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Executive Pcb Design Engineer Jobs in Calgary, AB

Design and produce PCB and high-density substrate layouts for reliability qualification and ... Mentor junior packaging engineers and contribute to continuous improvement of design methodologies ...

We are looking for a RF Engineer to join the Hardware Development team in Calgary, Alberta. In this ... Perform schematic design and collaborate on PCB layout for RF circuits, including filters ...

We are looking for a RF Engineer to join the Hardware Development team in Calgary, Alberta. In this ... Perform schematic design and collaborate on PCB layout for RF circuits, including filters ...

Design and develop product-specific test fixtures, including schematic design, PCB layout ... Practical object-oriented programming experience using C++ and C#. * Valid passport and ability to ...

Design and develop product-specific test fixtures, including schematic design, PCB layout ... Practical object-oriented programming experience using C++ and C#. * Valid passport and ability to ...

Project Development Engineer

Calgary, AB · On-site

  • Medical

  • Dental

  • Vision

  • Life

Project Development includes problem definition, project scope definition, design, stakeholder ... Conduct reviews with project stakeholders, including executive-level stakeholders, to ensure ...

Serve in the lead technical role on transportation design projects with a focus on transit and road ... Each group has an executive sponsor and is open to all employees.

... the design package. You will help solve difficult operating problems, strengthen engineering ... Translate complex engineering issues into practical recommendations for executives and non ...

Bachelor's degree in Electrical Engineering. * Minimum of 2 years of Substation design experience ... Each group has an executive sponsor and is open to all employees.

Build the Business Development Function Behind Great Engineering Tangent Design Engineering is ... Building strong relationships with technical buyers, founders, executives, and operational leaders

... executive approval for projects throughout their lifecycle. In addition to aggregating and ... civil engineering principles, practices, and tools. * Proficient in computer-assisted design ...

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Executive Pcb Design Engineer information

What is an executive PCB design engineer?

Executive PCB Design Engineers are senior professionals responsible for leading the design and development of printed circuit boards (PCBs) for electronic devices. They oversee projects from concept to completion, ensuring that designs meet technical specifications, industry standards, and client requirements. In addition to technical design work, they often manage teams, coordinate with other engineering disciplines, and provide guidance on best practices and new technologies. Their expertise is crucial for creating reliable and efficient electronic products. These engineers typically have extensive experience in PCB design and a strong background in electrical engineering.

What are the key skills and qualifications needed to thrive as an executive PCB design engineer?

To thrive as an Executive PCB Design Engineer, you need expertise in electronics engineering, PCB layout design, and a solid understanding of industry standards, often backed by a relevant engineering degree. Mastery of design tools such as Altium Designer, OrCAD, or Mentor Graphics, and familiarity with simulation and verification systems, are typically required. Exceptional problem-solving, project management, and communication skills set top candidates apart in this role. These skills and qualifications are vital for ensuring the delivery of reliable, innovative, and manufacturable PCB solutions in complex engineering projects.

What are some common challenges faced by executive PCB design engineers when coordinating with cross-functional teams?

Executive PCB Design Engineers often collaborate closely with hardware engineers, mechanical designers, and manufacturing teams to ensure seamless integration of PCB layouts into final products. A common challenge is balancing electrical performance requirements with mechanical constraints and manufacturability standards. Effective communication and proactive problem-solving are essential to address conflicting priorities and ensure that design revisions are implemented smoothly. Staying updated on evolving industry standards and best practices also helps facilitate efficient cross-team collaboration.

What is the difference between Executive Pcb Design Engineer vs PCB Design Engineer?

AspectExecutive Pcb Design EngineerPCB Design Engineer
CredentialsBachelor's degree in Electrical Engineering or related field; certifications like IPC Designer CertificationBachelor's degree in Electrical Engineering or related field; certifications like IPC Designer Certification
Work EnvironmentSenior-level design teams, project management, strategic planningDesign teams, engineering departments, product development
Industry UsageElectronics manufacturing, aerospace, defense, high-tech industriesConsumer electronics, industrial equipment, telecommunications

The main difference is that the Executive Pcb Design Engineer typically holds a senior or leadership role, focusing on strategic planning and project oversight, while the PCB Design Engineer is more involved in the hands-on design and development of printed circuit boards. Both roles require similar technical skills and certifications but differ in scope and responsibilities.

What are the most commonly searched types of Pcb Design Engineer jobs in Calgary, AB?

The most popular types of Pcb Design Engineer jobs in Calgary, AB are:

Infographic showing various Executive Pcb Design Engineer job openings in Calgary, AB as of August 2026, with employment types broken down into 100% Full Time. Highlights an 67% In-person, and 33% Hybrid job distribution.

