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Dry Etch Process Engineer Jobs in California (NOW HIRING)

Amat

Etch Process Engineer E3S

Santa Clara, CA · On-site

$124K - $171K/yr

Perform etch chamber hardware and process characterization under the guidance of senior engineers, including evaluation of hardware components such as ESCs, rings, liners, gas delivery systems, and ...

Applied Materials

Etch Process Engineer E3S

Santa Clara, CA · On-site

$124K - $171K/yr

Perform etch chamber hardware and process characterization under the guidance of senior engineers, including evaluation of hardware components such as ESCs, rings, liners, gas delivery systems, and ...

Semtech

Process Development Engineer

Alhambra, CA · On-site

$73K - $110K/yr

The Process Development Engineer - InP Wafer Fab position is responsible for development ... Develop and optimize dry etch (ICP-RIE/RIE) and wet etch processes for InP and related material ...

Semtech

Process Development Engineer

Alhambra, CA

$73K - $110K/yr

This role provides technical ownership of PECVD deposition processes and dry/wet etch technologies ... Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering ...

W3Global Inc.

Founding Process Engineer

Goleta, CA · On-site

$110K - $150K/yr

Develop and tune dry and wet etch processes for III-V optical material stacks. * Establish process ... D. in Electrical Engineering, Materials Science, Physics, or equivalent hands-on experience.

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Dry Etch Process Engineer information

See California salary details

$48.9K

$90.8K

$140.6K

How much do dry etch process engineer jobs pay per year?

As of Sep 14, 2026, the average yearly pay for dry etch process engineer in California is $90,813.00, according to ZipRecruiter salary data. Most workers in this role earn between $73,500.00 and $101,700.00 per year, depending on experience, location, and employer.

What is a dry etch process engineer?

A Dry Etch Process Engineer develops and optimizes plasma etching processes used in semiconductor manufacturing to create precise microchip features. They work with tools such as reactive ion etchers (RIE) and inductively coupled plasma (ICP) systems to ensure high-quality pattern transfer. Responsibilities include process monitoring, troubleshooting equipment issues, and collaborating with cross-functional teams to improve yield and efficiency. This role requires expertise in semiconductor physics, plasma chemistry, and data analysis.

What are the key skills and qualifications needed to thrive as a dry etch process engineer?

To thrive as a Dry Etch Process Engineer, you need a solid background in semiconductor processing, materials science, and statistical process control, often supported by a degree in engineering or a related field. Familiarity with plasma etching tools, process characterization software, and cleanroom operations is typically required. Strong problem-solving skills, effective communication, and the ability to work collaboratively within cross-functional teams are valuable soft skills. These competencies ensure precise process optimization, effective troubleshooting, and continuous improvement in a fast-evolving manufacturing environment.

What are some common challenges faced by dry etch process engineers and how are they addressed on the job?

Dry Etch Process Engineers often encounter challenges such as maintaining tight process tolerances, minimizing defects, and troubleshooting complex equipment issues. These challenges are met through continuous monitoring of process parameters, root-cause analysis, and collaboration with equipment maintenance, integration, and R&D teams. Engineers frequently use statistical analysis and process characterization techniques to identify trends and implement corrective actions. This collaborative and data-driven approach helps ensure consistent product quality and efficient manufacturing operations.

Dry Etch Process Engineer jobs near you
Infographic showing various Dry Etch Process Engineer job openings in California as of August 2026, with employment types broken down into 7% Internship, 86% Full Time, and 7% Contract. Highlights an 93% In-person, and 7% Remote job distribution, with an average salary of $90,813 per year, or $43.7 per hour.

Dry Etch Process Development Engineer (42024)

Milpitas, CA • On-site

TDK Headway Technologies Inc.
Manufacturing • 501 - 1,000 employees
Learn more about TDK Headway Technologies Inc.external

$120K - $177K/yr

Other

Re-posted 8 days ago

Job description

TITLE: DRY ETCH PROCESS DEVELOPMENT ENGINEER
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR, DRY ETCH PROCESS DEVELOPMENT
SUMMARY:
Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer is responsible for the developing and implementing new RIE, IBD, and Ashing processes for next generation magnetic recording heads, including implementing new process control schemes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; research, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:
  • Develops and implements new dry etch processes (RIE, IBE, and Ashing) for next generation magnetic recording heads
  • Implements new process control schemes or methodologies which ensure product manufacturability
  • Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
  • Adheres to appropriate timeline for introducing new processes into the manufacturing line
  • Reviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action
  • Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
  • Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
  • Partners with Equipment Engineering to research, select, and qualify new RIE tools
  • Adheres to all safety policies and procedures as required
  • Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:
  • Bachelor's degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master's degree preferred
  • One to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in dry etch process development
  • Experience working in a wafer fab manufacturing environment
  • Experience with Statistical Process Control (SPC)
  • Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:
  • Knowledge of semiconductor or HDD industry principles, practices, and techniques
  • Knowledge of wafer fabrication processing techniques, including process development and integration practices
  • Knowledge of Reactive Ion Etching (RIE), IBE, and Ashing principles, practices, and techniques
  • Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure
  • Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
  • Knowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate action
  • Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
  • Able to work productively and collaboratively with all levels of employees and management
  • Able to comply with all safety policies and procedures
  • Demonstrated organizational and time management skills
  • Demonstrated problem-solving and trouble shooting skills
  • Flexible and able to prioritize

The annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:
The Dry Etch Process Development Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.

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