including system ...

Data Engineer - IBM Quantum

Austin, TX · On-site

$113K - $136K/yr

Design Data Integration Solutions: Create and implement Extract, Transform, and Load (ETL) ... Support large-scale batch processing for high-volume, heterogeneous datasets, including system ...

Data Engineer - IBM Quantum

Durham, NC · On-site

$103K - $124K/yr

Design Data Integration Solutions: Create and implement Extract, Transform, and Load (ETL) ... Support large-scale batch processing for high-volume, heterogeneous datasets, including system ...

At least 2+ years of experience in ETL design and development using IBM DataStage components ... Hands-on experience in integrating data from heterogeneous data sources spanning across mainframes ...

At least 2+ years of experience in ETL design and development using IBM DataStage components ... Hands-on experience in integrating data from heterogeneous data sources spanning across mainframes ...

At least 2+ years of experience in ETL design and development using IBM DataStage components ... Hands-on experience in integrating data from heterogeneous data sources spanning across mainframes ...

... and integration patterns to facilitate seamless, real-time communication across heterogeneous ... Proven track record of migrating IBM Mainframe/TPF workloads to Event-Driven Architectures (EDA)

Big Data Developer

Glendale, CA

$56.25 - $72.75/hr

... in integrating heterogeneous applications is required Working knowledge of ESB is preferred ... with IBM Watson Explorer or Apache Solr is a plus Ability to work independently with limited ...

At least 2+ years of experience in ETL design and development using IBM DataStage components ... Hands-on experience in integrating data from heterogeneous data sources spanning across mainframes ...

... and integration patterns to facilitate seamless, real-time communication across heterogeneous ... Proven track record of migrating IBM Mainframe/TPF workloads to Event-Driven Architectures (EDA)

Sr.JAVA/J2EE Developer

Palo Alto, CA

$67.25 - $85.75/hr

... integration methods Experience with Spring and Hibernate is required Experience with Microsoft SQL ... IBM DB2 database development Strong HTML and CSS skills (hand coding) including HTML5 Deep ...

Sr.JAVA/J2EE Developer

Palo Alto, CA

$67.25 - $85.75/hr

... integration methods Experience with Spring and Hibernate is required Experience with Microsoft SQL ... IBM DB2 database development Strong HTML and CSS skills (hand coding) including HTML5 Deep ...

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Ibm Heterogeneous Integration information

See salary details

$44.5K

$124.3K

$173.5K

How much do ibm heterogeneous integration jobs pay per year?

As of Jun 4, 2026, the average yearly pay for ibm heterogeneous integration in the United States is $124,275.00, according to ZipRecruiter salary data. Most workers in this role earn between $104,000.00 and $140,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as an IBM Heterogeneous Integration Engineer, and why are they important?

To excel as an IBM Heterogeneous Integration Engineer, you need a strong background in materials science, microelectronics, and semiconductor packaging, typically with an advanced degree in electrical engineering or related fields. Familiarity with design tools such as Cadence or Mentor Graphics, experience in advanced packaging technologies, and knowledge of industry standards like IPC are essential. Strong problem-solving, collaboration, and project management skills help navigate complex integration projects and interdisciplinary teams. These abilities are crucial for delivering innovative, reliable solutions in fast-evolving semiconductor environments.

What are some typical projects an IBM Heterogeneous Integration engineer works on, and how does this role interact with cross-functional teams?

As an IBM Heterogeneous Integration engineer, you will often work on projects involving the integration of various semiconductor technologies—such as combining logic, memory, and analog components into advanced packaging solutions. This role requires close collaboration with design, process, and reliability engineering teams to ensure that integrated systems meet performance and manufacturability standards. You’ll regularly participate in cross-disciplinary meetings to address technical challenges and align on project goals, making strong communication and teamwork skills essential. The work environment is highly innovative, with opportunities to contribute to next-generation computing architectures.

What is IBM Heterogeneous Integration?