Principal Packaging Engineer

Semtech

Calgary, AB • On-site

Full-time

Re-posted 6 days ago


Job description

Our Team

Semtech's Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for the data communications and video broadcast industries - powering the interconnects that move data inside the world's largest hyperscaler data centers. Our Packaging Technology team sits at the heart of this mission, bridging the gap between silicon and system through world-class IC package design, signal integrity engineering, and close collaboration with a global network of advanced manufacturing partners.

You will be joining a highly integrated team of digital, analog, physical, and systems engineers who are passionate about solving hard problems at the intersection of speed, density, and reliability. If you thrive in a technically challenging, fast-moving environment where your work directly impacts next-generation Datacenter connectivity products - this is your team.

Job Summary

As a Principal Engineer in IC Package Design and Signal Integrity, you will lead the design and electrical characterization of advanced high-speed IC packages for Semtech's Datacenter connectivity product portfolio. Your primary responsibilities will span 3D electrical signal integrity modeling, IC package layout, and cross-functional collaboration across design, manufacturing, quality, and reliability engineering disciplines.

This role requires a deep understanding of high-speed transmission line behavior, advanced packaging architectures, and the full NPI lifecycle from concept through qualification. You will work closely with internal teams and external manufacturing partners, serving as a key technical authority on package-level signal and power integrity. The ideal candidate brings strong hands-on experience in EDA tooling, RF/SI measurement, and a track record of delivering complex package designs into high-volume production.

Responsibilities

Design high-speed IC packages and Chip-On-Board (COB) solutions to meet new product technical and financial requirements; develop robust solutions that achieve the highest levels of quality and reliability in fast-paced Datacenter connectivity environments.

Perform 3D signal integrity modeling at silicon, package, and system levels, including experimental validation via Scattering Parameter (S-parameter) and Time-Domain Reflectometer (TDR) measurements where required.

Prepare technical reports and application notes for internal teams and external customers/suppliers, covering Signal and Power Integrity (SI/PI), PCB layout guidance, and assembly process instructions.

Design and produce PCB and high-density substrate layouts for reliability qualification and electrical performance evaluation.

Serve as technical interface with manufacturing suppliers throughout new product introduction (NPI), package definition, and design phases; drive alignment between design intent and manufacturing capability.

Identify, evaluate, and launch projects with new strategic suppliers and emerging package technologies to advance Semtech's packaging roadmap.

Mentor junior packaging engineers and contribute to continuous improvement of design methodologies, tools, and workflows.

Minimum Qualifications

  • Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field, with 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer.
  • Deep expertise in high-speed transmission line theory, multi-domain power delivery network (PDN) design, and package-level signal integrity - including crosstalk, impedance control, and return-loss optimization.
  • Hands-on proficiency with industry-standard EDA tools: Keysight Advanced Design System (ADS), Cadence Advanced Package Designer (APD/SiP), and Ansys HFSS.
  • Demonstrated experience with RF/SI measurement equipment including Vector Network Analyzers (VNA) and Time-Domain Reflectometers (TDR).
  • Familiarity with multiple advanced packaging technologies: 2D, 2.5D, 3D, Fan-In, Fan-Out (FOCOS), high-density substrate, silicon bridge interconnects, and Chip-On-Board (COB).
  • Experience in optoelectronics package design or opto-electronic assembly is a strong asset.
  • Working knowledge of JEDEC specification JESD47H (Stress-Test-Driven Qualification of Integrated Circuits) and its design implications.
  • Proven ability to manage supplier relationships and drive technical alignment throughout NPI and package qualification phases.
  • Strong written and verbal communication skills, with the ability to produce high-quality technical documentation for both internal and customer-facing audiences.

Desired Qualifications

  • Master's degree or Ph.D. in Electrical Engineering, Physics, or a related discipline.
  • Experience with opto-electronic package assembly and photonic integration is highly desirable.
  • Background in Datacenter or high-speed communications product development (400G, 800G, 1.6T).
  • Familiarity with thermo-mechanical simulation tools and reliability engineering methodologies (e.g., finite element analysis for package stress modeling).
  • Experience working in a fabless semiconductor environment with global contract manufacturing partners.

Career Growth Philosophy

At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with the support, resources, and opportunities they need to excel - both technically and professionally. Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation and benefits package, including equity participation. We invest in your growth because your success is our success.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents maybe requiredto perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.

We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.

A reasonable estimate of the pay range for this position is $150,000 - $164,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee's total compensation package.