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$34K

$101.7K

$166.5K

How much do etch process manager jobs pay per year?

As of Sep 13, 2026, the average yearly pay for etch process manager in the United States is $101,733.00, according to ZipRecruiter salary data. Most workers in this role earn between $70,500.00 and $129,500.00 per year, depending on experience, location, and employer.

What does an Etch Process Manager do?

An Etch Process Manager oversees the etching processes used in semiconductor manufacturing to create patterns on silicon wafers. They are responsible for developing, optimizing, and maintaining etch process recipes, ensuring product quality, and troubleshooting issues that arise during production. This role involves collaborating with engineering teams, supervising technicians, and implementing process improvements to increase yield and efficiency. The Etch Process Manager also monitors equipment performance and ensures compliance with safety and industry standards.

What are some typical challenges an Etch Process Manager faces when optimizing semiconductor manufacturing processes?

Etch Process Managers often encounter challenges such as maintaining process consistency across multiple tools, minimizing defects, and balancing throughput with yield. They must troubleshoot equipment issues, respond quickly to production anomalies, and collaborate closely with engineering, equipment maintenance, and production teams. Additionally, staying updated with the latest etch chemistries and process control methods is essential for continuous improvement and meeting increasingly stringent device requirements.

What are the key skills and qualifications needed to thrive as an Etch Process Manager, and why are they important?

To thrive as an Etch Process Manager, you need a solid background in semiconductor manufacturing, process engineering, and materials science, often supported by a relevant engineering degree. Familiarity with advanced etch equipment, cleanroom protocols, and statistical process control (SPC) software is typically required. Strong problem-solving abilities, leadership, and effective communication are crucial soft skills for managing teams and optimizing production. These competencies ensure efficient process control, yield improvement, and successful collaboration in high-tech manufacturing environments.

What is the difference between Etch Process Manager vs Etch Technician?

AspectEtch Process ManagerEtch Technician
CredentialsTypically requires a bachelor's degree in engineering or related field, with experience in process managementUsually holds a high school diploma or associate degree, with specialized training in etching processes
Work EnvironmentSupervises etch operations in cleanroom or manufacturing settings, overseeing teams and processesOperates etching equipment directly, performing setup, monitoring, and troubleshooting
ResponsibilitiesOversees process optimization, quality control, and team managementExecutes etching tasks, maintains equipment, and ensures process adherence

The Etch Process Manager focuses on overseeing and optimizing etching processes, managing teams, and ensuring quality standards. In contrast, the Etch Technician handles the hands-on operation of etching equipment, performing daily tasks to maintain process flow. Both roles are essential in semiconductor manufacturing, but they differ in scope, responsibilities, and required credentials.

What cities are hiring for Etch Process Manager jobs?

Cities with the most Etch Process Manager job openings:

What states have the most Etch Process Manager jobs?

States with the most job openings for Etch Process Manager jobs include:

What are popular job titles related to Etch Process Manager jobs?

For Etch Process Manager jobs, the most frequently searched job titles are:

Infographic showing various Etch Process Manager job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 90% Physical, 2% Hybrid, and 8% Remote job distribution, with an average salary of $101,733 per year, or $48.9 per hour.

Dry Etch Process Development Engineer (42024)

Milpitas, CA • On-site

TDK Headway Technologies Inc.
Manufacturing • 501 - 1,000 employees
Learn more about TDK Headway Technologies Inc.external

$120K - $177K/yr

Other

Re-posted 7 days ago

Job description

TITLE: DRY ETCH PROCESS DEVELOPMENT ENGINEER
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR, DRY ETCH PROCESS DEVELOPMENT
SUMMARY:
Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer is responsible for the developing and implementing new RIE, IBD, and Ashing processes for next generation magnetic recording heads, including implementing new process control schemes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; research, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:
  • Develops and implements new dry etch processes (RIE, IBE, and Ashing) for next generation magnetic recording heads
  • Implements new process control schemes or methodologies which ensure product manufacturability
  • Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
  • Adheres to appropriate timeline for introducing new processes into the manufacturing line
  • Reviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action
  • Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
  • Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
  • Partners with Equipment Engineering to research, select, and qualify new RIE tools
  • Adheres to all safety policies and procedures as required
  • Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:
  • Bachelor's degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master's degree preferred
  • One to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in dry etch process development
  • Experience working in a wafer fab manufacturing environment
  • Experience with Statistical Process Control (SPC)
  • Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:
  • Knowledge of semiconductor or HDD industry principles, practices, and techniques
  • Knowledge of wafer fabrication processing techniques, including process development and integration practices
  • Knowledge of Reactive Ion Etching (RIE), IBE, and Ashing principles, practices, and techniques
  • Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure
  • Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
  • Knowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate action
  • Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
  • Able to work productively and collaboratively with all levels of employees and management
  • Able to comply with all safety policies and procedures
  • Demonstrated organizational and time management skills
  • Demonstrated problem-solving and trouble shooting skills
  • Flexible and able to prioritize

The annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:
The Dry Etch Process Development Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.

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