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Entry Level Process Td Engineer Intel Jobs (NOW HIRING)

Intel

Thin Films Module Development Engineer

Hillsboro, OR · On-site

$133K - $188K/yr

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development ...

New

INTEL

Thin Films Module Development Engineer

Portland, OR · On-site

$127K - $179K/yr

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development ...

New

INTEL

Thin Films Module Development Engineer

Vernonia, OR · On-site

$127K - $179K/yr

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development ...

New

Central Plains Cement

Process Engineer

Tulsa, OK · On-site

Entry Level Process Engineer $75K - $85K (Depending on Experience) Nature and Scope The Process Engineer is responsible for scheduling, supervising, and participating in process flow studies for all ...

Intel

Process Integration and Yield Engineer

Phoenix, AZ

$147K - $188K/yr

Join Intel as a Process Integration and Yield Engineer, where you will play a pivotal role in driving yield improvements, quality standards, and manufacturing excellence across Intel's cutting-edge ...

Central Plains Cement

Process Engineer

Tulsa, OK · On-site

Entry Level Process Engineer $75K - $85K (Depending on Experience) Nature and Scope The Process Engineer is responsible for scheduling, supervising, and participating in process flow studies for all ...

INTEL

Process Integration and Yield Engineer

Phoenix, AZ · On-site

$147K - $188K/yr

Join Intel as a Process Integration and Yield Engineer, where you will play a pivotal role in driving yield improvements, quality standards, and manufacturing excellence across Intel's cutting-edge ...

INTEL

Seniconductor Process Engineer

Phoenix, AZ · On-site

Intel is in the midst of an exciting transformation, with a vision to create and extend computing ... Trains production/receiving process engineers for transfer to other factories. * Transfers process ...

INTEL

Process Integration Engineer

Phoenix, AZ · On-site

Intel is in the midst of an exciting transformation, with a vision to create and extend computing ... Trains production/receiving process engineers for transfer to other factories. * Transfers process ...

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How much do entry level process td engineer intel jobs pay per year?

As of Aug 23, 2026, the average yearly pay for entry level process td engineer intel in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is the difference between Entry Level Process Td Engineer Intel vs Entry Level Manufacturing Engineer?

AspectEntry Level Process Td Engineer IntelEntry Level Manufacturing Engineer
Required CredentialsBachelor's in Engineering, Electrical, or related field; internship experienceBachelor's in Mechanical, Industrial, or related engineering; internship experience
Work EnvironmentSemiconductor fabrication facilities, R&D labsManufacturing plants, production lines
Industry UsageSemiconductor industry, tech companiesAutomotive, consumer electronics, industrial manufacturing
Common Search IntentUnderstanding roles in semiconductor process developmentUnderstanding manufacturing process roles

Entry Level Process Td Engineer Intel primarily focuses on developing and optimizing semiconductor manufacturing processes within Intel's fabrication facilities. In contrast, Entry Level Manufacturing Engineers work across various industries to improve production efficiency and quality in manufacturing plants. While both roles require engineering degrees and internship experience, their work environments and industry applications differ significantly.

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Thin Films Module Development Engineer

Intel

Hillsboro, OR • On-site

$133K - $188K/yr

Full-time

Medical, Retirement, PTO

Posted 2 days ago

New

Intel rating

8.7

Company rating: 8.7 out of 10

Based on 147 frontline employees who took The Breakroom Quiz

19th of 159 rated electronics manufacturers

Job description

Job Details:Job Description: 

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.
Core Responsibilities:

  • Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms
  • Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control
  • Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement
  • Apply expert knowledge of equipment operating principles, materials characterization and metrology, and device characteristics to accelerate technology development learning cycles
  • Support novel material and process screening and evaluation, equipment selection, on-time install/qualification of first-of-kind equipment, and design for manufacturability
  • Partner with cross-functional teams including process integration, device engineering, metrology, yield, manufacturing, and equipment suppliers
  • Contribute to process pathfinding efforts for next-generation semiconductor technologies through evaluation of novel materials, hardware assessment, process screening, integration development, and silicon validation
Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

  • PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field

With at least 1+ years of experience in:

  • Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies
  • Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design

Preferred Qualifications:

  • Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/plating
  • Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniques
  • Experience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentals
  • Proficient with data analysis software including JMP, Excel, Python, R, SQL
  • Strong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environment
  • Experience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgement
  • Strong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholders
  • Availability to work on site and support 24/7 manufacturing operations with on-call rotation

For information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information

Job Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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