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Full Time Electroplating Process Engineer Jobs in New Mexico

TechSource

Process Engineer

Los Alamos, NM · On-site

TechSource is seeking 1-2 full-time Project Managers for this effort. Key Responsibilities * Lead ... Coordinate with engineering, facilities, utilities, operations, procurement, and construction teams ...

Stantec

Senior Process Engineer

Albuquerque, NM · On-site

$117K - $176K/yr

Your Opportunity The Sr. Process Engineer will be responsible for managing projects across the ... Regular full-time and part-time employees (working at least 20 hours per week) have access to ...

Strata-G, LLC

Mid Process Engineers

Albuquerque, NM · On-site

Mid Process Engineers = BS degree in Chemical Engineering or related technical degree or equivalent ... Job Type: Full-Time/Contract Strata-G will not sponsor applicants for immigrant or non-immigrant ...

Strata-G, LLC

Sr. Process Engineers

Albuquerque, NM · On-site

$100K - $130K/yr

Summary: * Sr. Process Engineers with Uranium processing experience - BS degree in Chemical ... Job Type: Full-Time/Contract Strata-G will not sponsor applicants for immigrant or non-immigrant ...

CACI International, Inc.

NAVWAR Engineer

Albuquerque, NM · On-site

$60K - $123K/yr

Engineering Time Type: Full time Minimum Clearance Required to Start: Secret Employee Type: Regular ... signal processing algorithms that enable threat detection and identification for employing ...

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Full Time Electroplating Process Engineer information

What is the difference between Full Time Electroplating Process Engineer vs Full Time Quality Control Inspector?

AspectFull Time Electroplating Process EngineerFull Time Quality Control Inspector
CredentialsEngineering degree, certifications in plating processesHigh school diploma or equivalent, quality assurance certifications
Work EnvironmentManufacturing plants, electroplating facilitiesQuality labs, manufacturing sites
Industry UsageDesigning and optimizing electroplating processesInspecting and testing finished products for quality

The Full Time Electroplating Process Engineer focuses on developing and improving electroplating procedures, requiring engineering expertise. In contrast, the Full Time Quality Control Inspector emphasizes inspecting products to ensure quality standards are met. Both roles are essential in manufacturing but serve different functions within the electroplating industry.

What are the most commonly searched types of Electroplating Process Engineer jobs in New Mexico? The most popular types of Electroplating Process Engineer jobs in New Mexico are:
What cities in New Mexico are hiring for Full Time Electroplating Process Engineer jobs? Cities in New Mexico with the most Full Time Electroplating Process Engineer job openings:
Full Time Electroplating Process Engineer jobs near you
Infographic showing various Full Time Electroplating Process Engineer job openings in New Mexico as of August 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution.

Copper Plating Engineering Group Leader

3D Glass Solutions

Albuquerque, NM • On-site

Full-time

Re-posted 19 days ago

Job description

Job/Position Summary
The Copper Plating Engineering Group Leader is a hands-on leader who will lead process development and provide manufacturing support for advanced copper plating technologies. This role requires deep technical expertise in electroplating and electroless copper processes, strong experimental leadership, and the ability to mentor and guide a team of process engineers. The ideal candidate will be both a technical authority and an active contributor in lab and fab environments.
Primary Responsibilities
  • Lead and manage a team of process engineers focused on copper plating and related unit processes.
  • Drive experimental design, execution, and data analysis to optimize plating performance, yield, and reliability.
  • Provide hands-on technical leadership in lab and production environments, including tool setup, process tuning, and troubleshooting.
  • Develop, qualify, and maintain copper plating processes for wafer-level and/or panel-level manufacturing.
  • Serve as the technical owner for copper electroplating and electroless plating modules.
  • Collaborate cross-functionally with equipment, integration, yield, reliability, and manufacturing teams.
  • Establish robust problem-solving methodologies (DOE, SPC, FMEA, root cause analysis) to address process challenges.
  • Support technology transfers from R&D to high-volume manufacturing
  • Mentor junior engineers and elevate the overall team's technical capability
  • Interface with chemical and equipment suppliers for process optimization and roadmap alignment.
  • Perform additional functions and other duties as assigned or required.

Requirements
  • Bachelor's degree or higher in Materials Science, Chemical Engineering, Electrical Engineering, or a related field required.
  • 5-10 years of industry experience in copper plating or advanced packaging process engineering.
  • Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently.
  • This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

Knowledge, Skills, and Abilities
  • Demonstrated experience leading technical teams or serving as a senior technical authority.
  • Proven track record of solving complex plating and integration challenges.
  • Experience with plating equipment operation, optimization, and qualification.
  • Experience with plating chemistry additives, including suppressors, accelerators, and levelers.
  • Knowledge of wafer-level and/or panel-level plating process development and manufacturing.
  • Knowledge of microvia electroplating and void-free fill techniques.
  • Knowledge of plating seed layer etching and related metallization removal processes.
  • Experience in through Glass Via (TGV) filling.
  • Familiarity with high-volume manufacturing requirements and process control methodologies.
  • Ability to balance technical depth with project and people leadership.
  • Excellent communication and mentoring skills.
  • Supplier and equipment vendor engagement experience.
  • Experience in advanced packaging, heterogeneous integration, or semiconductor manufacturing environments.
  • Experience in through Silicon Via (TSV) filling.
  • Knowledge of photoresist stripping and post-plating cleaning processes.
  • Experience with redistribution Layer (RDL) electroplating.
  • Knowledge of electroless copper plating chemistries, including copper seed layer formation.
  • Experience with Electroplating waveforms, including DC, pulse, and pulse-reverse plating.
  • Demonstrated experience with Copper electroplating chemistries, including acid copper systems and additive interactions.
  • Strong experimental design and data analysis skills.

Physical/Working Requirements
  • Must be able to wear personal protective gear most of the day (where applicable).
  • Prolonged periods of sitting or standing.

Behavioral Traits
  • Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
  • A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
  • The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.
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About 3D Glass Solutions

Sourced by ZipRecruiter

Industry

Electrical equipment, appliance, and component manufacturing

Company size

11 - 50 Employees

Headquarters location

Albuquerque, NM, US

Year founded

2006

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