Flex Thick Film Jobs (NOW HIRING)

Starkey is adding a Sr Microelectronic Manufacturing Engineer I to it's Manufacturing Process Development team at it's global headquarters in Eden Prairie, MN. Do you have experience and a passion for microelectronics? If so, this could be your next opportunity to bring your experience and make an impact at a well respected medical device company. This position is responsible for the development, qualification, implementation, and continuous improvement of microelectronic, hybrid assembly, thick film substrate, PCB and flexible circuit manufacturing processes. The role serves as a technical leader and hands-on engineering resource supporting new product introduction (NPI), product transfers, manufacturing scale-up, process validation, and ongoing production support. The engineer collaborates closely with R&D, Quality, Manufacturing, Supplier Quality, and Operations to ensure robust, manufacturable, and scalable microelectronic manufacturing solutions while driving innovation, reliability, quality, and operational excellence.
Starkey is a world leader in the manufacturing and distribution of advanced hearing technologies. We are in the business of connecting people and changing lives. Our teams come to work each day focused on ensuring people everywhere have the products and services they need to hear better and live better. Founded in 1967 by Bill Austin, Starkey is known for our cutting-edge hearing health innovations, industry-leading research and development, and not being afraid to push the edge of what's possible. We are headquartered in Eden Prairie, Minnesota, have over 5,000 employees in 29 facilities across the globe, and do business in more than 100 markets worldwide.
Watch this video to see more of what sets Starkey apart.
https://youtu.be/9cUYwTlCepg?si=wkovx8_R_iINfrc6
Job Responsibilities
Process Development and Technology Advancement

• Investigate, develop, and implement innovative manufacturing processes, materials, and technologies for microelectronic assemblies, hybrid substrates, rigid-flex PCBAs, and related electronic products.
• Evaluate and qualify new materials: epoxies, underfills, encapsulants, substrates, and electronic components.
• Design and execute feasibility studies, experiments, and development builds to evaluate emerging technologies and manufacturing methods.
• Identify, evaluate, recommend, and qualify new manufacturing and test equipment to improve capability, quality, throughput, and efficiency.
• Benchmark industry best practices and emerging technologies and recommend opportunities.
• Attend technical seminars, training, and industry conferences to maintain awareness of advancements in microelectronics manufacturing.

Process Validation and Qualification

• Author, execute, and approve manufacturing validation and qualification documentation, including: Validation Master Plans (VMP), Validation Master Reports (VMR), Installation Qualification (IQ), Operational Qualification (OQ), Performance Qualification (PQ), Process Performance Qualification (PPQ), Process Validation (PV) Protocols and Reports
• Review DFM/DFA results, Design Verification Testing (DVT), PFMEA assessments, and process development outputs to determine qualification readiness.
• Develop and execute process qualification strategies and test plans.
• Lead process validation activities required for manufacturing release and ongoing process control.
• Demonstrate process capability and manufacturing readiness prior to product release.

Manufacturing Support and Continuous Improvement

• Provide technical support for microelectronics assembly, substrate fabrication, PCBA manufacturing, and test operations.
• Lead and support yield improvement initiatives for manufacturing processes and products.
• Investigate and resolve manufacturing equipment issues, product yield losses, and Automated Test System Verification (ATSV) yield challenges.
• Utilize structured problem-solving methodologies including DMAIC, Design of Experiments (DOE), Statistical Process Control (SPC), Root Cause Analysis (RCA), and corrective action processes.
• Analyze manufacturing and quality data to identify improvement opportunities and implement solutions.
• Drive process control and error-proofing initiatives to improve process robustness and product quality.
• Support production personnel through troubleshooting, process optimization, and technical training.

Reliability, Testing, and Failure Analysis

• Lead and support reliability testing programs and product performance evaluations.
• Conduct and support destructive and non-destructive testing activities.
• Perform failure analysis on printed circuit boards, electronic assemblies, components, and mfg processes.
• Utilize electrical test equipment and lab instrumentation to evaluate process and product performance.
• Assess manufacturing and field performance data to drive corrective and preventive actions.

Supply Chain and Cross-Functional Collaboration

• Partner with Sourcing, Planning, Supplier Quality, Manufacturing, and R&D teams to qualify dual-source components and ensure supply chain resilience.
• Support supplier qualification and component change activities.
• Review and approve manufacturing documentation including: Work instructions, Process specifications, Manufacturing variances, Equipment qualification documents, Design transfer documentation, Product release and production readiness approvals.
• Represent Manufacturing Engineering as the Voice of Manufacturing during project reviews, NPI meetings, and continuation engineering activities.

Leadership and Communication

• Lead cross-functional teams in implementation of new manufacturing technologies and processes.
• Coordinate prototype builds and pilot production activities.
• Facilitate communication between engineering, manufacturing, quality, suppliers, and project teams.
• Prepare and present technical reports, recommendations, validation summaries, and project updates to management and stakeholders.
• Support training and development of mfg personnel on new technologies, processes, and equipment.
• Other duties/responsibilities as assigned

Minimum Education and Experience Requirements

• Education
  4-year degree in engineering or a physical science with a strong emphasis in metrology, materials science, electrical engineering, chemical engineering, physical analysis, and chemical analysis.

• Experience
  Minimum 10 years of experience with B.S. degree in process or manufacturing engineering required including failure analysis of printed circuit boards and/or electrical components, using DOE and SPC tools and other formal problem-solving techniques.

WORK CONTEXT
Working Conditions

• Normal office/lab conditions.
• Some travel (10-15%) expected to work directly with key suppliers domestically and internationally

Equipment Operation

• Microelectronic packaging design tools.
• Manual, automated, and bench electrical testing

Salary and Other Compensation:
The target rate for this position is between $93,940 to $128,100/year. Factors which may affect starting pay within this range may include geography/market, skills, education, experience and other qualifications of the successful candidate.
Benefits: The following benefits for this position, subject to applicable eligibility requirements, include medical, dental and vision insurance, 401(k) retirement plan with company match, company-paid life and short-term disability insurance, long-term disability insurance, employee assistance plan, hearing aid benefits, Paid Time Off, paid holidays, paid floating holidays, paid volunteer service day, paid paternity and maternity leave and tuition reimbursement
This position is eligible for a bonus based upon performance results. There is no guarantee of payout.
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Equal Opportunity Employer/Protected Veterans/Individuals with Disabilities
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