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How much do dry etch development engineer jobs pay per year?

As of Sep 14, 2026, the average yearly pay for dry etch development engineer in the United States is $96,155.00, according to ZipRecruiter salary data. Most workers in this role earn between $79,500.00 and $106,500.00 per year, depending on experience, location, and employer.

What is a dry etch development engineer?

A Dry Etch Development Engineer is a professional who specializes in developing and optimizing dry etching processes used in semiconductor manufacturing. They work with plasma and other advanced techniques to precisely remove materials from silicon wafers during the fabrication of integrated circuits. Their responsibilities include process design, equipment calibration, troubleshooting, and collaborating with other engineers to improve production yields and device performance. This role is critical in ensuring the accuracy and efficiency of microchip production.

What are the key skills and qualifications needed to thrive as a dry etch development engineer?

A Dry Etch Development Engineer needs a solid background in semiconductor physics, materials science, and process engineering, often with a degree in electrical engineering, materials science, or a related field. Familiarity with plasma etching tools, process simulation software, SPC (Statistical Process Control), and cleanroom protocols is typically required. Strong analytical thinking, problem-solving, and effective teamwork are crucial soft skills for optimizing processes and collaborating with cross-functional teams. These skills and qualifications are vital to ensure innovative, reliable process development and yield improvement in advanced semiconductor manufacturing.

What are some common challenges faced by dry etch development engineers when scaling processes from R&D to high-volume manufacturing?

Dry Etch Development Engineers often encounter challenges in maintaining process stability and repeatability when transitioning from research and development to high-volume manufacturing. Variability in tool performance, differences in wafer materials, and integration with upstream and downstream processes can impact final device yields. Effective collaboration with manufacturing, integration, and equipment engineering teams is essential to troubleshoot issues and optimize recipes for mass production, ensuring that the developed processes meet both technical and throughput requirements.

What is the difference between Dry Etch Development Engineer vs Process Engineer?

AspectDry Etch Development EngineerProcess Engineer
CredentialsBachelor's or Master's in Electrical, Chemical, or Materials EngineeringBachelor's or Master's in Chemical, Mechanical, or Industrial Engineering
Work EnvironmentCleanroom, R&D labs, semiconductor fabrication facilitiesManufacturing plants, R&D labs, semiconductor fabs
Industry UsageFocused on developing and optimizing etching processes for semiconductorsOversees overall manufacturing processes, including etching, deposition, and cleaning

Dry Etch Development Engineers specialize in creating and refining etching processes for semiconductor fabrication, focusing on plasma and reactive ion etching techniques. Process Engineers have a broader role, managing entire manufacturing workflows, including etching, to ensure product quality and efficiency. Both roles require similar technical backgrounds and often work in the same industry environments, but their focus areas differ.

What states have the most Dry Etch Development Engineer jobs?

States with the most job openings for Dry Etch Development Engineer jobs include:

What are popular job titles related to Dry Etch Development Engineer jobs?

For Dry Etch Development Engineer jobs, the most frequently searched job titles are:

Infographic showing various Dry Etch Development Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 83% Full Time, 14% Part Time, and 2% Contract. Highlights an 90% Physical, 3% Hybrid, and 7% Remote job distribution, with an average salary of $96,155 per year, or $46.2 per hour.

DRY ETCH PROCESS DEVELOPMENT ENGINEER (WRITER) (49917)

Milpitas, CA • On-site

TDK Headway Technologies Inc.
Manufacturing • 501 - 1,000 employees
Learn more about TDK Headway Technologies Inc.external

$96K - $142K/yr

Full-time

Re-posted 18 days ago

Job description

TITLE: DRY ETCH PROCESS DEVELOPMENT ENGINEER (WRITER)
FLSA STATUS: EXEMPT
REPORTS TO: SR. MANAGER, DRY ETCH PROCESS ENGINEERING
SUMMARY:
Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer (Writer) is responsible for the developing and implementing new RIE, IBD, and Ashing processes for next generation magnetic recording heads, including implementing new process control schemes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; research, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:
  • Develops and implements new dry etch processes (RIE, IBE, and Ashing) for next generation magnetic recording heads
  • Implements new process control schemes or methodologies which ensure product manufacturability
  • Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
  • Adheres to appropriate timeline for introducing new processes into the manufacturing line
  • Reviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action
  • Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
  • Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
  • Partners with Equipment Engineering to research, select, and qualify new RIE tools
  • Adheres to all safety policies and procedures as required
  • Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:
  • Bachelor's degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master's degree preferred
  • Three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process Engineer
  • Experience in plasma etch process development (RIE, IBE, Ashing, etc.) is preferred
  • Experience working in a wafer fab manufacturing environment
  • Experience with Statistical Process Control (SPC)
  • Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:
  • Knowledge of semiconductor or HDD industry principles, practices, and techniques
  • Knowledge of wafer fabrication processing techniques, including process development and integration practices
  • Knowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniques
  • Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure
  • Knowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate action
  • Knowledge and ability to use Microsoft Office applications to create reports and presentations
  • Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
  • Able to work productively and collaboratively with all levels of employees and management
  • Able to comply with all safety policies and procedures
  • Demonstrated organizational and time management skills
  • Demonstrated problem-solving and trouble shooting skills
  • Flexible and able to prioritize

The annual base salary for this full-time position is between $96,656.00-$142,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS:
The Dry Etch Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.
Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.

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