ZipRecruiter

Log In

1

Director System Engineering Jobs in California (NOW HIRING)

E-Space

5G Core System Engineering Lead

Saratoga, CA · On-site

We are looking for a 5G Core System Engineering Lead to own end-to-end system design and interface ... Familiarity with 3GPP SA2/CT4 specifications or direct standards contribution experience.

E-Space

5G Core System Engineering Lead

Saratoga, CA

$180K - $220K/yr

We are looking for a 5G Core System Engineering Lead to own end-to-end system design and interface ... Familiarity with 3GPP SA2/CT4 specifications or direct standards contribution experience.

General Atomics

System Engineer

San Diego, CA · On-site

Responsibilities may include direct program systems engineering support, proposal development, or support to internal development tasks. * Provide support to proof-of-concept programs and tailoring ...

previous pagenext page

Showing results 21-40

All JobsSystem Engineering JobsDirector System Engineering JobsDirector System Engineering Jobs in California

Director System Engineering information

What cities in California are hiring for Director System Engineering jobs?

Cities in California with the most Director System Engineering job openings:

Infographic showing various Director System Engineering job openings in California as of September 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution.

Director, System in Package Architecture

San Jose, CA • On-site

SK hynix America
Semiconductor and Electronic Component Manufacturing • 201 - 500 employees
Learn more about SK hynix Americaexternal

$240K - $300K/yr

Full-time

Medical, Retirement, PTO

Re-posted 5 days ago

Key responsibilities

  • Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a focus on High Bandwidth Memory (HBM).

  • Drive mechanical and electrical test vehicle design and development when necessary.

  • Spearhead research and development of novel technologies to enhance SiP performance and drive the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments.

Job description

About SK hynix America:
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Responsibilities:
  • Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM).
  • Drive mechanical and electrical test vehicle design and development when necessary.
  • Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments.
  • Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market.

Minimum Qualifications:
  • BS in Electrical Engineering or equivalent combination of education and progressive industry experience.
  • 7+ years of specialized experience in advanced packaging architecture definition, strategy, and development.
  • Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions.
  • Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred.
  • Exceptional verbal and written communication skills, with the ability to articulate technical strategies.

Preferred Qualifications:
  • Master's degree or PhD in Electrical Engineering, Materials Science, or related field.
  • 10+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies.
  • Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies.
  • Strong proficiency in Signal Integrity (SI) and Power Integrity (PI) analysis and optimization.
  • Direct experience in High Bandwidth Memory (HBM) architecture and integration is highly desirable.

Benefits:
  • Top Tier health insurance at no employee cost
  • Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
  • 401k Matching
  • Flexible Spending Account (FSA) for Health Care & Dependent Care
  • Educational reimbursement up to $10,000 per year
  • Donation Matching and volunteering opportunities
  • Corporate discount programs
  • Free Breakfast/Lunch/Dinner provided to employees

Compensation:
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
Pay Range
$240,000-$300,000 USD
Equal Employment Opportunity:
SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.
In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:
  • E-Verify Participation Poster (Bilingual English & Spanish)
  • IER Right to Work Poster (English)
  • IER Right to Work Poster (Spanish)
SK Hynix America logo

About SK Hynix America

Sourced by ZipRecruiter

Industry

Semiconductor and electronic component manufacturing

Company size

201 - 500 Employees

Headquarters location

San Jose, CA, US

Year founded

1983

View All SK Hynix America Jobs

Apply