IBM Heterogeneous Integration refers to the process of combining different types of semiconductor technologies, materials, and components into a single microelectronic system or package. This approach enables enhanced performance, greater functionality, and improved energy efficiency by integrating components such as processors, memory, and specialized chips from different fabrication technologies. IBM is a leader in this field, developing advanced packaging solutions like 2.5D and 3D integration to meet the demands of high-performance computing, AI, and data center applications.

What is the difference between Ibm Heterogeneous Integration vs Ibm Hardware Engineer?

AspectIbm Heterogeneous IntegrationIbm Hardware Engineer
Primary FocusDesign and integration of diverse electronic components and systems at the chip or package levelDesign, develop, and test hardware components and systems for various applications
Required SkillsKnowledge of integrated circuit design, packaging, and system integrationExpertise in circuit design, PCB layout, and hardware testing
Work EnvironmentResearch labs, R&D centers, collaborative projects with multidisciplinary teamsManufacturing facilities, product development teams, hardware labs
Industry UsageSemiconductor, electronics, and integrated systems industriesConsumer electronics, computing, telecommunications industries

In summary, Ibm Heterogeneous Integration focuses on combining diverse electronic components into cohesive systems, often requiring advanced integration techniques. Ibm Hardware Engineers primarily design and develop individual hardware components. While both roles require technical expertise, their scope and focus differ significantly.

Infographic showing various Ibm Heterogeneous Integration job openings in the United States as of May 2026, with employment types broken down into 3% As Needed, 10% Full Time, 81% Part Time, 3% Contract, and 3% Nights. Highlights an 84% Physical, 4% Hybrid, and 12% Remote job distribution, with an average salary of $124,275 per year, or $59.7 per hour.
Professor of Empire Innovation, Microelectronics

Professor of Empire Innovation, Microelectronics

Binghamton University

Binghamton, NY • On-site

Full-time

This job post has expired today. Applications are no longer accepted.


