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From Home Chassis Design Jobs (NOW HIRING)

Harley-Davidson

Designer - Chassis Systems

Wauwatosa, WI · On-site

$74K - $112K/yr

The Harley-Davidson Motor Company Product Development Center (PDC) located in Wauwatosa, WI is home ... for the CAD design and delivery of motorcycle components and systems from concept through ...

Harley-Davidson

Designer - Chassis Systems

Wauwatosa, WI · On-site

$74K - $112K/yr

The Harley-Davidson Motor Company Product Development Center (PDC) located in Wauwatosa, WI is home ... for the CAD design and delivery of motorcycle components and systems from concept through ...

Amphenol TCS

Mechanical Design Engineer

Yocumtown, PA · On-site

$72K - $98K/yr

... from initial proposal to successful tooling and product qualifications. * Perform Design FMEA ... Rack and Chassis design; Blade and rack server configurations; Switches, routers, and network ...

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How much do from home chassis design jobs pay per hour?

As of Jul 15, 2026, the average hourly pay for from home chassis design in the United States is $52.93, according to ZipRecruiter salary data. Most workers in this role earn between $38.46 and $63.94 per hour, depending on experience, location, and employer.
What are the most commonly searched types of Chassis Design jobs? The most popular types of Chassis Design jobs are:
From Home Chassis Design jobs near you

Mechanical Engineer - SoC to Rack Integration

Majestic Labs

Los Altos, CA • On-site

Full-time

Re-posted 13 days ago

Job description

We are seeking a Principal Mechanical Engineer to lead the hardware definition of our next-generation AI infrastructure. This is a high-impact individual contributor role where you will serve as the primary technical authority for the physical architecture of advanced server platforms. You will bridge the critical gap between ultra-high-power silicon packaging, liquid-cooled node design, and massive-scale rack deployments.

Key Responsibilities

  • Blade & Chassis Design: Lead the end-to-end mechanical definition of server blades, high-density chassis, and rack-level enclosures.
  • Structural Hardware: Architect the integration of sliding rails, blind-mate connectors, precision standoffs, and high-load extraction handles.
  • Power & Interconnects: Define mechanical paths for ultra-high-density power delivery busbars and complex cable management systems.
  • Cold Plate & Fluid Management: Own mechanical integration of liquid cooling systems, providing design feedback on cold plate layouts, manifold distribution, and QD/leak-mitigation compatibility.
  • Thermal Strategy: Support hybrid air/liquid cooling solutions for 1kW+ nodes, collaborating with thermal specialists on CFD-informed design decisions.
  • HVM Optimization: Optimize designs for high-volume manufacturing using precision milling, die casting, and complex sheet metal fabrication.
  • Environmental Ruggedization: Ensure system integrity against transportation shock and vibration and extreme thermal and humidity cycling.
  • Lifecycle Design: Implement Design for Cost (DfC) and Design for Assembly (DFA) principles to ensure seamless serviceability and global deployment readiness.



Requirements:

Required Qualifications

  • B.S. or M.S. in Mechanical Engineering.
  • Design Experience: 12+ years in design and validation (MDVT) of modular electromechanical chassis and rack level systems in data centers for HPC/AI/Enterprise segment.
  • Proven track record of owning at least one full product lifecycle — from concept through high-volume manufacturing (HVM).
  • Expert-level understanding of metal fabrication processes including milling, casting, and sheet metal, and how they impact thermal performance and structural integrity.
  • Technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of drip-free connector integration.
  • Proficiency in FEA tools for structural and vibration analysis.
  • Demonstrated ability to drive technical alignment across silicon, power, and optical engineering teams.

Preferred Qualifications

  • Direct experience with AI/GPU-based architectures and ultra-high-density power delivery systems.
  • Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
  • Experience with blind-mate liquid and power interfaces.