Binghamton University rating

7.8

Company rating: 7.8 out of 10

Based on 17 frontline employees who took The Breakroom Quiz

192nd of 532 rated colleges and universities


Job description

Job Description: Binghamton University is nationally recognized for its leadership in microelectronic systems, semiconductors, and advanced packaging, leveraging a comprehensive ecosystem of research centers, state-of-the-art facilities, and industry partnerships. The Small Scale Systems Integration and Packaging (S3IP) center at Binghamton is a New York State Center of Excellence that houses multiple specialized centers, including the Center for Heterogeneous Integration Research in Packaging (CHIRP), Center for Advanced Microelectronics Manufacturing (CAMM), Integrated Electronics Engineering Center (IEEC), Energy Smart Electronic Systems (ES2) center, and Analytical and Diagnostic Laboratory (ADL). Our faculty members and scientists conduct sponsored research in advanced packaging, heterogeneous integration, semiconductor manufacturing and materials, flexible electronics, energy efficient electronics, and process optimization, among others. Since 1996, their research efforts have generated over $1.9 billion in economic impact for New York State, supported by collaborations with over 75 companies, including IBM, AMD, NVIDIA, Google, Intel, General Electric, Lockheed Martin, and GlobalFoundries. The Thomas J. Watson College of Engineering and Applied Science at Binghamton University invites applications from experts in Microelectronics for a tenured faculty position at the Full Professor level. This position will carry the title of Professor of Empire Innovation, and is supported in part by SUNY's Empire Innovation Program (EIP), a key initiative to recruit and retain faculty with an established track record of research and scholarship in areas of strategic priority. We are seeking a well-established expert who has a track record of leadership in funded research and scholarship in one or more areas of Microelectronics, including:
  • Codesign for Heterogeneous Integration/Advanced Packaging: (a) EDA tools for chiplet integration or chiplet system design, including applied AI/ML techniques for microelectronics co-design, and (b) modeling for co-design with crosscutting considerations of the chiplet system architecture, thermal and mechanical issues, materials and reliability
  • Digital Twinning for Semiconductor Manufacturing and Packaging (SMP): Process optimizations for SMP across lithography, device and chiplet fabrication, chiplet integration/assembly, material choices and materials synthesis for improving manufacturing yield
  • Semiconductor Lifecycle Impact Reduction: Sustainable microelectronics manufacturing across the entire product lifecycle using use of eco-friendly materials, minimizing the use of hazardous chemicals (e.g., PFAS), energy-efficient processes, circular economy models, utilizing lifecycle assessment tools, and end-of-life microelectronics waste planning and management
As a Professor of Empire Innovation, the successful candidate must have an established record of securing funding from federal/state agencies and industry. They will be expected to lead in pursuing large funding opportunities from federal and state agencies besides industry partners and enhance the collaborative research ecosystem involving multiple campus units across Binghamton University. The successful hire would also help recruit and attract top talent to complement existing strengths. Depending on the specialization and match, the successful candidate could be a tenured faculty in the Electrical and Computer Engineering (ECE) Department, the Mechanical Engineering (ME) Department, the School of Computing (CS), or the School of System Science and Industrial Engineering (SSIE). The successful candidate will receive a comprehensive startup package including competitive salary compensation and benefits commensurate with qualifications and experience. Requirements:
  • A doctoral degree in Engineering, Computer Science, or a closely related discipline
  • Proven record of research leadership in cross-cutting multi-institutional collaborative teams
  • Proven record of sponsored research funding from federal and state agencies
  • Proven record of peer-reviewed high-impact publications
  • Experience as an educator and research mentor at the undergraduate and/or graduate level
Preferred:
  • Significant scholarly work and contributions within one or more of the focus areas of:
    • Codesign for Heterogeneous Integration/Advanced Packaging
    • Digital Twinning for Semiconductor Manufacturing and Packaging
    • Semiconductor Lifecycle Impact Reduction.
  • Potential for leading multi-disciplinary research in Microelectronics across different departments and schools of Watson College.
Please be advised that H1B visa sponsorship may not be available for this position. Additional Information: Binghamton University is committed to providing access, equal opportunity, and reasonable accommodation for individuals with disabilities in employment, its services, programs, and activities. To request reasonable accommodation to participate in the job application or interview process, please contact the ADA Coordinator by completing the following Request Form. The State University of New York is an Equal Opportunity/Affirmative Action Employer. It is the policy of Binghamton University to provide for and promote equal opportunity employment, compensation, and other terms and conditions of employment without discrimination on the basis of age, race, color, religion, disability, national origin, gender identity or expression, sexual orientation, veteran or military service member status, marital status, domestic violence victim status, genetic predisposition or carrier status, or arrest and/or criminal conviction record unless based upon a bona fide occupational qualification or other exception. As required by title IX and its implementing regulations, Binghamton University does not discriminate on the basis of sex in the educational programs and activities which it operates. This requirement extends to employment and admission. Inquiries about sex discrimination may be directed to the University Title IX Coordinator or directly to the Office of Civil Rights (OCR). Contact information for the Title IX Coordinator and OCR, as well as the University's complete Non-Discrimination Notice may be found here. Pursuant to Executive Order 161, no State entity, as defined by the Executive Order, is permitted to ask, or mandate, in any form, that an applicant for employment provide his or her current compensation, or any prior compensation history, until such time as the applicant is extended a conditional offer of employment with compensation. If such information has been requested from you before such time, please contact the Governor's Office of Employee Relations at (518) 474-6988 or via email at info@goer.ny.gov. Binghamton University is a tobacco-free campus effective August 1, 2017. Offers of employment will be contingent upon successful completion of a pre-employment background check and verification of degree(s) and credentials. Application Instructions: All applicants must apply via Interview Exchange: http://binghamton.interviewexchange.com/jobofferdetails.jsp?JOBID=195278 Review of applications will begin immediately and continue until the vacancy is filled. After filling out contact information, you will be directed to an upload page where you must submit:
  • a cover letter,
  • a curriculum vitae,
  • a statement of research interests,
  • a statement of teaching interests,
  • a diversity statement, and
  • names and contact information of three references.
Deadline for Applicants: Open until filled. To check/edit your profile or to upload additional documents, please log into http://binghamton.interviewexchange.com/login.jsp.

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